In order to study the mechanism of vacuum fluxless soldering on the conditions of laser heating, the method of measuring temperature by the thermocouple is used to analyze the spreading and wetting process of both flu...In order to study the mechanism of vacuum fluxless soldering on the conditions of laser heating, the method of measuring temperature by the thermocouple is used to analyze the spreading and wetting process of both fluxless Sn-Pb solder in the vacuum surroundings and flux Sn-Pb solder on Cu pad. Solder spreading and wetting affected by the soldering thermal process is also discussed according to the thermodynamics principle. Results show that vacuum fluxless soldering demands higher temperature, and the fall of the solder surface tension is the important factor achieving fluxless laser soldering.展开更多
Four process parameters, pad diameter, stencil thickness, ball diameter and stand-off were chosen as four control factors. By using an L25 （5^6 ） orthogonal array the ceramic ball grid array （ CBGA ） solder joints...Four process parameters, pad diameter, stencil thickness, ball diameter and stand-off were chosen as four control factors. By using an L25 （5^6 ） orthogonal array the ceramic ball grid array （ CBGA ） solder joints which have 25 different combinations of process parameters were designed. The numerical models of all the 25 CBGA solder joints were developed using the Sugrace Evolver. Utilizing the sugrace coordinate exported from the 25 CBGA solder joints numerical models, the finite element analysis models were set up and the nonlinear finite element analysis of the CBGA solder joints under thermal cycles were pegrormed by ANSYS. The thermal fatigue life of CBGA solder joint was calculated using Coffin-Manson equation. Based on the calculated thermal fatigue life results, the range analysis and the variance analysis were pegrormed. The results show that the fatigue life of CBGA solder joint is affected by the pad diameter, the stencil thickness, the ball diameter and the stand-off in a descending order, the best combination of process parameters results in the longest fatigue life is 0.07 mm stand-off, 0.125 mm stencil thickness of, 0.85 mm ball diameter and 0. 89 mm pad diameter. With 95% confidence the pad diameter has a significant effect on the reliability of CBGA solder joints whereas the stand-off, the stencil thickness and the ball diameter have little effect on the reliability of CBGA solder joints.展开更多
基金This project is supported by National Natural Science Foundation of China !(59671063)
文摘In order to study the mechanism of vacuum fluxless soldering on the conditions of laser heating, the method of measuring temperature by the thermocouple is used to analyze the spreading and wetting process of both fluxless Sn-Pb solder in the vacuum surroundings and flux Sn-Pb solder on Cu pad. Solder spreading and wetting affected by the soldering thermal process is also discussed according to the thermodynamics principle. Results show that vacuum fluxless soldering demands higher temperature, and the fall of the solder surface tension is the important factor achieving fluxless laser soldering.
基金This work was supported by Science Foundation of Guangxi Zhuang Autonomous Region (Contract No. 02336060).
文摘Four process parameters, pad diameter, stencil thickness, ball diameter and stand-off were chosen as four control factors. By using an L25 （5^6 ） orthogonal array the ceramic ball grid array （ CBGA ） solder joints which have 25 different combinations of process parameters were designed. The numerical models of all the 25 CBGA solder joints were developed using the Sugrace Evolver. Utilizing the sugrace coordinate exported from the 25 CBGA solder joints numerical models, the finite element analysis models were set up and the nonlinear finite element analysis of the CBGA solder joints under thermal cycles were pegrormed by ANSYS. The thermal fatigue life of CBGA solder joint was calculated using Coffin-Manson equation. Based on the calculated thermal fatigue life results, the range analysis and the variance analysis were pegrormed. The results show that the fatigue life of CBGA solder joint is affected by the pad diameter, the stencil thickness, the ball diameter and the stand-off in a descending order, the best combination of process parameters results in the longest fatigue life is 0.07 mm stand-off, 0.125 mm stencil thickness of, 0.85 mm ball diameter and 0. 89 mm pad diameter. With 95% confidence the pad diameter has a significant effect on the reliability of CBGA solder joints whereas the stand-off, the stencil thickness and the ball diameter have little effect on the reliability of CBGA solder joints.
