The study of lithographic variation in resistive random access memory

Reducing the process variation is a significant concern for resistive random access memory(RRAM).Due to its ultrahigh integration density,RRAM arrays are prone to lithographic variation during the lithography process,introducing electrical variation among different RRAM devices.In this work,an optical physical verification methodology for the RRAM array is developed,and the effects of different layout parameters on important electrical characteristics are systematically investigated.The results indicate that the RRAM devices can be categorized into three clusters according to their locations and lithography environments.The read resistance is more sensitive to the locations in the array(~30%)than SET/RESET voltage(<10%).The increase in the RRAM device length and the application of the optical proximity correction technique can help to reduce the variation to less than 10%,whereas it reduces RRAM read resistance by 4×,resulting in a higher power and area consumption.As such,we provide design guidelines to minimize the electrical variation of RRAM arrays due to the lithography process.

Advances of embedded resistive random access memory in industrial manufacturing and its potential applications

Embedded memory,which heavily relies on the manufacturing process,has been widely adopted in various industrial applications.As the field of embedded memory continues to evolve,innovative strategies are emerging to enhance performance.Among them,resistive random access memory(RRAM)has gained significant attention due to its numerousadvantages over traditional memory devices,including high speed(<1 ns),high density(4 F^(2)·n^(-1)),high scalability(~nm),and low power consumption(~pJ).This review focuses on the recent progress of embedded RRAM in industrial manufacturing and its potentialapplications.It provides a brief introduction to the concepts and advantages of RRAM,discusses the key factors that impact its industrial manufacturing,and presents the commercial progress driven by cutting-edge nanotechnology,which has been pursued by manysemiconductor giants.Additionally,it highlights the adoption of embedded RRAM in emerging applications within the realm of the Internet of Things and future intelligent computing,with a particular emphasis on its role in neuromorphic computing.Finally,the review discusses thecurrent challenges and provides insights into the prospects of embedded RRAM in the era of big data and artificial intelligence.

Resistive switching characteristic and uniformity of low-power HfO_x-based resistive random access memory with the BN insertion layer

In this letter,the Ta/HfO/BN/TiN resistive switching devices are fabricated and they exhibit low power consumption and high uniformity each.The reset current is reduced for the HfO/BN bilayer device compared with that for the Ta/HfO/TiN structure.Furthermore,the reset current decreases with increasing BN thickness.The HfOlayer is a dominating switching layer,while the low-permittivity and high-resistivity BN layer acts as a barrier of electrons injection into TiN electrode.The current conduction mechanism of low resistance state in the HfO/BN bilayer device is space-chargelimited current(SCLC),while it is Ohmic conduction in the HfOdevice.

Thermal stability and data retention of resistive random access memory with HfOx/ZnO double layers

As an industry accepted storage scheme, hafnium oxide（HfO_x） based resistive random access memory（RRAM）should further improve its thermal stability and data retention for practical applications. We therefore fabricated RRAMs with HfO_x/ZnO double-layer as the storage medium to study their thermal stability as well as data retention. The HfO_x/ZnO double-layer is capable of reversible bipolar switching under ultralow switching current（〈 3 μA） with a Schottky emission dominant conduction for the high resistance state and a Poole–Frenkel emission governed conduction for the low resistance state. Compared with a drastically increased switching current at 120℃ for the single HfO_x layer RRAM, the HfO_x/ZnO double-layer exhibits excellent thermal stability and maintains neglectful fluctuations in switching current at high temperatures（up to 180℃）, which might be attributed to the increased Schottky barrier height to suppress current at high temperatures. Additionally, the HfO_x/ZnO double-layer exhibits 10-year data retention @85℃ that is helpful for the practical applications in RRAMs.

Analysis and modeling of resistive switching mechanisms oriented to resistive random-access memory

With the progress of the semiconductor industry,the resistive random-access memory（RAM） has drawn increasing attention.The discovery of the memristor has brought much attention to this study.Research has focused on the resistive switching characteristics of different materials and the analysis of resistive switching mechanisms.We discuss the resistive switching mechanisms of different materials in this paper and analyze the differences of those mechanisms from the view point of circuitry to establish their respective circuit models.Finally,simulations are presented.We give the prospect of using different materials in resistive RAM on account of their resistive switching mechanisms,which are applied to explain their resistive switchings.

