Interface healing mechanism of fine-grained Ni-Co-based superalloy during hot-compression bonding

The interface healing mechanism of fine-grained Ni-Co-based superalloy during hot-compression bonding(HCB)is investigated.During HCB,the incompatibility of deformation between theγand the primary γ′leads to a large number of dislocation pairs(DP),stacking faults(SF),and micro-twins(MT)in the primary γ′.These defects act as fast channels for elemental diffusion,leading to supersaturation of the primary γ′and promoting the growth of the γ-shell.On the one hand,the primary γ′with a γ-shell moves towards the bonding interface due to anomalous yielding phenomena of the primary γ′and plastic flow during HCB process.The increase in the number of defects leads to the growth of γ-γ′heterogeneous epitaxial recrystallization(HERX)grain with coherent structure at the bonding interface,which promotes the bulge of the interface grain boundaries(IGBs).On the other hand,the nucleation and growth of a necklace-like distribution of discontinuous dynamic recrystallization(DDRX)grain at the interface lead to the healing of IGBs.With the synergistic action of DDRX and HERX,the mechanical properties of Ni-Co-based superalloy joints through HCB achieve the same level as the base material.This finding further enriches the theory of interface healing in HCB.

Hot Compression Behavior and Tensile Property of a Novel Ni-Co-Based Superalloy Prepared by Electron Beam Smelting Layered Solidification Technology

The hot compression behavior and tensile strength after compression of a new Ni-Co-based superalloy produced using electron beam smelting layered(EBSL)solidification technology were investigated.Isothermal compression tests were performed at temperatures of 1120℃and 1150℃,with strain rates of 1 s^(-1) and 0.01 s^(-1),reaching a true strain of 0.51.Tensile strength was evaluated at room temperature.The results revealed that this EBSL technology accelerates dynamic recrystallization(DRX),without compromising the strength of alloy.A significant correlation between the volume fraction of DRX and the strain rate was observed,with higher fractions at lower strain rates,leading to higher tensile strength.Additionally,at the same strain rate,the specimens compressed at 1120℃exhibited higher tensile strength due to undissolvedγ′precipitates.After solution and aging heat treatment,the alloy maintained high tensile strength.The results suggested that the EBSL Ni-Co-based superalloy offers excellent prospects for practical applications.

Recrystallization Behavior of the New Ni-Co-Based Superalloy with Fusion Structure Produced by Electron Beam Smelting Layered Solidification Technology

The new Ni-Co-based superalloy featuring a"fusion structure"was produced utilizing electron beam smelting layered solidification technology(EBSL).Experimental examination of hot compression deformation with varied settings for EBSL and conventional duplex process melting Ni-Co superalloys was performed.As per the study,EBSL-Ni-Co superalloys exhibited enhanced recrystallization susceptibility during hot deformation.Furthermore,elevating deformation temperature,lowering strain rate,and augmenting strain collectively contribute to enlarging the volume fraction of dynamically recrystallized grains.Aberrant growth of grains occurred when the deformation temperature equaledγ′sub-solvus temperature and the strain rate was slower.Moreover,exceeding theγ′solvus temperature during deformation significantly increases the particle size of dynamic recrystallization(DRX)grains.Theγ′phase can effectively modulate the DRX grain size through the pegging effect.Additionally,it was revealed that the presence of the fusion structure aids in the generation of continuous dynamic recrystallization,discontinuous dynamic recrystallization,and twinning-induced dynamic recrystallization while the alloy undergoes hot deformation.This mechanism promotes DRX granule formation and permits complete recrystallization.Ultimately,the fusion structure was identified as playing a catalytic role in the dynamic recrystallization process of the new Ni-Co superalloy.

Deformation micro-twinning arising at high temperatures in a Ni-Co-based superalloy

Deformation twinning is an important deformation mechanism in nickel-based superalloys. For superalloys, deformation twins are generally observed at low or intermediate temperatures and high strain rates;however, the appearance of microtwins(MTs) at high temperatures has rarely been reported. In this study, transmission electron microscopy(TEM) was used to study MT formation in Ni-Co-based superalloys following compression at 1120 °C/1 s. The deformation behavior was discussed in detail to reveal the mechanism of MT formation. The twinning mechanism at elevated temperatures was theoretically attributed to the low stacking fault energy(SFE) and poor dislocation-driven deformations caused by the high strain rate in specific directions.

Revealing the Void Formation Mechanism during Superplastic Deformation of a Fine-Grained Ni-Co-Base Superalloy

The mechanism behind void formation during superplasticity remains a subject of uncertainty.This study presented a novel insight into the void formation in a fine-grained Ni-Co-based superalloy during superplasticity.It was observed that the dissolution ofγ′-particles resulted in the creation of vacancies due to differences in atomic size between the matrix and the particles.These vacancies acted as inclusions,leading to the formation of micro-voids.Notably,excessive void formation correlated with higher particle dissolution was experimentally observed,highlighting a direct relationship between void formation and particle dissolution.