Ge is an attractive material for Si-based microelectronics and photonics due to its high carries mobility, pseudo direct bandgap structure, and the compatibility with complementary metal oxide semiconductor （CMOS） p...Ge is an attractive material for Si-based microelectronics and photonics due to its high carries mobility, pseudo direct bandgap structure, and the compatibility with complementary metal oxide semiconductor （CMOS） processes. Based on Ge, Ge on insulator （GOI） not only has these advantages, but also provides strong electronic and optical confinement. Recently, a novel technique to fabricate GOI by rapid melting growth （RMG） has been described. Here, we introduce the RMG technique and review recent efforts and progress in RMG. Firstly, we will introduce process steps of RMG. We will then review the researches which focus on characterizations of the GOI including growth dimension, growth mechanism, growth orientation, concentration distribution, and strain status. Finally, GOI based applications including high performance metal-oxide-semiconductor field effect transistors （MOSFETs） and photodetectors will be discussed. These results show that RMG is a promising technique for growth of high quality GOIs with different characterizations. The GOI grown by RMG is a potential material for the next-generation of integrated circuits and optoelectronic circuits.展开更多
Processing technologies for the mass production of aero and industrial gas turbine engine hot-section components made by the investment casting process are discussed. Howmet Corporation is involved in most of these te...Processing technologies for the mass production of aero and industrial gas turbine engine hot-section components made by the investment casting process are discussed. Howmet Corporation is involved in most of these technologies because of the end-user's desire for a finished part. These technologies include pattern-making (using a variety of wax and plastic materials, rapid prototyping, 'hard' tooling, and wax injection machines), silica-zircon and alumina cores that produce internal passages, shells for very large parts and for use with alloys containing reactive elements, Ni, Co, and Ti alloys that are cleaner than ever before,zirconia, silica, and mullite crucibles;computer-controls,robotics,and the manufacture of vacuum casting furnaces; cleaning and finishing equipment designed to quickly process parts with minimal variation,and post-casting operations including hot isostatic pressing (HIP),heat treating,coating,and machining. These technologies will be discussed along with process capabilities required by today's turbine hot-section component suppliers.展开更多
基金Project supported in part by the National Key Research and Development Program of China(No.2017YFA0206404)the National Natural Science Foundation of China(Nos.61435013,61534005,61534004,61604146)
文摘Ge is an attractive material for Si-based microelectronics and photonics due to its high carries mobility, pseudo direct bandgap structure, and the compatibility with complementary metal oxide semiconductor （CMOS） processes. Based on Ge, Ge on insulator （GOI） not only has these advantages, but also provides strong electronic and optical confinement. Recently, a novel technique to fabricate GOI by rapid melting growth （RMG） has been described. Here, we introduce the RMG technique and review recent efforts and progress in RMG. Firstly, we will introduce process steps of RMG. We will then review the researches which focus on characterizations of the GOI including growth dimension, growth mechanism, growth orientation, concentration distribution, and strain status. Finally, GOI based applications including high performance metal-oxide-semiconductor field effect transistors （MOSFETs） and photodetectors will be discussed. These results show that RMG is a promising technique for growth of high quality GOIs with different characterizations. The GOI grown by RMG is a potential material for the next-generation of integrated circuits and optoelectronic circuits.
文摘Processing technologies for the mass production of aero and industrial gas turbine engine hot-section components made by the investment casting process are discussed. Howmet Corporation is involved in most of these technologies because of the end-user's desire for a finished part. These technologies include pattern-making (using a variety of wax and plastic materials, rapid prototyping, 'hard' tooling, and wax injection machines), silica-zircon and alumina cores that produce internal passages, shells for very large parts and for use with alloys containing reactive elements, Ni, Co, and Ti alloys that are cleaner than ever before,zirconia, silica, and mullite crucibles;computer-controls,robotics,and the manufacture of vacuum casting furnaces; cleaning and finishing equipment designed to quickly process parts with minimal variation,and post-casting operations including hot isostatic pressing (HIP),heat treating,coating,and machining. These technologies will be discussed along with process capabilities required by today's turbine hot-section component suppliers.
