Effect of surface modification on the radiation stability of diamond ohmic contacts

The ohmic contact interface between diamond and metal is essential for the application of diamond detectors.Surface modification can significantly affect the contact performance and eliminate the interface polarization effect.However,the radiation stability of a diamond detector is also sensitive to surface modification.In this work,the influence of surface modification technology on a diamond ohmic contact under high-energy radiation was investigated.Before radiation,the specific contact resistivities(ρc)between Ti/Pt/Au-hydrogen-terminated diamond(H-diamond)and Ti/Pt/Au-oxygenterminated diamond(O-diamond)were 2.0×10^(-4)W·cm^(2) and 4.3×10^(-3)Wcm^(2),respectively.After 10 MeV electron radiation,the ρc of Ti/Pt/Au H-diamond and Ti/Pt/Au O-diamond were 5.3×10^(-3)W·cm^(2)and 9.1×10^(-3)W·cm^(2),respectively.The rates of change of ρc of H-diamond and O-diamond after radiation were 2550%and 112%,respectively.The electron radiation promotes bond reconstruction of the diamond surface,resulting in an increase in ρc.

Low-resistance Ohmic contact for GaN-based laser diodes

Low-resistance Ohmic contact is critical for the high efficiency GaN-based laser diodes.This study investigates the introduction of the In_(0.15)Ga_(0.85)N contact layer on the specific contact resistance.Experimental results reveal that adopting the In0.15Ga0.85N contact layer yields a minimized specific contact resistance of 2.57×10^(-5)Ω·cm^(2) which is two orders of magnitude lower than the GaN contact layer(7.61×10^(-3)Ω·cm^(2)).A decrease in the specific contact resistance arises from the reduction of the barrier between the metal and p-type In0.15Ga0.85N.To develop an optimal metal electrode combination on the In0.15Ga0.85N contact layer,the Pd/Au and Ni/Au electrode stacks which are most commonly used in the formation of Ohmic contact with p-GaN are investigated.Metal stack of 10/30 nm Pd/Au is demonstrated effective in reducing the specific contact resistance to 10^(-5)Ω·cm^(2) level.The mechanism of the variation of the specific contact resistance under different annealing atmospheres is explained by auger electron spectroscopy.

Computational Investigation of Brownian Motion and Thermophoresis Effect on Blood-Based Casson Nanofluid on a Non-linearly Stretching Sheet with Ohmic and Viscous Dissipation Effects

Motivated by the widespread applications of nanofluids,a nanofluid model is proposed which focuses on uniform magnetohydrodynamic(MHD)boundary layer flow over a non-linear stretching sheet,incorporating the Casson model for blood-based nanofluid while accounting for viscous and Ohmic dissipation effects under the cases of Constant Surface Temperature(CST)and Prescribed Surface Temperature(PST).The study employs a two-phase model for the nanofluid,coupled with thermophoresis and Brownian motion,to analyze the effects of key fluid parameters such as thermophoresis,Brownian motion,slip velocity,Schmidt number,Eckert number,magnetic parameter,and non-linear stretching parameter on the velocity,concentration,and temperature profiles of the nanofluid.The proposed model is novel as it simultaneously considers the impact of thermophoresis and Brownian motion,along with Ohmic and viscous dissipation effects,in both CST and PST scenarios for blood-based Casson nanofluid.The numerical technique built into MATLAB’s bvp4c module is utilized to solve the governing system of coupled differential equations,revealing that the concentration of nanoparticles decreases with increasing thermophoresis and Brownian motion parameters while the temperature of the nanofluid increases.Additionally,a higher Eckert number is found to reduce the nanofluid temperature.A comparative analysis between CST and PST scenarios is also undertaken,which highlights the significant influence of these factors on the fluid’s characteristics.The findings have potential applications in biomedical processes to enhance fluid velocity and heat transfer rates,ultimately improving patient outcomes.

Physical mechanism of oxygen diffusion in the formation of Ga_(2)O_(3) Ohmic contacts

The formation of low-resistance Ohmic contacts in Ga_(2)O_(3) is crucial for high-performance electronic devices. Conventionally, a titanium/gold(Ti/Au) electrode is rapidly annealed to achieve Ohmic contacts, resulting in mutual diffusion of atoms at the interface. However, the specific role of diffusing elements in Ohmic contact formation remains unclear.In this work, we investigate the contribution of oxygen atom diffusion to the formation of Ohmic contacts in Ga_(2)O_(3). We prepare a Ti/Au electrode on a single crystal substrate and conduct a series of electrical and structural characterizations.Using density functional theory, we construct a model of the interface and calculate the charge density, partial density of states, planar electrostatic potential energy, and I–V characteristics. Our results demonstrate that the oxygen atom diffusion effectively reduces the interface barrier, leading to low-resistance Ohmic contacts in Ga_(2)O_(3). These findings provide valuable insights into the underlying mechanisms of Ohmic contact formation and highlight the importance of considering the oxygen atom diffusion in the design of Ga_(2)O_(3)-based electronic devices.

