After Sn/Pd activating, the SiCp/Al composite with 65% SiC (volume fraction) was coated by electroless Ni?P alloy plating. Surface morphology of the composite and its effect on the Ni?P alloy depositing process and bo...After Sn/Pd activating, the SiCp/Al composite with 65% SiC (volume fraction) was coated by electroless Ni?P alloy plating. Surface morphology of the composite and its effect on the Ni?P alloy depositing process and bonding action of Ni and P atoms in the Ni?P alloy were studied. The results show that inhomogeneous distribution of the Sn/Pd activating points results in preferential deposition of the Ni?P alloy particles on the Al alloy and rough SiC particle surfaces and in the etched caves. The Ni?P alloy film has an amorphous structure where chemical bonding between Ni and P atoms exists. After a continuous Ni?P alloy film formed, electroless Ni?P alloy plating is not affected by surface morphology and characteristics of the SiCp/Al composite any longer, but by the electroless plating process itself. The Ni?P alloy film follows linear growth kinetics with an activation energy of 68.44 kJ/mol.展开更多
Effects of process on the deposition rate,corrosion resistance and corrosion potential of Ni-P-nano-TiO2(rutile) electroless composite plating,were studied by using weightless corrosion methods,magnetic thickness gaug...Effects of process on the deposition rate,corrosion resistance and corrosion potential of Ni-P-nano-TiO2(rutile) electroless composite plating,were studied by using weightless corrosion methods,magnetic thickness gauge and electrochemical methods.The results indicated that the optimum formula and process,composed of NiSO4(10g/400mL),NaH2PO2(10g/400mL),NaAc(6g/400mL),H3BO3(6g/400mL),1h,pH=5.5,80℃,100r/min and nano-TiO2 particle(rutile)(4g/400mL),were obtained.Then,it was shown that corrosion resistance of electroless composite coatings Ni-P-nano-TiO2 (rutile) increased 3-4 times,compared with that of electroless coatings Ni-Pin alkaline and salt corrosion media.However,in acid media,corrosion resistance of Ni-P coating was better.展开更多
基金Project(2014DFA50860)supported by International Science&Technology Cooperation Program of China
文摘After Sn/Pd activating, the SiCp/Al composite with 65% SiC (volume fraction) was coated by electroless Ni?P alloy plating. Surface morphology of the composite and its effect on the Ni?P alloy depositing process and bonding action of Ni and P atoms in the Ni?P alloy were studied. The results show that inhomogeneous distribution of the Sn/Pd activating points results in preferential deposition of the Ni?P alloy particles on the Al alloy and rough SiC particle surfaces and in the etched caves. The Ni?P alloy film has an amorphous structure where chemical bonding between Ni and P atoms exists. After a continuous Ni?P alloy film formed, electroless Ni?P alloy plating is not affected by surface morphology and characteristics of the SiCp/Al composite any longer, but by the electroless plating process itself. The Ni?P alloy film follows linear growth kinetics with an activation energy of 68.44 kJ/mol.
文摘Effects of process on the deposition rate,corrosion resistance and corrosion potential of Ni-P-nano-TiO2(rutile) electroless composite plating,were studied by using weightless corrosion methods,magnetic thickness gauge and electrochemical methods.The results indicated that the optimum formula and process,composed of NiSO4(10g/400mL),NaH2PO2(10g/400mL),NaAc(6g/400mL),H3BO3(6g/400mL),1h,pH=5.5,80℃,100r/min and nano-TiO2 particle(rutile)(4g/400mL),were obtained.Then,it was shown that corrosion resistance of electroless composite coatings Ni-P-nano-TiO2 (rutile) increased 3-4 times,compared with that of electroless coatings Ni-Pin alkaline and salt corrosion media.However,in acid media,corrosion resistance of Ni-P coating was better.
