High-k polymer composite materials are next-generation dielectrics that show amazing applications in diverse electrical and electronic devices. Establishing near-percolated network of conducting filler in an insulatin...High-k polymer composite materials are next-generation dielectrics that show amazing applications in diverse electrical and electronic devices. Establishing near-percolated network of conducting filler in an insulating polymer matrix is a promising approach to develop flexible high-k dielectrics. However, challenges still exist today on fine controlling the network morphology to achieve extremely high k values and low losses simultaneously. The relationship between the network morphology and the dielectric properties of polymer composites is raising a number of fundamental questions. Herein, recent progress towards high-k polymer composites based on carbon nanomaterials is reviewed. Particular attention is paid on the influence of the network morphology on the dielectric properties. Some perspectives that warrant further investigation in the future are also addressed.展开更多
基金supported by project ELENA,funded by France ANR and Solvay, and of the Labex AMADEus (No. ANR-10-LABX-0042-AMADEus)
文摘High-k polymer composite materials are next-generation dielectrics that show amazing applications in diverse electrical and electronic devices. Establishing near-percolated network of conducting filler in an insulating polymer matrix is a promising approach to develop flexible high-k dielectrics. However, challenges still exist today on fine controlling the network morphology to achieve extremely high k values and low losses simultaneously. The relationship between the network morphology and the dielectric properties of polymer composites is raising a number of fundamental questions. Herein, recent progress towards high-k polymer composites based on carbon nanomaterials is reviewed. Particular attention is paid on the influence of the network morphology on the dielectric properties. Some perspectives that warrant further investigation in the future are also addressed.
