pH对化学镀P-Ni合金性能的影响

研究了pH值对化学镀P-Ni合金性能的影响,着重讨论了在不同pH值下对其镀速、镀层形貌、镀层成分的影响。结果表明:当pH为6.2时,镀层沉积速度最快,镀层表面颗粒最均匀,镀层含P量最大。

Hot deformation behavior and processing map of Cu-Ni-Si-P alloy

The high-temperature deformation behavior of Cu-Ni-Si-P alloy was investigated by using the hot compression test in the temperature range of 600-800 ℃ and strain rate of 0.01-5 s-1. The hot deformation activation energy, Q, was calculated and the hot compression constitutive equation was established. The processing maps of the alloy were constructed based on the experiment data and the forging process parameters were then optimized based on the generated maps for forging process determination. The flow behavior and the microstructural mechanism of the alloy were studied. The flow stress of the Cu-Ni-Si-P alloy increases with increasing strain rate and decreasing deformation temperature, and the dynamic recrystallization temperature of alloy is around 700 ℃. The hot deformation activation energy for dynamic recrystallization is determined as 485.6 kJ/mol. The processing maps for the alloy obtained at strains of 0.3 and 0.5 were used to predict the instability regimes occurring at the strain rate more than 1 s-1 and low temperature （〈650 ℃）. The optimum range for the alloy hot deformation processing in the safe domain obtained from the processing map is 750-800 ℃ at the strain rate of 0.01-0.1 s i The characteristic microstructures predicted from the processing map agree well with the results of microstructural observations.

Effect of novel ternary ligand system on acidic electroless Ni-P plating on AZ91D magnesium alloy

The electroless Ni-P coatings on AZ91 D magnesium alloy substrate were prepared using the acidic hypophosphite-reduced electroless nickel bath containing the novel ternary ligand system. The results indicate that the deposition rate varies with the ternary ligand concentration in plating solution. The structural and morphological characteristics of the coatings were analyzed by XRD and SEM. The anticorrosion properties of the Ni-P coatings were evaluated in 3.5% NaCl solution by electrochemical impedance and potentiodynamic polarization methods. The amount of ternary ligands in electroless plating bath has an significant effect on the surface morphology and structure of Ni-P coatings. The decrease of crystallization temperature and increase of crystallization heat of all the deposits with an increase in ternary ligand concentration are found by DSC measurements. The coating obtained with 0.035 mol/L ternary ligand additive in plating bath can offer a better surface homogeneity and improve corrosion resistance.

Structure and effects of electroless Ni-Sn-P transition layer during acid electroless plating on magnesium alloys

An electroless ternary Ni-Sn-P transition layer with high corrosion resistance was applied for acid electroless nickel plating on magnesium alloys. The surface morphologies and microstructure of the traditional alkaline electroless Ni-P and novel Ni-Sn-P transition layers were compared by SEM and XRD, and the bonding strengths between the transition layers and AZ31 magnesium alloys were tested. The corrosion resistance of the samples was analyzed by porosity test, potentiodynamic polarization, electrochemical impedance spectroscopy（EIS） in acid electroless solution at p H 4.5 and immersion test in 10% HCl. The results indicate that the transition layer is essential for acid electroless plating Ni-P coatings on magnesium alloys. Under the same thin thickness（-6 μm）, the electroless Ni-Sn-P transition layer possesses superior properties to the traditional Ni-P transition layer, including high amorphization, smooth and dense surface without pores, enhanced bonding strength and corrosion resistance. Most importantly, acid electroless Ni-P coatings can be successfully deposited on magnesium alloys by using Ni-Sn-P transition layer.

An in situ measure method to study deposition mechanism of electroless Ni-P plating on AZ31 magnesium alloy

An in situ method was designed to measure a continuous open circuit potential （OCP） curve of AZ31 magnesium alloy and to observe the morphology variation of Ni-P coating during the process of the electroless plating. The deposition mechanism of the electroless Ni-P plating on AZ31 Mg alloy was studied by OCP curve, scanning electron microscopy （SEM）, and energy dispersion spectroscopy （EDS）. The process of electroless Ni-P plating contains the coating formation stage and the coating growth stage. The formation stage includes three procedures, i.e., the nucleation and growth of Ni crystallites, the extension of the coating in two-dimensional （2D） direction and the coalescence of the coating along three-dimensional （3D） direction. SEM investigations demonstrate that the spherical nodules of the Ni-P coating are not only formed during the coating growth stage, but also generated in the initial deposition stage of electroless Ni-P plating. The variation of the coating rates at different deposition stages corresponds to the deposition mechanism of their respective deposition stage.

