Improvement of Ga_(2)O_(3)vertical Schottky barrier diode by constructing NiO/Ga_(2)O_(3)heterojunction

The high critical electric field strength of Ga_(2)O_(3)enables higher operating voltages and reduced switching losses in power electronic devices.Suitable Schottky metals and epitaxial films are essential for further enhancing device performance.In this work,the fabrication of vertical Ga_(2)O_(3)barrier diodes with three different barrier metals was carried out on an n--Ga_(2)O_(3)homogeneous epitaxial film deposited on an n+-β-Ga_(2)O_(3)substrate by metal-organic chemical vapor deposition,excluding the use of edge terminals.The ideal factor,barrier height,specific on-resistance,and breakdown voltage characteristics of all devices were investigated at room temperature.In addition,the vertical Ga_(2)O_(3)barrier diodes achieve a higher breakdown volt-age and exhibit a reverse leakage as low as 4.82×10^(-8)A/cm^(2)by constructing a NiO/Ga_(2)O_(3)heterojunction.Therefore,Ga_(2)O_(3)power detailed investigations into Schottky barrier metal and NiO/Ga_(2)O_(3)heterojunction of Ga_(2)O_(3)homogeneous epitaxial films are of great research potential in high-efficiency,high-power,and high-reliability applications.

MoS_(2)/Si tunnel diodes based on comprehensive transfer technique

Due to the pristine interface of the 2D/3D face-tunneling heterostructure with an ultra-sharp doping profile, the 2D/3D tunneling field-effect transistor(TFET) is considered as one of the most promising low-power devices that can simultaneously obtain low off-state current(IOFF), high on-state current(ION) and steep subthreshold swing(SS). As a key element for the 2D/3D TFET, the intensive exploration of the tunnel diode based on the 2D/3D heterostructure is in urgent need.The transfer technique composed of the exfoliation and the release process is currently the most common approach to fabricating the 2D/3D heterostructures. However, the well-established transfer technique of the 2D materials is still unavailable.Only a small part of the irregular films can usually be obtained by mechanical exfoliation, while the choice of the chemical exfoliation may lead to the contamination of the 2D material films by the ions in the chemical etchants. Moreover, the deformation of the 2D material in the transfer process due to its soft nature also leads to the nonuniformity of the transferred film,which is one of the main reasons for the presence of the wrinkles and the stacks in the transferred film. Thus, the large-scale fabrication of the high-quality 2D/3D tunnel diodes is limited. In this article, a comprehensive transfer technique that can mend up the shortages mentioned above with the aid of the water and the thermal release tape(TRT) is proposed. Based on the method we proposed, the MoS_(2)/Si tunnel diode is experimentally demonstrated and the transferred monolayer MoS_(2) film with the relatively high crystal quality is confirmed by atomic force microscopy(AFM), scanning electron microscopy(SEM), and Raman characterizations. Besides, the prominent negative differential resistance(NDR) effect is observed at room temperature, which verifies the relatively high quality of the MoS_(2)/Si heterojunction. The bilayer MoS_(2)/Si tunnel diode is also experimentally fabricated by repeating the transfer process we proposed, followed by the specific analysis of the electrical characteristics. This study shows the advantages of the transfer technique we proposed and indicates the great application foreground of the fabricated 2D/3D heterostructure for ultralow-power tunneling devices.

NiO/β-Ga_(2)O_(3)heterojunction diodes with ultra-low leakage current below 10^(-10)A and high thermostability

The 10 nm p-NiO thin film is prepared by thermal oxidation of Ni onβ-Ga_(2)O_(3)to form NiO/β-Ga_(2)O_(3)p-n heterojunction diodes(HJDs).The NiO/β-Ga_(2)O_(3)HJDs exhibit excellent electrostatic properties,with a high breakdown voltage of 465 V,a specific on-resistance(Ron,sp)of 3.39 mΩ·cm^(2),and a turn-on voltage(V on)of 1.85 V,yielding a static Baliga's figure of merit(FOM)of 256 MW/cm^(2).Also,the HJDs have a low turn-on voltage,which reduces conduction loss dramatically,and a rectification ratio of up to 108.Meanwhile,the HJDs'reverse leakage current is essentially unaffected at temperatures below 170?C,and their leakage level may be controlled below 10^(-10)A.This indicates that p-NiO/β-Ga_(2)O_(3)HJDs with good thermal stability and high-temperature operating ability can be a good option for high-performanceβ-Ga_(2)O_(3)power devices.

