Monolithic integration of resonant tunneling diodes (RTDs) and high electron mobility transistors (HEMTs) is an important development direction of ultra-high speed integrated circuit. A kind of top-RTD and bottom-HEMT...Monolithic integration of resonant tunneling diodes (RTDs) and high electron mobility transistors (HEMTs) is an important development direction of ultra-high speed integrated circuit. A kind of top-RTD and bottom-HEMT material structure is epitaxied on InP substrate through molecular beam epitaxy. Based on wet chemical etching, metal lift-off and air bridge interconnection technology, RTD and HEMT are fabricated simultaneously. The peak-to-valley current ratio of RTD is 7.7 and the peak voltage is 0.33 V at room temperature. The pinch-off voltage is -0.5 V and the current gain cut-frequency is 30 GHz for a 1.0 μm gate length depletion mode HEMT. The two devices are conformable in current magnitude, which is suitable for the construction of various RTD/HEMT monolithic integration logic circuits.展开更多
This paper reports that the structures of AlGaAs/InGaAs high electron mobility transistor （HEMT） and AlAs/GaAs resonant tunnelling diode （RTD） are epitaxially grown by molecular beam epitaxy （MBE） in turn on a G...This paper reports that the structures of AlGaAs/InGaAs high electron mobility transistor （HEMT） and AlAs/GaAs resonant tunnelling diode （RTD） are epitaxially grown by molecular beam epitaxy （MBE） in turn on a GaAs substrate. An Alo.24Gao.76As chair barrier layer, which is grown adjacent to the top AlAs barrier, helps to reduce the valley current of RTD. The peak-to-valley current ratio of fabricated RTD is 4.8 and the transconductance for the 1-μm gate HEMT is 125mS/mm. A static inverter which consists of two RTDs and a HEMT is designed and fabricated. Unlike a conventional CMOS inverter, the novel inverter exhibits self-latching property.展开更多
For the first time, we have introduced a novel GaN based resonant tunneling high electron mobility transistor （RTHEMT） on a silicon substrate. A monolithically integrated GaN based inverted high electron mobility tr...For the first time, we have introduced a novel GaN based resonant tunneling high electron mobility transistor （RTHEMT） on a silicon substrate. A monolithically integrated GaN based inverted high electron mobility transistor （HEMT） and a resonant tunneling diode （RTD） are designed and simulated using the ATLAS simulator and MATLAB in this study. The 10% Al composition in the barrier layer of the GaN based RTD structure provides a peak-to-valtey current ratio of 2.66 which controls the GaN based HEMT performance. Thus the results indicate an improvement in the current-voltage characteristics of the RTHEMT by controlling the gate voltage in this structure. The introduction of silicon as a substrate is a unique step taken by us for this type of RTHEMT structure.展开更多
基金Supported by National Natural Science Foundation of China (No. 60876009)Tianjin Research Program of Application Foundation and Advanced Technology (No. 09JCZDJC16600)
文摘Monolithic integration of resonant tunneling diodes (RTDs) and high electron mobility transistors (HEMTs) is an important development direction of ultra-high speed integrated circuit. A kind of top-RTD and bottom-HEMT material structure is epitaxied on InP substrate through molecular beam epitaxy. Based on wet chemical etching, metal lift-off and air bridge interconnection technology, RTD and HEMT are fabricated simultaneously. The peak-to-valley current ratio of RTD is 7.7 and the peak voltage is 0.33 V at room temperature. The pinch-off voltage is -0.5 V and the current gain cut-frequency is 30 GHz for a 1.0 μm gate length depletion mode HEMT. The two devices are conformable in current magnitude, which is suitable for the construction of various RTD/HEMT monolithic integration logic circuits.
文摘This paper reports that the structures of AlGaAs/InGaAs high electron mobility transistor （HEMT） and AlAs/GaAs resonant tunnelling diode （RTD） are epitaxially grown by molecular beam epitaxy （MBE） in turn on a GaAs substrate. An Alo.24Gao.76As chair barrier layer, which is grown adjacent to the top AlAs barrier, helps to reduce the valley current of RTD. The peak-to-valley current ratio of fabricated RTD is 4.8 and the transconductance for the 1-μm gate HEMT is 125mS/mm. A static inverter which consists of two RTDs and a HEMT is designed and fabricated. Unlike a conventional CMOS inverter, the novel inverter exhibits self-latching property.
基金ENS Project, Department of Electronics and Information Technology (DeitY) Government of India
文摘For the first time, we have introduced a novel GaN based resonant tunneling high electron mobility transistor （RTHEMT） on a silicon substrate. A monolithically integrated GaN based inverted high electron mobility transistor （HEMT） and a resonant tunneling diode （RTD） are designed and simulated using the ATLAS simulator and MATLAB in this study. The 10% Al composition in the barrier layer of the GaN based RTD structure provides a peak-to-valtey current ratio of 2.66 which controls the GaN based HEMT performance. Thus the results indicate an improvement in the current-voltage characteristics of the RTHEMT by controlling the gate voltage in this structure. The introduction of silicon as a substrate is a unique step taken by us for this type of RTHEMT structure.
