This paper investigates the effect of O2 plasma treatment on the electric property of Cu/SiCOH low dielectric constant （low-k） film integrated structure. The results show that the leakage current of Cu/SiCOH low-k i...This paper investigates the effect of O2 plasma treatment on the electric property of Cu/SiCOH low dielectric constant （low-k） film integrated structure. The results show that the leakage current of Cu/SiCOH low-k integrated structure can be reduced obviously at the expense of a slight increase in dielectric constant k of SiCOH films. Bythe Fourier transform infrared （FTIR） analysis on the bonding configurations of SiCOH films treated by O2 plasmar it is found that the decrease of leakage current is related to the increase of Si-O cages originating from the linkage of Si dangling bonds through O, which makes the open pores sealed and reduces the diffusion of Cu to pores.展开更多
With the progress of ULSI technology, materials with low dielectric constant are required to replace SiO2 film as the interlayer to scale down the interconnection delay. Fluorinated Si oxide thin films (SiOF) are a pr...With the progress of ULSI technology, materials with low dielectric constant are required to replace SiO2 film as the interlayer to scale down the interconnection delay. Fluorinated Si oxide thin films (SiOF) are a promising material for the low dielectric constant and the process compatibility in existing technology. However, SiOF films are liable to absorb moisture when exposed to air. By treating the SiOF films with O-2 plasma, it was found that the moisture resistibility of SiOF films was remarkably improved. The mechanism of the improvement in stability of dielectric constant was investigated. The results show that: 1) F atoms dissociated from the films and the bond angle of Si-O-Si decreased. 2) The plasma treatment enhanced the strength of Si-F bonds by removing unstable =SiF2 structures in the films. Resistibility of SiOF films in moisture was improved.展开更多
基金Project supported by the National Natural Science Foundation of China （Grant No 10575074）, the Specialized Research Fund for the Doctoral Program of Higher Education of China and the Foundation of Key Laboratory of Thin Films, Jiangsu Province, China.
文摘This paper investigates the effect of O2 plasma treatment on the electric property of Cu/SiCOH low dielectric constant （low-k） film integrated structure. The results show that the leakage current of Cu/SiCOH low-k integrated structure can be reduced obviously at the expense of a slight increase in dielectric constant k of SiCOH films. Bythe Fourier transform infrared （FTIR） analysis on the bonding configurations of SiCOH films treated by O2 plasmar it is found that the decrease of leakage current is related to the increase of Si-O cages originating from the linkage of Si dangling bonds through O, which makes the open pores sealed and reduces the diffusion of Cu to pores.
基金The work was supported by the National Natural Science Foundation of China(No.69776026)the Foundation for University Key Teacher by the Ministry of Education.
文摘With the progress of ULSI technology, materials with low dielectric constant are required to replace SiO2 film as the interlayer to scale down the interconnection delay. Fluorinated Si oxide thin films (SiOF) are a promising material for the low dielectric constant and the process compatibility in existing technology. However, SiOF films are liable to absorb moisture when exposed to air. By treating the SiOF films with O-2 plasma, it was found that the moisture resistibility of SiOF films was remarkably improved. The mechanism of the improvement in stability of dielectric constant was investigated. The results show that: 1) F atoms dissociated from the films and the bond angle of Si-O-Si decreased. 2) The plasma treatment enhanced the strength of Si-F bonds by removing unstable =SiF2 structures in the films. Resistibility of SiOF films in moisture was improved.