Constructing interfacial electric field and Zn vacancy modulated ohmic junctions ZnS/NiS for photocatalytic H_(2) evolution

Adjusting the interfacial transport efficiency of photogenerated electrons and the free energy of hydrogen adsorption through interface engineering is an effective means of improving the photocatalytic activity of semiconductor photocatalysts.Herein,hollow ZnS/NiS nanocages with ohmic contacts containing Zn vacancy(V_(Zn)-ZnS/NiS)are synthesized using ZIF-8 as templates.An internal electric field is constructed by Fermi level flattening to form ohmic contacts,which increase donor density and accelerate electron transport at the V_(Zn)-ZnS/NiS interface.The experimental and DFT results show that the tight interface and V_(Zn) can rearrange electrons,resulting in a higher charge density at the interface,and optimizing the Gibbs free energy of hydrogen adsorption.The optimal hydrogen production activity of V_(Zn)-ZnS/NiS is 10,636 mmol h^(-1) g^(-1),which is 31.9 times that of V_(Zn)-ZnS.This study provides an idea for constructing sulfide heterojunctions with ohmic contacts and defects to achieve efficient photocatalytic hydrogen production.

Impact of Viscous Dissipation and Ohmic Heating on Natural Convection Heat Transfer in Thermo-Magneto Generated Plume

The present investigation centers on the impact of viscous dissipation and ohmic heating on the plume generated by a line heat source under the impact of an aligned magnetic field.In this study,the flow model is adapted to incorporate ohmic heating and viscous dissipation by including the respective terms in the energy equation.A mathematical model is formulated as a system of coupled partial differential equations to analyze the flow problem.Subsequently,a numerical solution is derived with stream function formulation for the system of coupled partial differential equations,which transmutes it into ordinary differential equations.To achieve this,the numerical properties of the problem are established through the utilization of the Shooting method in tandem with the MATLAB tool bvp4c.The graphical representations of both missing and specified boundary conditions depict the effects of the magnetic parameter,viscous dissipation variable,magnetic force parameter,Prandtl number,and magnetic Prandtl number.These are accompanied by a discussion of their respective physical implications.The observed results claimed that the velocity,current density,and temperature distribution decrease for enhancing magnetic parameters.Meanwhile,the skin friction and magnetic flux drop while the heat transfer rate increases with an increment in magnetic parameters.These fluid flow and heat transfer characteristics were observed to decrease for increasing viscous dissipation.The current work is novel in incorporating ohmic heating viscous dissipation in energy equations coupled with Max-well and magnetic induction equations.

Evidence of the Role of Carbon Vacancies in Nickel-Based Ohmic Contacts to n-Type Silicon Carbide

N-wells are created by P＋ ion implantation into Si-faced p-type 4H-SiC epilayer. Ti and Ni are deposited in sequence on the surface of the active regions. Ni2Si is identified as the dominant phase by X-ray diffraction （XRD） analysis after metallization annealing. An amorphous C film at the Ni2 Si/SiC interface is confirmed by an X-ray energy-dispersive spectrometer （XEDS）. The Ni2Si and amorphous C film are etched away selectively,followed by deposition of new metal films without annealing. Measurement of the current-voltage characteristics shows that the contacts are still ohmic after the Ni2 Si and amorphous C film are replaced by new metal films. The sheet resistance Rsh of the implanted layers decreases from 975 to 438f2/D, because carbon vacancies （Vc） appeared during annealing,which act as donors for electrons in SiC.

