光敏聚酰亚胺抗蚀剂的研究

A kind of negative photoresist, composed of photosensitive polyimides and N methyl 2 pyrrolidone was formulated. The curing mechanism and the relationship of the properties and structure of PSPIs were studied. The results of TGA show that the PSPIs have excellent heat resistance. Based on our research, the pattern with line width as low as 2.5 μm was gained with the conventional UV photolithography under the optimum parameters.

自增感光敏聚酰亚胺的热失重及光固化研究

对一类主链上含有二苯甲酮羰基和侧烷基的新型自增感光敏聚酰亚胺（ＰＳＰＩ）的热失重行为及光固化过程进行了研究．通过红外分析（ＩＲ）和热失重分析（ＴＧＡ）对光固化过程进行了追踪，确定了光交联机理为侧烷基上的氢脱除后生成的自由基进攻二苯甲酮的羰基．此外，还讨论了曝光和热处理对ＰＳＰＩ薄膜颜色、脆性和溶解度的影响．