As a metal alloy,NiCr films have a relatively high resistivity and low temperature coefficient of resistance (TCR) and are widely used in electronic components and sensors.However,the resistivity of pure NiCr is insuf...As a metal alloy,NiCr films have a relatively high resistivity and low temperature coefficient of resistance (TCR) and are widely used in electronic components and sensors.However,the resistivity of pure NiCr is insufficient for high-resistance and highly stable film resistors.In this study,a quaternary NiCrAlSi target (47:33:10:10,wt.%) was successfully used to prepare resistor films with resistivities ranging from 1000 to 10 000μΩcm and TCR within±100 ppm/K.An oxygen flow was introduced during the sputtering process.The films exhibit hightemperature stability at 450℃.The films were analyzed using Auger electron spectroscopy,x-ray diffraction,time-of-flight secondary-ion mass spectrometry,and x-ray photoelectron spectroscopy.The results show that the difference in the oxide proportion of the films caused the differences in resistivity.The near-zero TCR values were considered to be due to the competition between silicon and other metals.This study provides new insights into the electrical properties of NiCr-based films containing Si,which will drive the manufacturing of resistors with high resistivity and zero TCR.展开更多
基金support from the Innovation Foundation of the Shanghai Institute of Technical Physics,Chinese Academy of Sciences。
文摘As a metal alloy,NiCr films have a relatively high resistivity and low temperature coefficient of resistance (TCR) and are widely used in electronic components and sensors.However,the resistivity of pure NiCr is insufficient for high-resistance and highly stable film resistors.In this study,a quaternary NiCrAlSi target (47:33:10:10,wt.%) was successfully used to prepare resistor films with resistivities ranging from 1000 to 10 000μΩcm and TCR within±100 ppm/K.An oxygen flow was introduced during the sputtering process.The films exhibit hightemperature stability at 450℃.The films were analyzed using Auger electron spectroscopy,x-ray diffraction,time-of-flight secondary-ion mass spectrometry,and x-ray photoelectron spectroscopy.The results show that the difference in the oxide proportion of the films caused the differences in resistivity.The near-zero TCR values were considered to be due to the competition between silicon and other metals.This study provides new insights into the electrical properties of NiCr-based films containing Si,which will drive the manufacturing of resistors with high resistivity and zero TCR.