Zn-Cu电池的Joule热电阻与Ohmic电阻的理论研究

当Zn－Cu伏打电池处于缓慢、均匀稳定放电状态时，Joule热电阻RJ不等于Ohmic电阻R.RJ涉及由电流I所带的离子，而R则涉及电解质内所有离子．

Fabrication of n^+ Polysilicon Ohmic Contacts with a Heterojunction Structure to n-Type 4H-Silicon Carbide

Polysilicon ohmic contacts to n-type 4H-SiC have been fabricated. TLM （transfer length method） test patterns with polysilicon structure are formed on n-wells created by phosphorus ion （P^＋） implantation into a Si-faced p-type 4H-SiC epilayer. The polysilicon is deposited using low-pressure chemical vapor deposition （LPCVD） and doped by phosphorous ions implantation followed by diffusion to obtain a sheet resistance of 22Ω/□. The specific contact resistance pc of n^＋ polysilicon contact to n-type 4H-SiC as low as 3.82 × 10^-5Ω· cm^2 is achieved. The result for sheet resistance Rsh of the phosphorous ion implanted layers in SiC is about 4.9kΩ/□. The mechanisms for n^＋ polysilicon ohmic contact to n-type SiC are discussed.

Ohmic Contact Properties of Multi-Metal Films on n-Type 4H-SiC

An investigation of Au/Ti/Ni and Au/Ti/Pt ohmic contacts to n-type 4H-SiC and the behavior of metal films on SiC with thermal anneals is reported. Specific contact resistance as low as 2. 765 x 10^-6Ω·cm^2 was achieved after rapid thermal annealing in N2 for 2min at 950℃. SIMS analysis shows that the formation of Ni silicide after annealing supported a number of carbon atoms＇ outdiffusion from the SiC to form interstitial compound TiC. This process can create abundant C vacancies near the interface. It is the carbon defect layer that enhances the defect-assisted tunneling. The interface band structure within the defect level could make it clear why the metal-SiC contacts become ohmic during annealing.

圆柱形电极Zn-Cu电池中Joule热电阻和Ohmic电阻的理论研究

从理论上对Zn-Cu伏打电池中的Joule热电阻(RJ)和Ohmic电阻(RO)进行了研究.结果表明:当Zn-Cu伏打电池处于缓慢、均匀、稳定放电状态时,RJ>RO.这是因为RJ=Q/I2,RJ涉及电流所带的离子,其大小取决于电能和化学能产生的热,RO=ΔU/I,其值大小只取决于电能.

A Novel Ideal Ohmic Contact SiGeC/Si Power Diode with Graded Doping Concentration

A novel structure of ideal ohmic contact p^＋ （SiGeC）-n^- -n^＋ diodes with three-step graded doping concentration in the base region is presented, and the changing doping concentration gradient is also optimized. Using MEDICI, the physical parameter models applicable for SiGeC/Si heterojunction power diodes are given. The simulation results indicate that the diodes with graded doping concentration in the base region not only have the merit of fast and soft reverse recovery but also double reverse blocking voltage,and their forward conducting voltage has dropped to some extent,compared to the diodes with constant doping concentration in the base region. The new structure achieves a good trade-off in Qs-Vf-Ir ,and its combination of properties is superior to ideal ohmic contact diodes and conventional diodes.

Non-Ohmic谱反常扩散粒子的响应特性:耦合谐振子势情况

研究了具有non-Ohmic谱的反常扩散粒子对谐振子势的响应特性,结果发现对次扩散粒子,系统需要更长的时间达到平衡,而对超扩散粒子,则只要更短的时间就可平衡;特别对超扩散粒子,系统对各种参数值的变化更加敏感,而对次扩散则相对迟钝些.本文提供的分析方法对研究系统在其他外势条件下的响应特性问题将有一定的启发作用.

Low-thermal-budget Au-free ohmic contact to an ultrathin barrier AlGaN/GaN heterostructure utilizing a micro-patterned ohmic recess

A pre-ohmic micro-patterned recess process,is utilized to fabricate Ti/Al/Ti/TiN ohmic contact to an ultrathin-barrier(UTB)AlGaN/GaN heterostructure,featuring a significantly reduced ohmic contact resistivity of 0.56Ω·mm at an alloy temperature of 550℃.The sheet resistances increase with the temperature following a power law with the index of +2.58,while the specific contact resistivity decreases with the temperature.The contact mechanism can be well described by thermionic field emission(TFE).The extracted Schottky barrier height and electron concentration are 0.31 eV and 5.52×10^(18) cm^(−3),which suggests an intimate contact between ohmic metal and the UTB-AlGaN as well as GaN buffer.A good correlation between ohmic transfer length and the micro-pattern size is revealed,though in-depth investigation is needed.A preliminary CMOS-process-compatible metal-insulator-semiconductor high-mobility transistor(MIS-HEMT)was fabricated with the proposed Au-free ohmic contact technique.