Carbon-based memristors for resistive random access memory and neuromorphic applications

As a typical representative of nanomaterials,carbon nanomaterials have attracted widespread attention in the construction of electronic devices owing to their unique physical and chemical properties,multi-dimensionality,multi-hybridization methods,and excellent electronic properties.Especially in the recent years,memristors based on carbon nanomaterials have flourished in the field of building non-volatile memory devices and neuromorphic applications.In the current work,the preparation methods and structural characteristics of carbon nanomaterials of different dimensions were systematically reviewed.Afterwards,in depth discussion on the structural characteristics and working mechanism of memristors based on carbon nanomaterials of different dimensions was conducted.Finally,the potential applications of carbon-based memristors in logic operations,neural network construction,artificial vision systems,artificial tactile systems,and multimodal perception systems were also introduced.It is believed that this paper will provide guidance for the future development of high-quality information storage,high-performance neuromorphic applications,and highsensitivity bionic sensing based on carbon-based memristors.

基于28 nm RRAM的可重构真随机数发生器

基于阻变存储器(RRAM)电流饥饿型环形振荡器的真随机数发生器(TRNG)方案,提出交替读写的操作模式,优化熵源重构机制.针对现有RRAM在多操作周期下跨导线性化问题,提出熵可配置电阻窗口钳位电路.通过减小电阻窗口获得RRAM非线性的最大化,所提电路能够有效避免RRAM出现过度置位、过度复位的现象,保证熵源稳定性.基于UMC 28 nm HKMG工艺对TRNG进行流片.输出数据统计性测试结果通过了NIST SP800-22所有测试集的真随机数标准测试.检测结果表明,在高斯分布的95%置信区间,所有统计数据的自相关函数值均落在-0.003~0.003,输出序列具有良好的随机性.

Graphene resistive random memory - the promising memory device in next generation

Graphene-based resistive random access memory （GRRAM） has grasped researchers＇ attention due to its merits com- pared with ordinary RRAM. In this paper, we briefly review different types of GRRAMs. These GRRAMs can be divided into two categories： graphene RRAM and graphene oxide （GO）/reduced graphene oxide （rGO） RRAM. Using graphene as the electrode, GRRAM can own many good characteristics, such as low power consumption, higher density, transparency, SET voltage modulation, high uniformity, and so on. Graphene flakes sandwiched between two dielectric layers can lower the SET voltage and achieve multilevel switching. Moreover, the GRRAM with rGO and GO as the dielectric or electrode can be simply fabricated. Flexible and high performance RRAM and GO film can be modified by adding other materials layer or making a composite with polymer, nanoparticle, and 2D materials to further improve the performance. Above all, GRRAM shows huge potential to become the next generation memory.

基于GA-DNN模型的RRAM数据自动化分析系统

为了整合RRAM器件的测试数据,提升RRAM器件性能探知效率,构建了一套适用于RRAM测试数据分析和可视化的Web系统。结合Set和Reset操作的测试数据,提出一种GA-DNN模型算法,用于预测RRAM器件操作电压,从而为相同测试条件的实验提供可信的预测范围。相比于BPNN模型和CNN模型,在测试集相对误差小于15%的评估条件下,GA-DNN模型使得Set电压的预测精度分别提升了11.38%和2.33%;同时,Reset电压的预测精度分别提升了9.25%和2.54%。最终,系统采用B/S架构、Vue.js前端框架和Django后端框架建立了前后端分离的RRAM器件测试数据分析系统。该系统可进行RRAM器件的测试数据统计、可视化分析以及测试电压预测。

Effect of Pulse and dc Formation on the Performance of One-Transistor and One-Resistor Resistance Random Access Memory Devices

We investigate the effect of the formation process under pulse and dc modes on the performance of one transistor and one resistor （1 T1R） resistance random access memory （RRAM） device. All the devices are operated under the same test conditions, except for the initial formation process with different modes. Based on the statistical results, the high resistance state （FIRS） under the dc forming mode shows a lower value with better distribution compared with that under the pulse mode. One of the possible reasons for such a phenomenon originates from different properties of conductive filament （CF） formed in the resistive switching layer under two different modes. For the dc forming mode, the formed filament is thought to be continuous, which is hard to be ruptured, resulting in a lower HRS. However, in the case of pulse forming, the filament is discontinuous where the transport mechanism is governed by hopping. The low resistance state （LRS） can be easily changed by removing a few trapping states from the conducting path. Hence, a higher FIRS is thus observed. However, the HRS resistance is highly dependent on the length of the gap opened. A slight variation of the gap length will cause wide dispersion of resistance.

Effects of Film Thickness and Ar/O2 Ratio on Resistive Switching Characteristics of HfOx-Based Resistive-Switching Random Access Memories

Cu/HfOx/n^＋Si devices are fabricated to investigate the influence of technological parameters including film thickness and Ar/02 ratio on the resistive switching （RS） characteristics of HfOx films, in terms of switch ratio, endurance properties, retention time and multilevel storage. It is revealed that the RS characteristics show strong dependence on technological parameters mainly by altering the defects （oxygen vacancies） in the film. The sample with thickness of 2Onto and Ar/O2 ratio of 12：3 exhibits the best RS behavior with the potential of multilevel storage. The conduction mechanism of all the films is interpreted based on the filamentary model.

