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Deployment of Effective Testing Methodology in Automotive Software Development
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作者 P. Sivakumar B. Vinod +1 位作者 R. S. Sandhya Devi R. Divya 《Circuits and Systems》 2016年第9期2568-2577,共10页
Software development in automotive industry has bestowed greater comforts and conveniences to mankind. A remarkable progress in this field often faces a setback due to minor defects in the software. So there is recurr... Software development in automotive industry has bestowed greater comforts and conveniences to mankind. A remarkable progress in this field often faces a setback due to minor defects in the software. So there is recurring need for standardization and implementation of testing strategies. But the process of creation of test scripts to check if the software created complies with its specifications and requirements is both time- and resource-consuming. Generating a short but effective test suite usually requires a lot of manual work and expert knowledge. Patronizing research work in this field is the need of the hour. This paper solves the problem by using Model-Based Testing where test harness and evaluation are performed economically through automation. Simulink Design Verifier and Reactis are the tools used to carry out this purpose in Adaptive Front Light System. The resulting outputs obtained from Simulink Design Verifier and Reactis using Model-Based Testing prove that short test suites can be generated for the model where full model coverage can be achieved easily through automation. The outputs of these test cases when compared with the expected outputs confirm that the model developed is working as per the requirements. 展开更多
关键词 Model Advisor Model-Based Testing reactis Simulink Design Verifier
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Modification of Sn–1.0Ag–0.5Cu solder using nickel and boron 被引量:1
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作者 Jun-Feng Qu Jun Xu +2 位作者 Qiang Hu Fu-Wen Zhang Shao-Ming Zhang 《Rare Metals》 SCIE EI CAS CSCD 2015年第11期783-788,共6页
Effects of Ni and B additions on the microstructure and growth behavior of the intermetallic compound(IMC) of Sn–1.0Ag–0.5Cu alloys(SAC105) were investigated in this study. Results show that microadditions of Ni and... Effects of Ni and B additions on the microstructure and growth behavior of the intermetallic compound(IMC) of Sn–1.0Ag–0.5Cu alloys(SAC105) were investigated in this study. Results show that microadditions of Ni and B result in volume fraction of primary Sn increasing and the grain size decreasing observably. It is found that a large number of fine reinforcement particles with network-like shape are found in the solder, and the thickness of interfacial IMC layer in the solder joint is grew less than that of SAC105 with longer aging time. Shear test results reveal that as-soldered solder joints of microalloyed SAC105 have better shear strength than that of SAC105 solder alloy. 展开更多
关键词 Lead-free solder Sn–1.0Ag–0.5Cu Interfacial reacti
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