Ohmic Losses in Coaxial Cavity Gyrotron with Outer Corrugation

Ohmic losses of a coaxial cavity gyrotron with outer corrugation are investigated.The results show that the averaged ohmic loss densities of the inner and outer conductors have similar changes along with the axial direction of the gyrotron;whereas averaged ohmic loss densities of the outer conductor are more than the inner conductor;the outer slot depth and width cause greatly the averaged ohmic loss densities of the corrugation bottom and the corrugation period of outer conductor,and averaged densities of ohmic losses on the inner conductor are almost unaffected.

Modelling and Simulation of an Ohmic Heating Process

Ohmic Heating (OH) is one of the emerging thermal technologies used in food processing which can produce rapid and uniform heating with close to 100% energy transfer efficiency. Although mathematical modelling for OH processes has been studied by many researchers in recent years, systematic simulations of OH have not been developed for model-based control of the processes. In this paper, mathematical model for a Colinear Ohmic Heater is presented, analyzed, and studied based on the selected configuration. A numerical solution for the mathematical equations has been defined and proposed. MATLAB/Simulink model is hence developed and validated against the available data. Simulation results have shown that MATLAB/Simulink model can produce robust outputs at low computational costs with an accuracy of up to 99.6% in comparison to the analytical solution. This model can be used in further studies for analysis of the OH processes and development of advanced controllers.

关于球形电极Zn—Cu电池的Ohmic电阻和Joule热电阻的理论研究

当Zn—Cu伏打电池处于缓慢、均匀稳定的放电状态时,Joule热电阻不等于Ohmic电阻R。从能量上来考虑,电池中不仅电能转化成热量,化学能也转化成热量。涉及由电能I所带的离子,而R则涉及电解质中所有离子。

Formation of Nickel Based Ohmic Contact to High Energy Vanadium Implanted n-Type 4H-SiC

The diffusion behavior of vanadium （V） implanted in SiC is investigated by secondary ion mass spec- trometry. Significant redistribution, especially out-diffusion of vanadium towards the sample surface, is not ob- served after 1650℃ annealing. Higher carrier concentration is obtained due to a lack of compensation of vanadium in the surface region. The electrical characteristics of Ni contacts to V-implanted n-type 4H-SiC are investigated using a linear transmission line method. A specific contact resistance as low as 4.4 × 10^-3Ω · cmA^2 is achieved after annealing at 1050℃ for 10min in gas ambient consisting of 90% N2 and 10% H2 X-ray diffraction analysis shows the formation of Ni2 Si and graphite phase at the interface after annealing. This provides the evidence that the car- bon vacancies,resulting from the out-diffusion of carbon atoms from SiC, contribute to the formation of ohmic contact through the reduction of effective Schottky barrier height for the transport of electrons.

Ohmic Contacts to n-Type Al_(0.6)Ga_(0.4)N for Solar-Blind Detectors

We investigate the contact characteristics of bi-layer thin films, Ti（20nm）/Al（200nm） on Si-doped n-type A10.6 Ga0.4 N films grown on sapphire substrate. The surface treatment was aqua regia boiling before metallization and annealing after metallization at different conditions in N2 ambient. High resolution X-ray diffractometery analysis was carried out on the contacts and the surface interfaces of these conditions were compared. A specific contact resistivity pc was determined using the circular transmission line method via current-voltage measurements. A pc of 3.42 × 10^-4 Ω·cm^2 was achieved when annealed at 670℃ for 90s. Then, this ideal ohmic contact was used in back-illuminated solar-blind AlGaN p- i-n detectors and the detectors＇ performances, such as spectral responsivity, dark-current,and breakdown voltage were optimized.

Study on Matching a 300 MVA Motor Generator with an Ohmic Heating Power Supply in HL-2M

A new 300 MVA/1350 MJ motor generator （MG） will be built to feed all of the poloidal field power supplies （PFPS） and auxiliary heating power supplies of the HL-2M tokamak. The MG has a vertical-shaft salient pole 6-phase synchronous generator and a coaxial 8500 kW induction motor. The Ohmic heating power supply （OHPS） consisting of 4-quadrant DC pulsed convertor is the one with the highest parameters among the PFPS. Therefore, the match between the generator and the OHPS is very important. The matching study with Matlab/Simulink is described in this paper. The simulation results show that the subtransient reactance of the generator is closely related to the inversion operation of the OHPS. By setting various subtransient reactance in the simulation generator model and considering the cost reduction, the optimized parameters are obtained as xd＂ = 0.405 p.u. at 100 Hz for the generator. The models built in the simulation can be used as an important tool for studying the dynamic characteristics and the control strategy of other HL-2M PFPSes.