A Novel Ideal Ohmic Contact SiGeC/Si Power Diode with Graded Doping Concentration

A novel structure of ideal ohmic contact p^＋ （SiGeC）-n^- -n^＋ diodes with three-step graded doping concentration in the base region is presented, and the changing doping concentration gradient is also optimized. Using MEDICI, the physical parameter models applicable for SiGeC/Si heterojunction power diodes are given. The simulation results indicate that the diodes with graded doping concentration in the base region not only have the merit of fast and soft reverse recovery but also double reverse blocking voltage,and their forward conducting voltage has dropped to some extent,compared to the diodes with constant doping concentration in the base region. The new structure achieves a good trade-off in Qs-Vf-Ir ,and its combination of properties is superior to ideal ohmic contact diodes and conventional diodes.

New Rare-Earth Containing (Sr_(1-y)Eu_y)_2Al_2Si_(10)N_(14)O_4 Phosphors for Light-Emitting Diodes

Remarkable progress was made in the development of white-light-emitting diodes （LEDs）. White LEDs provided a light element having a semiconductor InGaN light-emitting chip （blue or UV LEDs） and luminescent phosphors. Here we reported the sialon s-phase of （Sr,Eu）2A12Si10N14O4. Eu^2＋ activator ions that were substituted for the strontium site represented a new type of yeUow-green phosphor that could be excited by blue LEDs used for application in the fabrication of white LEDs.

Monolithic semi-polar(1■01) InGaN/GaN near white light-emitting diodes on micro-striped Si(100) substrate

The epitaxial growth of novel GaN-based light-emitting diode(LED) on Si(100) substrate has proved challenging.Here in this work, we investigate a monolithic phosphor-free semi-polar InGaN/GaN near white light-emitting diode, which is formed on a micro-striped Si(100) substrate by metal organic chemical vapor deposition. By controlling the size of micro-stripe, InGaN/GaN multiple quantum wells(MQWs) with different well widths are grown on semi-polar(1■01)planes. Besides, indium-rich quantum dots are observed in InGaN wells by transmission electron microscopy, which is caused by indium phase separation. Due to the different widths of MQWs and indium phase separation, the indium content changes from the center to the side of the micro-stripe. Various indium content provides the wideband emission. This unique property allows the semipolar InGaN/GaN MQWs to emit wideband light, leading to the near white light emission.

Performance improvement of Ga N-based light-emitting diodes transferred from Si(111) substrate onto electroplating Cu submount with embedded wide p-electrodes

Crack-free Ga N/In Ga N multiple quantum wells（MQWs） light-emitting diodes（LEDs） are transferred from Si substrate onto electroplating Cu submount with embedded wide p-electrodes. The vertical-conducting n-side-up configuration of the LED is achieved by using the through-hole structure. The widened embedded p-electrode covers almost the whole transparent conductive layer（TCL）, which could not be applied in the conventional p-side-up LEDs due to the electrodeshading effect. Therefore, the widened p-electrode improves the current spreading property and the uniformity of luminescence. The working voltage and series resistance are thereby reduced. The light output of embedded wide p-electrode LEDs on Cu is enhanced by 147% at a driving current of 350 m A, in comparison to conventional LEDs on Si.

Comparative study of the electrical properties of Au/n-Si(MS) and Au/Si_3N_4 /n-Si(MIS) Schottky diodes

In this paper, the electrical parameters of Au/n-Si （MS） and Au/Si3N4/n-Si （MIS） Schottky diodes are obtained from the forward bias current-voltage （I-V） and capacitance-voltage （C-V） measurements at room temperature. Experimental results show that the rectifying ratios of the MS and MIS diodes at ± 5 V are found to be 1.25 ×103 and 1.27 ×104, respectively. The main electrical parameters of the MS and MIS diodes, such as the zero-bias barrier height （rbBo） and ideality factor （n）, are calculated to be 0.51 eV （I-V）, 0.53 eV （C-V）, and 4.43, and 0.65 eV （I-V）, 0.70 eV （C-V）, and 3.44, respectively. In addition, the energy density distribution profile of the interface states （Nss） is obtained from the forward bias I-V, and the series resistance （Rs） values for the two diodes are calculated from Cheung＇s method and Ohm＇s law.

