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Erosion-corrosion behavior of Pd-Co and Pd-Cu films on 316L stainless steel in simulated PTA slurry environment
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作者 李思锐 左禹 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2016年第1期167-174,共8页
Pd-Co films with the Co content varying from 21.9% to 34.62%(mole fraction) and Pd-Cu(5% Cu, mole fraction) film were electrodeposited on 316 L stainless steel, and the erosion-corrosion resistance of the Pd-Co an... Pd-Co films with the Co content varying from 21.9% to 34.62%(mole fraction) and Pd-Cu(5% Cu, mole fraction) film were electrodeposited on 316 L stainless steel, and the erosion-corrosion resistance of the Pd-Co and Pd-Cu plated samples in a simulated boiling pure terephthalic acid(PTA) slurry environment was studied with methods of mass loss test, polarization measurement and scanning electron microscopy(SEM). Under the static state condition, both the Pd-Cu and Pd-Co plated samples exhibit good corrosion resistance and the Pd-Cu film behaves slightly better. However, with increasing the stirring speed, the corrosion rate of the Pd-Cu plated samples increases obviously while that of the Pd-Co plated samples shows only slight increase. Higher microhardness and lower surface roughness of Pd-Co film than those of Pd-Cu film, as well as good corrosion resistance, may be the main reasons for better erosion-corrosion resistance in the strong reductive acid plus erosion environment. 展开更多
关键词 Pd-Co film Pd-Cu film 316L stainless steel ELECTROPLATING EROSION-CORROSION pta environment
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