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高温高压下Cu在Ⅱa型金刚石大单晶Ti除氮反应中的作用机理 被引量:3
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作者 郭明明 李尚升 +6 位作者 冯璐 胡美华 宿太超 高广进 王君卓 尤悦 聂媛 《新型炭材料》 SCIE EI CAS CSCD 北大核心 2020年第5期559-566,共8页
研究Cu在高温高压下Ti除氮反应中的作用机理,对合成优质的Ⅱa型金刚石晶体具有重要意义。本研究在FeNi-C体系中添加Ti和Ti/Cu或TiC和TiC/Cu,在5.6 GPa和1543 K的条件下使用温度梯度法制备了金刚石大单晶,并使用光学显微镜和红外光谱仪... 研究Cu在高温高压下Ti除氮反应中的作用机理,对合成优质的Ⅱa型金刚石晶体具有重要意义。本研究在FeNi-C体系中添加Ti和Ti/Cu或TiC和TiC/Cu,在5.6 GPa和1543 K的条件下使用温度梯度法制备了金刚石大单晶,并使用光学显微镜和红外光谱仪对样品进行表征。结果表明,Ti或TiC分别与N反应生成TiN和Ti(C1-x,Nx)。这种情况下,单独添加Ti或TiC除氮效果差,所合成金刚石晶体中会出现大量的包裹体和凹坑。这是由于反应生成的TiN、TiC和Ti(C1-x,Nx)杂质严重影响晶体质量的结果。Ti或TiC分别与Cu共掺杂,可以促进TiC的分解释放Ti,提高除氮效率,并逐渐减少晶体合成中的缺陷和包裹体数量。这说明Cu的添加量应明显小于Ti,这与普通Ti和Cu的添加比例1∶1不同。最终结果表明,当Ti/Cu质量分数为1.70%/1.06%(Ti∶Cu=1∶0.625)时,可以合成出高质量的Ⅱa型金刚石晶体。 展开更多
关键词 高温高压 大单晶 Ⅱa型金刚石 ti/cu除氮剂
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机械合金化Nd_8Fe_(81)Cu_3Ti_8合金的结构与磁性
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作者 崔保志 孙校开 +1 位作者 赵新国 刘伟 《金属功能材料》 CAS 1998年第2期56-58,共3页
本文研究了掺杂3at%Cu对Nd(Fe,Ti)12化合物结构与磁性的影响。结果表明,加入3at%Cu后,ThMn12结构相的形成温度由900℃降至750℃,但也对渗氮造成困难。预先将样品在300℃氢气中进行活化处... 本文研究了掺杂3at%Cu对Nd(Fe,Ti)12化合物结构与磁性的影响。结果表明,加入3at%Cu后,ThMn12结构相的形成温度由900℃降至750℃,但也对渗氮造成困难。预先将样品在300℃氢气中进行活化处理,有利于形成氮化物。氮化物的内禀矫顽力随退火温度的升高而增大,到850℃达最大值。 展开更多
关键词 Nd(Fe ti)12 渗氮 磁性能 铜掺杂 磁性材料 MA
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Characterization of Ti-Cu Films Deposited by HPPMS and Effect on NO Catalytic Release and Platelet Adhesion Behavior
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作者 陈涛 CHENG Dan +6 位作者 TAI Yuandong 景凤娟 SUN Hong XIE Dong LENG Yonxiang HUANG Nan KEN Yukimural 《Journal of Wuhan University of Technology(Materials Science)》 SCIE EI CAS 2018年第2期505-511,共7页
Ti-Cu films with different Cu concentrations were fabricated by high-power pulsed magnetron sputtering(HPPMS) to release copper ions and catalyze NO to improve the blood compatibility. The Cu concentrations of films... Ti-Cu films with different Cu concentrations were fabricated by high-power pulsed magnetron sputtering(HPPMS) to release copper ions and catalyze NO to improve the blood compatibility. The Cu concentrations of films were 25.7 at% and 68.8 at%. Pure Ti films were also fabricated. Copper release, catalytic release of nitric oxide(NO), and blood platelet adhesion of Ti-Cu films were studied. Ti-Cu films released copper ions in PBS solution and more Cu ions were released from films with 68.8 at% Cu. Ti-Cu films had excellent ability of catalytical decomposition of exogenous donor S-nitroso-N-acetyl-DL-penicillamine(SNAP) and as a result, nitric oxide(NO) was generated. The NO generation catalyzed by Ti-Cu films was significantly higher than that by pure Ti films. This was more eminent in the Ti-Cu films with 68.8 at% Cu. The platelet adhesion and activation of Ti-Cu films were significantly inhibited compared to that of pure Ti films in the presence of SNAP. The Ti-Cu film fabricated by HPPMS showed the ability of releasing Cu ions to catalyze SNAP to generate NO to inhibit platelet adhesion and activation. 展开更多