White Organic Light-emitting Diodes with A Sr_2SiO_4:Eu^(3+) Color Conversion Layer

Abstract:Hybrid inorganic/organic white organic light emitting diodes(hybrid-WOLEDs)are fabricated by combi-ning the blue phosphorescent organic light emitting diodes(PHOLEDs)with red Sr2SiO4:Eu3+phosphor spin coatedas a color conversion layer(CCL)over the other side of glass substrate on the devices.The basic configuration of thePHOLEDs consists a host material,N,N'-dicarbazolyl-3,5-benzene(mCP)which doped with a blue phosphorescentiridium complexes iridium(Ⅲ)bis[(4,6-di-fluorophenyl)-pyridinato-N-C2'](FIrpic)to produce high efficient blueorganic light emitting diodes.The hybrid-WOLED shows maximum luminous efficiency of 22.1 cd/A,maximumpower efficiency of 11.26 lm/W,external quantum efficiency of 10.2%and CIE coordinates of(0.32,0.34).Mo-reover,the output spectra and CIE coordinates of the hybrid-WOLED have a small shift in different driving currentdensity,which demonstrate good color stability.

Total dose test with γ-ray for silicon single photon avalanche diodes

Gamma-ray(γ-ray)radiation for silicon single photon avalanche diodes(Si SPADs)is evaluated,with total dose of 100 krad(Si)and dose rate of 50 rad(Si)/s by using 60Co as theγ-ray radiation source.The breakdown voltage,photocurrent,and gain have no obvious change after the radiation.However,both the leakage current and dark count rate increase by about one order of magnitude above the values before the radiation.Temperature-dependent current-voltage measurement results indicate that the traps caused by radiation function as generation and recombination centers.Both leakage current and dark count rate can be almost recovered after annealing at 200℃for about 2 hours,which verifies the radiation damage mechanics.

A Fast-Speed Pulse Detector Based on N-Type Si-Schottky Diode via Tuning Circuit

A fast-speed pulse detector based on n-type Si-Sehottky diode mounted in the waveguide is investigated. The relation of the fast-speed pulse detector between response time and 3 dB bandwidth is analyzed. By adopting the tunable circuit, the matched bandwidth is achieved as wide as possible. Experi- mental results show that the pulse response time of the detector is less than 150 ps within random carrier signal 500 MHz bandwidth range between 35 GHz to 39 GHz via tuning circuit. The detector is very easy to operate because it does not need bias current or synch-pulse source.

Broadband chirped InAs quantum-dot superluminescent diodes with a small spectral dip of 0.2 dB

We report on the fabrication and characterization of InAs/GaAs chirped multilayer quantum-dot superluminescent diodes(CMQD-SLDs)with and without direct Si doping in QDs.It was found that both the output power and the spectral width of the CMQD-SLDs were significantly enhanced by direct Si doping in the QDs.The output power and spectral width have been increased by approximately 18.3%and 40%,respectively.Moreover,we shortened the cavity length of the doped CMQD-SLD and obtained a spectral width of 106 nm.In addition,the maximum output power and spectral width of the CMQD-SLD doped directly with Si can be further increased to 16.6 mW and 114 nm,respectively,through anti-reflection coating and device packaging.The device exhibited the smallest spectral dip of 0.2 dB when the spectrum was widest.The improved performances of the doped CMQD-SLD can be attributed to the direct doping of Si in the QDs,optimization of device structure and device packaging.