Electroless plating and growth kinetics of Ni-P alloy film on SiC_p/Al composite with high SiC volume fraction

After Sn/Pd activating, the SiCp/Al composite with 65% SiC (volume fraction) was coated by electroless Ni?P alloy plating. Surface morphology of the composite and its effect on the Ni?P alloy depositing process and bonding action of Ni and P atoms in the Ni?P alloy were studied. The results show that inhomogeneous distribution of the Sn/Pd activating points results in preferential deposition of the Ni?P alloy particles on the Al alloy and rough SiC particle surfaces and in the etched caves. The Ni?P alloy film has an amorphous structure where chemical bonding between Ni and P atoms exists. After a continuous Ni?P alloy film formed, electroless Ni?P alloy plating is not affected by surface morphology and characteristics of the SiCp/Al composite any longer, but by the electroless plating process itself. The Ni?P alloy film follows linear growth kinetics with an activation energy of 68.44 kJ/mol.

不规则钢制件的化学镀镍技术

本文介绍了形状不规则的小的冷压钢金属冲压制件表面的化学镀镍技术、镀层特性及槽液的控制原则。

Ni-P cluster modified carbon nitride toward efficient photocatalytic hydrogen production

Exploring low-cost cocatalyst to take over noble metal cocatalyst is still challenging in the field of photocatalytic proton reduction.Herein,Ni-P alloy clusters are anchored onto the surface of polymeric carbon nitride through a chemical plating method and serve as highly efficient and stable cocatalyst toward photocatalytic proton reduction.An effective role in promoting the charge separation and migration of the photocatalytic system is demonstrated for Ni-P clusters,which essentially enhance the photocatalytic H2-production rate to a value of 1506μmol h^–1 g^–1.This performance is comparable to that of the benchmark of Pt-modified carbon nitride.This work highlights that the Ni-P alloy could be a potential alternative to noble metal cocatalyst in the photocatalytic reactions.

Mechanism and Microstructure of Electroless Ni-Fe-P Plating on CNTs

Electroless Ni-Fe-P alloy plating on the surface of CNTs was carded out with a bath using citrate salt and lactic acid as complex agents. We proposed a chemical reaction mechanism. The morphology, structure and chemical composition of the Ni-Fe-P/CNTs were studied with the aid of a scanning electronic microscope （SEM）, X-ray diffraction （XRD） and an energy-dispersive X-ray spectral analysis （EDS）. The results show that through a correct pre-treatment and electroless plating, Ni-Fe-P/CNTs composite particles can be obtained. The optimum electroless plating parameters of 35-42℃ and pH of 8.5-9.7 were achieved. The as-plated Ni-Fe-P alloy is amorphous. After a heat treatment at 500℃ for 90 min in H2, the coating is transformed into crystalloid Ni3E Fe2NiP and （Fe,Ni）3R The Ni-Fe-P alloy coating on the surface of CNTs is smooth and unique. The amount of Ni on the surface （mass fraction） of the Ni-Fe-P/CNTs composite particles is 29.13%, that of Fe 3.19% and that of P 2.28%.

Investigation on structure and dynamic property of liquid Pd-Cu-Ni-P alloys using ab initio molecular dynamics simulation

Based on the short-range order,it is found that the abundance of the P-centered P-transition-metal clusters are the common feature among the liquid Pd-Cu-Ni-P alloys,and hence this feature alone could not uncover the underlying mechanisms of the variation of glass forming ability among the liquid alloys.For the so called similar elements such as Cu and Ni,their behaviors are significantly different when interacting with Pd or P atoms.Cu has weak bonding with both Pd and P while Ni has very strong bonding with P but nearly no bonding with Pd.The different bonding characters thus underlie the phenomenon that in the best glass formers the ratio of the two similar elements often deviates from 1:1.Only if the parameters of chemical short-range order of Cu and Ni around P become closest to each other the best glass forming ability is reached.It is also illustrated that the calculated dynamic properties are very helpful to locate the composition of the best glass former.