Metamaterial devices(metadevices)have been developed in progress aiming to generate extraordinary performance over traditional de-vices in the(sub-)terahertz(THz)domain,and their planar integra-tion with complementary...Metamaterial devices(metadevices)have been developed in progress aiming to generate extraordinary performance over traditional de-vices in the(sub-)terahertz(THz)domain,and their planar integra-tion with complementary-metal-oxide-semiconductor(CMOS)cir-cuits pave a new way to build miniature silicon plasmonics that over-comes existing challenges in chip-to-chip communication.In an effort towards low-power,crosstalk-tolerance,and high-speed data link for future exascale data centers,this article reviews the recent progress on two metamaterials,namely,the spoof surface plasmon polaritons(SPPs),and the split-ring resonator(SRR),as well as their imple-mentations in silicon,focusing primarily on their fundamental the-ories,design methods,and implementations for future THz commu-nications.Owing to their respective dispersion characteristic at THz,these two metadevices are highly expected to play an important role in miniature integrated circuits and systems toward compact size,dense integration,and outstanding performance.A design example of a fully integrated sub-THz CMOS silicon plasmonic system integrating these two metadevices is provided to demonstrate a dual-channel crosstalk-tolerance and energy-efficient on-off keying(OOK)communication system.Future directions and potential applications for THz metade-vices are discussed.展开更多
基金supported by National Natural Science Founda-tion of China(NSFC)(Key Program Grant No.62034007)the Key-Area Research and Development Program of Guangdong Province(Grant No.2019B010116002)+3 种基金Guangdong Basic and Applied Basic Research Founda-tion(Grant 2019B1515120024)Shenzhen Science and Technology Program(Grant No.KQTD20200820113051096)supported by Na-tional Natural Science Foundation of China under Grant 62101122Natural Science Foundation of Jiangsu Province under Grant BK20210212.
文摘Metamaterial devices(metadevices)have been developed in progress aiming to generate extraordinary performance over traditional de-vices in the(sub-)terahertz(THz)domain,and their planar integra-tion with complementary-metal-oxide-semiconductor(CMOS)cir-cuits pave a new way to build miniature silicon plasmonics that over-comes existing challenges in chip-to-chip communication.In an effort towards low-power,crosstalk-tolerance,and high-speed data link for future exascale data centers,this article reviews the recent progress on two metamaterials,namely,the spoof surface plasmon polaritons(SPPs),and the split-ring resonator(SRR),as well as their imple-mentations in silicon,focusing primarily on their fundamental the-ories,design methods,and implementations for future THz commu-nications.Owing to their respective dispersion characteristic at THz,these two metadevices are highly expected to play an important role in miniature integrated circuits and systems toward compact size,dense integration,and outstanding performance.A design example of a fully integrated sub-THz CMOS silicon plasmonic system integrating these two metadevices is provided to demonstrate a dual-channel crosstalk-tolerance and energy-efficient on-off keying(OOK)communication system.Future directions and potential applications for THz metade-vices are discussed.