GaN与Si器件作为辐伏电池换能单元性能比较

利用63Ni和3H源等分别辐照两种可作为辐伏电池换能单元的GaN基和Si基PiN结型器件,比较了他们的输出电性能结果,以及两种器件的温度、辐照性能等。结果表明,GaN器件开路电压Voc比Si基器件有非常明显的提高,而短路电流Isc有较大下降;GaN基结型器件在高温和高能辐照条件下的性能比Si基结型器件有较大优势。

BESIII剂量率在线检测和保护系统读出电子学设计

为保护束流管,BESIII将使用PIN硅光电二极管来实时检测对撞点附近的剂量率水平,其中的信号读出电子学采用电流A/D转换方案。对几种弱电流放大与测量方法进行了比较,主要介绍了电流A/D方法的工作原理、软硬件实现以及实际性能。

磁控溅射NiO/ZnO透明异质结二极管及其光电特性研究

采用磁控溅射方法在ITO玻璃基板上沉积NiO,ZnO,AZO三层透明氧化物薄膜,成功制备了NiO/ZnO透明异质结二极管。实验结果表明,PN结展示出明显的I-V整流特性,正向开启电压1V;在氙灯光照条件下,二极管反向电流在5V偏置时,达到1.5mA。二极管在可见光的平均透过率约为25%。

原位合成NiO催化硅粉氮化制备氮化硅

采用化学沉淀方法在硅粉表面沉淀了Ni（OH）2,利用其原位合成NiO来催化硅粉氮化制备Si3N4粉,研究了原位合成NiO含量（质量分数为0-2.0%）和氮化温度对硅粉氮化的影响。结果表明：原位合成的NiO可以促进硅粉的氮化,随着NiO含量的增加,硅粉的氮化率呈先增后减的变化趋势;随着氮化温度的升高,硅粉氮化率逐渐提高,当温度升高到1 400℃、NiO质量分数为1.0%时硅粉全部氮化;制备的Si3N4呈晶须状,直径为65~497nm,其生长符合固-液-气-固（SLGS）生长机理。

a-SiTFT/PIN图像传感器件

在模拟计算以 a- Si TFT为有源开关 ,以 a- Si PIN为光敏源的有源成像器件工作特性与各单元元件关系的基础上 ,详细讨论了单元器件的材料、物理参数对 a- Si TFT/PIN耦合对特性的影响 ,并给出一定试验结果 .用 L ED光源照射 a- Si PIN的光电转换率可达 18.1n A/lx,a- Si

深槽Ni(Pt)Si/Si肖特基二极管特性研究

采用15nmNi/1.5nmPt/15nmNi/Si结构在600～850°C范围内经RTP退火的方法形成Ni(Pt)Si薄膜,其薄膜电阻低且均匀一致。比形成较低电阻率的NiSi薄膜的温度提高了150°C。在850°CRTP退火后形成的Ni(Pt)Si/Si肖特基势垒二极管I-V特性很好,其势垒高度ΦB为0.71eV,改善了肖特基二极管的稳定性。实验表明在肖特基二极管中引入深槽结构,可以大幅度地提高其反向击穿电压。在外延层浓度为5E15cm-3时,深槽器件的击穿电压可以达到80V,比保护环器件高约30V。

Si基Ge异质结构发光器件的研究进展

近年来,与Si的CMOS工艺相兼容的Ge/Si异质结构发光器件取得很多重要的进展。本文概述了Si基Ge异质结构发光器件的最新成果,如Ge/Si量子点发光二极管、Si衬底上的Ge发光二极管及激光器和Ge/SiGe多量子阱发光二极管,分别描述了这些器件的特点和增强其发光特性的途径。最后展望了Si基Ge异质结构发光器件的发展趋势,指出尽管Si基Ge异质结构发光器件获得了很大的发展,但是器件的发光效率仍然很低,离实用还有一定距离,还需要在材料和器件的结构方面有更多的创新。

SiGeC/Si功率二极管的数值模拟与分析

将SiGeC技术应用于功率半导体器件的特性改进,提出了一种新型p+(SiGeC)n-n+异质结功率二极管结构.在分析SiGeC合金材料物理特性的基础上,给出了该结构的关键物理参数模型,并在此基础上利用MEDICI模拟,对比分析了C的引入对器件各种电特性的影响.此外,还模拟比较了不同p+区厚度对器件反向漏电流的影响.结果表明:在SiGe/Si功率二极管中加入少量的C,在基本不影响器件正向I V特性和反向恢复特性的前提下,大大减少了器件的反向漏电流,并且C的加入还减小了器件特性对材料临界厚度的依赖性,提高了器件稳定性.