Improved resistive switching stability of Pt/ZnO/CoO_x /ZnO/Pt structure for nonvolatile memory devices

For Pt(Ag)/ZnO single-layer/Pt structure,random 10 formation and rupture of conductive filaments composed by oxygen vacancies or metallic ions often cause dispersion problems of resistive switching(RS)parameters,which is disadvantageous to devices application.In this study,ZnO/CoOx/ZnO(ZCZ)tri-layers were utilized as the switching layers to investigate their RS properties as compared with ZnO-based single-layer devices.It is interestingly noted that Pt/ZCZ/Pt devices show quite stable bipolar RS behaviors with little resistance value fluctuations compared to Ag/ZCZ/Pt devices and Pt(Ag)/ZnO/Pt devices,which minimize the dispersion of the resistances of RS.This highly stable RS effect of Pt/ZCZ/Pt structure would be promising for high density memory devices.

Resistive switching characteristics of Ti/ZrO_2/Pt RRAM device

In this paper, the bipolar resistive switching characteristic is reported in Ti/ZrO2/Pt resistive switching memory de- vices. The dominant mechanism of resistive switching is the formation and rupture of the conductive filament composed of oxygen vacancies. The conduction mechanisms for low and high resistance states are dominated by the ohmic conduc- tion and the trap-controlled space charge limited current （SCLC） mechanism, respectively. The effect of a set compliance current on the switching parameters is also studied： the low resistance and reset current are linearly dependent on the set compliance current in the log-log scale coordinate; and the set and reset voltage increase slightly with the increase of the set compliance current. A series circuit model is proposed to explain the effect of the set compliance current on the resistive switching behaviors.

Investigation of resistive switching behaviours in WO_3-based RRAM devices

In this paper, a WO3-based resistive random access memory device composed of a thin film of WO3 sandwiched between a copper top and a platinum bottom electrodes is fabricated by electron beam evaporation at room temperature. The reproducible resistive switching, low power consumption, multilevel storage possibility, and good data retention characteristics demonstrate that the Cu/WO3/Pt memory device is very promising for future nonvolatile memory applications. The formation and rupture of localised conductive filaments is suggested to be responsible for the observed resistive switching behaviours.

Analysis of tail bits generation of multilevel storage in resistive switching memory

The tail bits of intermediate resistance states（IRSs） achieved in the SET process（IRSS） and the RESET process（IRSR） of conductive-bridge random-access memory were investigated. Two types of tail bits were observed, depending on the filament morphology after the SET/RESET operation.（i） Tail bits resulting from lateral diffusion of Cu ions introduced an abrupt increase of device resistance from IRS to ultrahigh-resistance state, which mainly happened in IRSS.（ii） Tail bits induced by the vertical diffusion of Cu ions showed a gradual shift of resistance toward lower value. Statistical results show that more than 95% of tail bits are generated in IRSS. To achieve a reliable IRS for multilevel cell（MLC） operation, it is desirable to program the IRS in RESET operation. The mechanism of tail bit generation that is disclosed here provides a clear guideline for the data retention optimization of MLC resistive random-access memory cells.

Electric-field control of perpendicular magnetic anisotropy by resistive switching via electrochemical metallization

Electric-field control of perpendicular magnetic anisotropy(PMA) is a feasible way to manipulate perpendicular magnetization,which is of great importance for realizing energy-efficient spintronics.Here,we propose a novel approach to accomplish this task at room temperature by resistive switching(RS) via electrochemical metallization(ECM) in a device with the stack of Si/SiO_(2)/Ta/Pt/Ag/Mn-doped ZnO(MZO)/Pt/Co/Pt/ITO.By applying certain voltages,the device could be set at high-resistance-state(HRS) and low-resistance-state(LRS),accompanied with a larger and a smaller coercivity(H_(C)),respectively,which demonstrates a nonvolatile E-field control of PMA.Based on our previous studies and the present control experiments,the electric modulation of PMA can be briefly explained as follows.At LRS,the Ag conductive filaments form and pass through the entire MZO layer and finally reach the Pt/Co/Pt sandwich,leading to weakening of PMA and reduction of H_(C).In contrast,at HRS,most of the Ag filaments dissolve and leave away from the Pt/Co/Pt sandwich,causing partial recovery of PMA and an increase of H_(C).This work provides a new clue to designing low-power spintronic devices based on PMA films.

