Electrical Characterization of the through Via in Package-on-Package with Interposer using Parameter Extraction Method

This paper describes a method to extract electrical parameters of the through via in Package-on-Package(PoP)with interposer.Using the de-embedding technique electrical parameters of the through via are extracted.With the extracted electrical parameters of the through via,the effects of via height,the distance between signal and GND vias,and anti-pad clearance on the electrical characteristics are discussed.

无线通信系统的封装技术

本文讨论了两种适于低成本、小形状因子的无线通信系统的封装工艺。首先描述了一种嵌入式无源工艺,其目标在于减小RF前端模块的形状因子和基带电源供应,方法是使用高性能的电感、电容、电阻,以及在封装衬底上嵌入的衍生电路。其次,描述了一种新的堆叠封装结构,它适用于通信和无线产品。此封装方案在单一封装内集成高速处理器和存储器,提供优异的信号完整性和高布线密度。