以Ti/Al/Ni/Au作为欧姆接触金属体系,通过电感耦合等离子体(ICP)刻蚀的预处理,在氢化物气相外延法生长的单晶氮化镓(GaN)材料的N面实现了良好的欧姆接触,其比接触电阻率为3.7×10-4Ω·cm^2。通过扫描电子显微镜、原子力显微镜...以Ti/Al/Ni/Au作为欧姆接触金属体系,通过电感耦合等离子体(ICP)刻蚀的预处理,在氢化物气相外延法生长的单晶氮化镓(GaN)材料的N面实现了良好的欧姆接触,其比接触电阻率为3.7×10-4Ω·cm^2。通过扫描电子显微镜、原子力显微镜、阴极荧光和光致发光谱对GaN N面的表面、光学特性进行了对比表征。结果表明:未刻蚀GaN衬底的N面表面存在一定的损伤层,导致近表面处含有大量缺陷,不利于欧姆接触的形成;而ICP刻蚀处理有效地去除了损伤层。X射线光电子能谱(XPS)分析显示刻蚀后样品的Ga 3d结合能比未刻蚀样品向高能方向移动了约0.3 e V,其肖特基势垒则相应降低,有利于欧姆接触的形成。同时对Fe掺杂半绝缘GaN的N面也进行了刻蚀处理,同样实现了良好的Ti/Al/Ni/Au欧姆接触,其比接触电阻率为0.12Ω·cm^2。展开更多
The forward current transport mechanism and Schottky barrier characteristics of a Ni/Au contact on n-GaN are studied by using temperature-dependent current-voltage(T–I–V)and capacitance-voltage(C–V)measurements.The...The forward current transport mechanism and Schottky barrier characteristics of a Ni/Au contact on n-GaN are studied by using temperature-dependent current-voltage(T–I–V)and capacitance-voltage(C–V)measurements.The low-forward-bias I–V curve of the Schottky junction is found to be dominated by trap-assisted tunneling below 400 K,and thus can not be used to deduce the Schottky barrier height(SBH)based on the thermionic emission(TE)model.On the other hand,TE transport mechanism dominates the high-forward-bias region and a modified I–V method is adopted to deduce the effective barrier height.It is found that the estimated SBH(~0.95 eV at 300 K)by the I–V method is~0.20 eV lower than that obtained by the C–V method,which is explained by a barrier inhomogeneity model over the Schottky contact area.展开更多
Ohmic contacts of Ti/Al/Ni/Au multi-layer metal on A10.27 Ga0.73N/GaN heterostructures were fabricated. Specific contact resistivities were measured by the linear transmission line method （LTLM） and the circular tra...Ohmic contacts of Ti/Al/Ni/Au multi-layer metal on A10.27 Ga0.73N/GaN heterostructures were fabricated. Specific contact resistivities were measured by the linear transmission line method （LTLM） and the circular transmission line method （CTLM） ,respectively. A minimum specific contact resistivity of 1.46× 10 ^-5Ω· cm^2z was obtained by evaporating a Ti（10nm）/Al（100nm）/Ni（40nm）/Au（100nm） multi-layer and annealing for 30s at 650℃ in ultra-high purity N2 ambient. A10.27 Ga0.73 N/GaN photoconductor ultraviolet （UV） photodetectors were prepared. The dark current-voltage （I-V） characteristics of the detectors were measured and the result shows that the I- V curve was linear. Experimental results indicate that good ohmic contact on the Al0.27 Ga0.73 N/GaN heterostructure is obtained and it can be applied in high- performance AlGaN/GaN UV photodetector fabrications.展开更多
基金The National Natural Science Foundation of China(No.11404291)the Aeronautical Science Foundation(Nos.2014ZF55013,2015ZF55013)+1 种基金the Outstanding Person Foundation of Henan Province(No.164200510006)the Key Research Project of the Education Department Henan Province(No.15A140042)
文摘以Ti/Al/Ni/Au作为欧姆接触金属体系,通过电感耦合等离子体(ICP)刻蚀的预处理,在氢化物气相外延法生长的单晶氮化镓(GaN)材料的N面实现了良好的欧姆接触,其比接触电阻率为3.7×10-4Ω·cm^2。通过扫描电子显微镜、原子力显微镜、阴极荧光和光致发光谱对GaN N面的表面、光学特性进行了对比表征。结果表明:未刻蚀GaN衬底的N面表面存在一定的损伤层,导致近表面处含有大量缺陷,不利于欧姆接触的形成;而ICP刻蚀处理有效地去除了损伤层。X射线光电子能谱(XPS)分析显示刻蚀后样品的Ga 3d结合能比未刻蚀样品向高能方向移动了约0.3 e V,其肖特基势垒则相应降低,有利于欧姆接触的形成。同时对Fe掺杂半绝缘GaN的N面也进行了刻蚀处理,同样实现了良好的Ti/Al/Ni/Au欧姆接触,其比接触电阻率为0.12Ω·cm^2。
基金Supported by the National Basic Research Program of China under Grant No 2010CB327504the National Natural Science Foundation of China under Grant Nos 60936004 and 11074280+1 种基金the Fundamental Research Funds for the Central Universities of China under Grant Nos JUSRP111A42,JUSRP211A37 and JUSRP20914the State Key Laboratory of ASIC&System under Grant No 11KF003.
文摘The forward current transport mechanism and Schottky barrier characteristics of a Ni/Au contact on n-GaN are studied by using temperature-dependent current-voltage(T–I–V)and capacitance-voltage(C–V)measurements.The low-forward-bias I–V curve of the Schottky junction is found to be dominated by trap-assisted tunneling below 400 K,and thus can not be used to deduce the Schottky barrier height(SBH)based on the thermionic emission(TE)model.On the other hand,TE transport mechanism dominates the high-forward-bias region and a modified I–V method is adopted to deduce the effective barrier height.It is found that the estimated SBH(~0.95 eV at 300 K)by the I–V method is~0.20 eV lower than that obtained by the C–V method,which is explained by a barrier inhomogeneity model over the Schottky contact area.
基金the Pre-Research Foundation from the National Ministries and Commissions(Nos.51323040118,513080302)~~
文摘Ohmic contacts of Ti/Al/Ni/Au multi-layer metal on A10.27 Ga0.73N/GaN heterostructures were fabricated. Specific contact resistivities were measured by the linear transmission line method （LTLM） and the circular transmission line method （CTLM） ,respectively. A minimum specific contact resistivity of 1.46× 10 ^-5Ω· cm^2z was obtained by evaporating a Ti（10nm）/Al（100nm）/Ni（40nm）/Au（100nm） multi-layer and annealing for 30s at 650℃ in ultra-high purity N2 ambient. A10.27 Ga0.73 N/GaN photoconductor ultraviolet （UV） photodetectors were prepared. The dark current-voltage （I-V） characteristics of the detectors were measured and the result shows that the I- V curve was linear. Experimental results indicate that good ohmic contact on the Al0.27 Ga0.73 N/GaN heterostructure is obtained and it can be applied in high- performance AlGaN/GaN UV photodetector fabrications.