Ag掺杂TiO_(2)阻变特性的理论研究

阻变随机存储器(RRAM)是一种非易失性存储器。相比于传统的存储器,阻变随机存储器的读写速度和存储性能都实现了重大突破,是公认的新一代主流存储器。但是以TiO_(2)等金属氧化物为衬底的阻变随机存储器还存在阻变机制不清楚的问题。采用基于密度泛函理论的第一性原理,研究了Ag掺杂TiO_(2)的阻变特性,研究表明[001]、[110]、[011]、[111]四个方向的形成能和表面能均为负,最容易沉积形成表面。[011]、[111]方向最高势能面最大,电荷容易集聚,临界势能面同样最大,容易形成导电细丝。同时[011]、[111]方向的扩散势垒最小,容易形成导电通道。[011]和[111]方向的禁带宽度明显小于[001]和[110]方向,且存在明显的轨道杂化,容易在特定方向形成导电细丝。[011][111]两个方向上的电子和空穴有效质量约为[001][110]两个方向的2/3,而迁移率约为[001][110]方向的1.5~2倍,因此在外电场作用下更容易形成导电细丝。[011]和[111]方向电导率增长迅速,是实现阻变特性的理想方向。本文的研究结果可为改善以TiO_(2)为衬底的阻变随机存储器的性能提供理论指导。

Low-operation voltage conductive-bridge random access memory based on amorphous NbS_(2)

Amorphous NbS_(2)was proposed as the resistive switching(RS)layer for conductive-bridge random access memory(CBRAM)for the first time,with Cu and Au as the top and bottom electrodes,respectively.NbS_(2)films were prepared at room temperature,which exhibited an amorphous structure and did not crystalize even annealed at 500°C,showing good thermal stability.The amorphous NbS_(2)CBRAM devices present stable bipolar non-volatile RS characteristics.Repetitive RS behavior is demonstrated in amorphous NbS_(2)CBRAMs.The operating voltage during all RS cycles is less than 1 V,demonstrating that the NbS_(2)CBRAM is a low-operation voltage memory device.The distribution of the high and low resistive state resistance is relatively concentrated,and the on-off ratio has been kept above 100,offering a sufficient data read/write window.The formation and fracture of the Cu metal conductive filament is considered to be the RS mechanism by analyzing the dependence of current and voltage in logarithmic coordinates.Our study demonstrated that amorphous NbS_(2)is a promising material for lowoperation voltage CBRAM.

基于苯并噻二唑的共轭高分子材料的合成及其阻变存储性能

设计合成了一种新的基于苯并噻二唑的电子给体(D)-电子受体(A)型高分子阻变存储材料聚{[4,4′-(2,7-二苯基-9H-芴-9,9-二基)双(N,N-二苯基氨)]-alt-[4,7-双(4-正十二烷基-5-乙烯基噻吩-2-基)-苯并[c][1,2,5]噻二唑]}(PFVT)。以PFVT为活性材料制备的Al/PFVT/ITO(ITO:氧化铟锡)器件在室温下展现了非易失性阻变存储(RRAM)性能。器件经过50次开启、关闭循环操作,获得的平均开启和关闭电压分别为(-0.54±0.01) V和(2.42±0.05) V,电流开/关比为1.50×103。在循环操作期间的编程电压变化小于2.1%,器件展现出优良的可靠性。经200℃退火处理后,薄膜材料的结晶性增加,器件的平均开启和关闭电压减小,分别为(-0.49±0.01) V和(2.27±0.02) V。器件存储机制归属于电场诱导的分子内电荷转移。利用空间电荷限制电流模型和欧姆电流模型可以分别完美拟合OFF态和ON态电流。为了比较,用苯环替代高分子结构中的9,9-二(4-二苯胺基苯基)-芴单元,合成了聚{4-(4-十二烷基-5-(4-甲基苯乙烯基)噻吩-2-基)-7-(4-十二烷基-5-(丙烯-1-基)噻吩-2-基)苯并[c][1,2,5]噻二唑}(PPVT),该材料展现出类似的阻变存储性能。与PFVT相比,PPVT的开启电压明显变大,而电流开/关比则小了一个数量级,用苯环取代大体积芴单元后材料的热稳定性急剧下降,带隙增大。

基于RRAM的混合存储模型

传统的DRAM受其存储密度、工艺尺寸限制已不能满足大数据时代对海量信息存储的需求。针对这一问题,提出一种混合存储模型。在传统内存结构的基础上,引入阻变存储器(RRAM)作为同级存储设备,利用其存储密度高、扩展性强、非易失性等特性提高内存系统的容量和可靠性。通过构建混合内存控制器,合理分发请求,利用DRAM快速的写效率特性弥补新型存储器写延迟的缺点。在测试集PARSEC下对混合内存系统的读写性能进行测试与分析,验证了混合存储模型有效性。