The System-on-Chip’s increased complexity and shortened design cycle calls for innovation in design and validation. A high quality System-on-Chip creates distinction and position in the market, and validation is the ...The System-on-Chip’s increased complexity and shortened design cycle calls for innovation in design and validation. A high quality System-on-Chip creates distinction and position in the market, and validation is the key to a quality product. Validation consumes >60% of the product cycle. Therefore, validation should be carried out efficiently. Validation must be quantified to aid in determining its quality. Pre-silicon uses various coverage metrics for quantifying the validation. The available on-chip coverage logic limits the use of pre-silicon-like coverage metrics in post-silicon. Although on-chip coverage logic increases observability, it does not contribute to the functional logic;hence, they are controlled and limited. Discounting the need for the on-chip coverage logic, the question to be answered is whether or not these pre-silic-on coverage metrics applicable to post-silicon. We discuss the reasons for limited applicability of pre-silicon coverage metrics in post-silicon. This paper presents a unified SoC post-silicon coverage methodology centered on functional coverage metrics.展开更多
Rapid advancements in information technology push the explosive growth in data volume,requiring greater computing-capability logic circuits.However,conventional computing-capability improving technology,which mainly r...Rapid advancements in information technology push the explosive growth in data volume,requiring greater computing-capability logic circuits.However,conventional computing-capability improving technology,which mainly relies on increasing transistor number,encounters a significant challenge due to the weak field-effect characteristics of bulk siliconbased semiconductors.Still,the ultra-thin layered bodies of two-dimensional transition metal dichalcogenides(2D-TMDCs)materials enable excellent field-effect characteristics and multiple gate control ports,facilitating the integration of the functions of multiple transistors into one.Generally,the computing-capability improvement of the transistor cell in logic circuits will greatly alleviate the challenge in transistor numbers.In other words,one can only use a small number,or even just one,2DTMDCs-based transistors to conduct the sophisticated logic operations that have to be realized by using many traditional transistors.In this review,from material selection,device structure optimization,and circuit architecture design,we discuss the developments,challenges,and prospects for 2D-TMDCs-based logic circuits.展开更多
文摘The System-on-Chip’s increased complexity and shortened design cycle calls for innovation in design and validation. A high quality System-on-Chip creates distinction and position in the market, and validation is the key to a quality product. Validation consumes >60% of the product cycle. Therefore, validation should be carried out efficiently. Validation must be quantified to aid in determining its quality. Pre-silicon uses various coverage metrics for quantifying the validation. The available on-chip coverage logic limits the use of pre-silicon-like coverage metrics in post-silicon. Although on-chip coverage logic increases observability, it does not contribute to the functional logic;hence, they are controlled and limited. Discounting the need for the on-chip coverage logic, the question to be answered is whether or not these pre-silic-on coverage metrics applicable to post-silicon. We discuss the reasons for limited applicability of pre-silicon coverage metrics in post-silicon. This paper presents a unified SoC post-silicon coverage methodology centered on functional coverage metrics.
基金This work was supported by the National Natural Science Foundation of China(51991340,51991342,52225206,92163205,52188101,52142204,62204012,52250398,51972022)the National Key Research and Development Program of China(2018YFA0703503)+4 种基金the Overseas Expertise Introduction Projects for Discipline Innovation(B14003)Beijing Nova Program(20220484145)the Young Elite Scientists Sponsorship Program by CAST(2022QNRC001)the Fundamental Research Funds for the Central Universities(FRF-06500207)the Interdisciplinary Research Project for Young Teachers of USTB(Fundamental Research Funds for the Central Universities,FRF-IDRY-21-008).
文摘Rapid advancements in information technology push the explosive growth in data volume,requiring greater computing-capability logic circuits.However,conventional computing-capability improving technology,which mainly relies on increasing transistor number,encounters a significant challenge due to the weak field-effect characteristics of bulk siliconbased semiconductors.Still,the ultra-thin layered bodies of two-dimensional transition metal dichalcogenides(2D-TMDCs)materials enable excellent field-effect characteristics and multiple gate control ports,facilitating the integration of the functions of multiple transistors into one.Generally,the computing-capability improvement of the transistor cell in logic circuits will greatly alleviate the challenge in transistor numbers.In other words,one can only use a small number,or even just one,2DTMDCs-based transistors to conduct the sophisticated logic operations that have to be realized by using many traditional transistors.In this review,from material selection,device structure optimization,and circuit architecture design,we discuss the developments,challenges,and prospects for 2D-TMDCs-based logic circuits.
