Intermetallic compounds(IMC) formed at Sn-Ag-Cu solder droplet/pad interface during wetting reaction were investigated. Comparative studies of the IMC evolution during reflow and aging were also conducted. The results...Intermetallic compounds(IMC) formed at Sn-Ag-Cu solder droplet/pad interface during wetting reaction were investigated. Comparative studies of the IMC evolution during reflow and aging were also conducted. The results show that the wetting reaction between molten solder droplet and pad leads to the formation of Au-Sn compound at interface, but Au element is not fully consumed during wetting reaction. After reflow, all Au layer disappears from the interface, Au element is dissolved into solder and Au-Sn intermetallic compounds are precipitated in the bulk. Reaction between Ni layer and Sn-Ag-Cu solder leads to the formation of (CuxNi1-x)6Sn5 layer at interface during reflow. According to the thermodynamic-kinetic of interfacial reaction, the wetting reaction at solder droplet/pad interface influences the phase selectivity of IMC evolution during reflow and aging process.展开更多
The compact oxide on the surface of SiCp/Al metal matrix composite （SiCp/Al MMC） greatly depends on the property of the joint. Inlaid sputtering target was applied to etch the oxide completely on the bonding surface...The compact oxide on the surface of SiCp/Al metal matrix composite （SiCp/Al MMC） greatly depends on the property of the joint. Inlaid sputtering target was applied to etch the oxide completely on the bonding surface of SiCp/Al MMC by plasma erosion. Cu/Ni/Cu film of 5μm in thickness was prepared by magnetron sputtering method on the clean bonding surface in the same vacuum chamber, which was acted as an interlayer in transient liquid phase （TLP） bonding process. Compared with the same thickness of single Cu foil and Ni foil interlayer, the shear strength of 200 MPa was obtained using Cu/Ni/Cu film interlayer during TLP bonding, which was 89.7% that of base metal. In addition, homogenization of the bonding region and no particle segregation in interfacial region were found by analysis of the joint microstructure. Scanning electron microscopy （SEM） was used to observe the micrograph of the joint interface. The result shows that a homogenous microstructure of joint was achieved, which is similar with that of based metal.展开更多
Ti-6Al-4V and QAl 10-3-1.5 diffusion bonding has been carried out with Ni/Cu interlayers. The diffusionbonded joints are evaluated by scanning electron microscopy （SEM）, energy dispersive spectroscopy （EDS） and mi...Ti-6Al-4V and QAl 10-3-1.5 diffusion bonding has been carried out with Ni/Cu interlayers. The diffusionbonded joints are evaluated by scanning electron microscopy （SEM）, energy dispersive spectroscopy （EDS） and microhardness test. Intermetallic compounds at the interface zone are detected by X-ray diffraction （XRD）. Interracial microstructure of TiNi＋CuTi3＋α-Ti forms at the Ni/Ti-6Al-4V transition zone and Cu （ss. Ni） solid solution forms between Ni/Cu interlayers. The thickness of reaction layer （TiNi） increases with bonding time by a parabolic law： y^2=Koexp（-150000/RT）t, and K0=2.g×10^-7 m^2/s is figured out from the experiment data.展开更多
The magnetic properties of Ni/Cu multilayers, prepared by the electron beam evaporation method under ultra high vacuum conditions, have been systematically studied by magnetic measurements. The temperature dependence ...The magnetic properties of Ni/Cu multilayers, prepared by the electron beam evaporation method under ultra high vacuum conditions, have been systematically studied by magnetic measurements. The temperature dependence of the spontaneous magnetization M (T) is well described by a T3/2 law. A spin wave theory has been used to explain the magnetization versus temperature. Based on this theory, the approximate values for the exchange interactions have been obtained.展开更多
文摘Intermetallic compounds(IMC) formed at Sn-Ag-Cu solder droplet/pad interface during wetting reaction were investigated. Comparative studies of the IMC evolution during reflow and aging were also conducted. The results show that the wetting reaction between molten solder droplet and pad leads to the formation of Au-Sn compound at interface, but Au element is not fully consumed during wetting reaction. After reflow, all Au layer disappears from the interface, Au element is dissolved into solder and Au-Sn intermetallic compounds are precipitated in the bulk. Reaction between Ni layer and Sn-Ag-Cu solder leads to the formation of (CuxNi1-x)6Sn5 layer at interface during reflow. According to the thermodynamic-kinetic of interfacial reaction, the wetting reaction at solder droplet/pad interface influences the phase selectivity of IMC evolution during reflow and aging process.
基金The work was financially supported by the National Natural Science Foundation of China under grant Nos. 50275076 and 50075039.
文摘The compact oxide on the surface of SiCp/Al metal matrix composite （SiCp/Al MMC） greatly depends on the property of the joint. Inlaid sputtering target was applied to etch the oxide completely on the bonding surface of SiCp/Al MMC by plasma erosion. Cu/Ni/Cu film of 5μm in thickness was prepared by magnetron sputtering method on the clean bonding surface in the same vacuum chamber, which was acted as an interlayer in transient liquid phase （TLP） bonding process. Compared with the same thickness of single Cu foil and Ni foil interlayer, the shear strength of 200 MPa was obtained using Cu/Ni/Cu film interlayer during TLP bonding, which was 89.7% that of base metal. In addition, homogenization of the bonding region and no particle segregation in interfacial region were found by analysis of the joint microstructure. Scanning electron microscopy （SEM） was used to observe the micrograph of the joint interface. The result shows that a homogenous microstructure of joint was achieved, which is similar with that of based metal.
基金The financial supports from the National Natural Science Foundation of China(NSFC)under Grant No.50375065the National Key Laboratory of Advanced Welding Production Technology are acknowledged.
文摘Ti-6Al-4V and QAl 10-3-1.5 diffusion bonding has been carried out with Ni/Cu interlayers. The diffusionbonded joints are evaluated by scanning electron microscopy （SEM）, energy dispersive spectroscopy （EDS） and microhardness test. Intermetallic compounds at the interface zone are detected by X-ray diffraction （XRD）. Interracial microstructure of TiNi＋CuTi3＋α-Ti forms at the Ni/Ti-6Al-4V transition zone and Cu （ss. Ni） solid solution forms between Ni/Cu interlayers. The thickness of reaction layer （TiNi） increases with bonding time by a parabolic law： y^2=Koexp（-150000/RT）t, and K0=2.g×10^-7 m^2/s is figured out from the experiment data.
文摘The magnetic properties of Ni/Cu multilayers, prepared by the electron beam evaporation method under ultra high vacuum conditions, have been systematically studied by magnetic measurements. The temperature dependence of the spontaneous magnetization M (T) is well described by a T3/2 law. A spin wave theory has been used to explain the magnetization versus temperature. Based on this theory, the approximate values for the exchange interactions have been obtained.
