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Abnormal oxidation in nickel silicide and nickel germanosilicide in sub-micro CMOS
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作者 汪涛 郭清 +1 位作者 刘艳 Yun Janggn 《Chinese Physics B》 SCIE EI CAS CSCD 2012年第6期565-568,共4页
After post-silicidation annealing at various temperatures for 30 min, abnormal oxidation and agglomeration in nickel silicide and nickel germanosilicide are investigated under different conditions of NiSi, with As-, I... After post-silicidation annealing at various temperatures for 30 min, abnormal oxidation and agglomeration in nickel silicide and nickel germanosilicide are investigated under different conditions of NiSi, with As-, In-, and Sb-doped Si substrates of nickel germanosilicide without any dopants. The NiSi thickness, dopant species, doping concentration, and silicide process conditions are dominant factors for abnormal oxidation and NiSi agglomeration. Larger dopants than Si, thinner NiSi thickness and SiGe suhstrates, and higher dopant concentrations promote abnormal oxidation and agglomeration. 展开更多
关键词 NISI nisige OXIDATION metal oxide semiconductor field-effect transistor sub-micro IC process
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