关键词 ti-cu film copper ions nitrogen oxide platelet adhesion high-power pulsed magnetron sputtering
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碳化硼陶瓷与高氮钢钎焊接头组织和性能
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作者 杨晶 薛鹏 +3 位作者 张永锋 房旭 江晨雨 石凯 《焊接学报》 EI CAS CSCD 北大核心 2024年第5期113-118,共6页
使用Ag-Cu-Ti钎料实现了碳化硼(B_(4)C)陶瓷与高氮钢之间的可靠钎焊连接,研究了Ti元素含量对Ag-Cu-Ti钎料润湿铺展性能的影响,分析了Ti元素影响钎焊接头界面组织的作用机制,并在室温条件下测试了钎焊接头的抗剪强度.结果表明,当钎料Ag-C... 使用Ag-Cu-Ti钎料实现了碳化硼(B_(4)C)陶瓷与高氮钢之间的可靠钎焊连接,研究了Ti元素含量对Ag-Cu-Ti钎料润湿铺展性能的影响,分析了Ti元素影响钎焊接头界面组织的作用机制,并在室温条件下测试了钎焊接头的抗剪强度.结果表明,当钎料Ag-Cu-Ti钎料中的Ti元素含量为4.5%时,钎料在B_(4)C陶瓷与高氮钢上均表现出良好的润湿性能,铺展形貌良好,铺展面积更大,在钎焊温度910℃,保温时间25 min的焊接条件下,Ti元素含量为4.5%的钎料与B_(4)C陶瓷和高氮钢均实现了良好的冶金结合,显微组织分析结果表明,钎焊接头组织在陶瓷侧反应层存在TiB和TiC,而在高氮钢侧反应层中出现了TiFe_(2),TiN和CuTi_(2),B_(4)C陶瓷/高氮钢钎焊接头的最大抗剪强度为54 MPa. 展开更多
关键词 AG-cu-ti钎料 碳化硼陶瓷 高氮钢 润湿铺展性能 抗剪强度
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Ar-N_2 Shielding GTA Welding of Copper Thick Plates
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作者 李一楠 《Journal of Wuhan University of Technology(Materials Science)》 SCIE EI CAS 2009年第S1期59-62,共4页
The Ar-N2 gas tungsten arc(GTA) welding of 10 mm copper thick plates without preheating was investigated.The microstructure of weld metal and joints was observed and mechanical performance of weld metal was tested by ... The Ar-N2 gas tungsten arc(GTA) welding of 10 mm copper thick plates without preheating was investigated.The microstructure of weld metal and joints was observed and mechanical performance of weld metal was tested by using Cu-Ti welding metal with different Ti content.The Ar-N2 GTA weld of copper thick plates can eliminate the nitrogen porosities in the weld metal by adding element Ti in filler metal,which is caused by N2 gas in shield gas.The elimination degree of nitrogen porosities,the distribution of CuTiN intermetallic compound(IMC) and the mechanical performance of joints are associated with the change of the Ti content in the welding materials.And when Ti content is about 5%,nitrogen porosities is eliminated completely and the CuTiN IMC distribute dispersedly,the tensile strength and impact ductility of the joint achieve the best result,which almost reaches the lever of the base metal. 展开更多
关键词 thick copper plates Ar-N2 GTA welding cu-ti welding metals elimination of nitrogen porosity
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