存储卡容量不足是“色友”们外出采风经常遇到的尴尬，精彩的瞬间会因此停止。这对“色友”们来说无疑是一种遗憾。长期致力小型数字记忆卡最佳方案提供的专业厂商Kingrmax于近期推出了一款容量高达512MB的迷你SD卡。该卡应用了小型记...存储卡容量不足是“色友”们外出采风经常遇到的尴尬，精彩的瞬间会因此停止。这对“色友”们来说无疑是一种遗憾。长期致力小型数字记忆卡最佳方案提供的专业厂商Kingrmax于近期推出了一款容量高达512MB的迷你SD卡。该卡应用了小型记忆卡领域革命性的PIP(Product In Package)封装技术，体积相当小，规格仅为20x21．5x1．4mm，适用于数码相机、掌上电脑等电子产品。展开更多
The precursor infiltration and pyrolysis（PIP） method for preparation of BN/SiO2 composites was used to improve mechanical properties, dielectric properties and feasibility of high temperature dielectric parts with l...The precursor infiltration and pyrolysis（PIP） method for preparation of BN/SiO2 composites was used to improve mechanical properties, dielectric properties and feasibility of high temperature dielectric parts with large dimensions and complex shapes. In the processing procedure, the porous BN ceramic matrix was first successfully prepared by compacting the mixed powders of B and BN and then sintering them at a certain temperature under normal pressure of N2.The polycarbosilane（PCS） solution was vacuum infiltrated into porous BN ceramics at the room temperature and then at 800℃ in the air to depolimerize out amorphous SiO2, and sintered further at 1300℃ in N2 to get BN/SiO2 composites. The microstructure of materials was studied by means of X-ray diffraction and electron probe micro （analysis.） The thermo-decomposition mechanism of PCS was investigated by a TG-DTA and infrared （IR） spectrum analysis. The flexural strengths were measured by the three-point bending method. The dielectric constant and the loss tangent were measured by the wave-guide method. The results show BN/SiO2 composites were fabricated. The obtained composites posses a flexural strength of 61.96-93.31MPa, the dielectric constant in the range of 3.50-3.78 and the order of magnitude of the loss tangent at 10-3, which are good for the high temperature dielectric parts with large size and complex shapes.展开更多
文摘存储卡容量不足是“色友”们外出采风经常遇到的尴尬，精彩的瞬间会因此停止。这对“色友”们来说无疑是一种遗憾。长期致力小型数字记忆卡最佳方案提供的专业厂商Kingrmax于近期推出了一款容量高达512MB的迷你SD卡。该卡应用了小型记忆卡领域革命性的PIP(Product In Package)封装技术，体积相当小，规格仅为20x21．5x1．4mm，适用于数码相机、掌上电脑等电子产品。
文摘The precursor infiltration and pyrolysis（PIP） method for preparation of BN/SiO2 composites was used to improve mechanical properties, dielectric properties and feasibility of high temperature dielectric parts with large dimensions and complex shapes. In the processing procedure, the porous BN ceramic matrix was first successfully prepared by compacting the mixed powders of B and BN and then sintering them at a certain temperature under normal pressure of N2.The polycarbosilane（PCS） solution was vacuum infiltrated into porous BN ceramics at the room temperature and then at 800℃ in the air to depolimerize out amorphous SiO2, and sintered further at 1300℃ in N2 to get BN/SiO2 composites. The microstructure of materials was studied by means of X-ray diffraction and electron probe micro （analysis.） The thermo-decomposition mechanism of PCS was investigated by a TG-DTA and infrared （IR） spectrum analysis. The flexural strengths were measured by the three-point bending method. The dielectric constant and the loss tangent were measured by the wave-guide method. The results show BN/SiO2 composites were fabricated. The obtained composites posses a flexural strength of 61.96-93.31MPa, the dielectric constant in the range of 3.50-3.78 and the order of magnitude of the loss tangent at 10-3, which are good for the high temperature dielectric parts with large size and complex shapes.
