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短沟道CMOS/SIMOX器件与电路的制造
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作者 张兴 李映雪 +2 位作者 奚雪梅 王阳元 石涌泉 《微电子学与计算机》 CSCD 北大核心 1995年第2期22-24,共3页
本文简要介绍短沟道CMOS/SIMOX器件与电路的研制。在自制的SIMOX材料上成功地制出了沟道长度为1.0μm的高性能全耗尽SIMOX器件和19级CMOS环形振荡器。N管和P管的泄漏电流均小于1×10-12A/... 本文简要介绍短沟道CMOS/SIMOX器件与电路的研制。在自制的SIMOX材料上成功地制出了沟道长度为1.0μm的高性能全耗尽SIMOX器件和19级CMOS环形振荡器。N管和P管的泄漏电流均小于1×10-12A/μm,在电源电压为5V时环振电路的门延迟时间为280ps。 展开更多
关键词 CMOS器件 simox器件 集成电路 制造
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A STUDY ON HOT-CARRIER-INDUCED GATE OXIDE BREAKDOWN IN PARTIALLY DEPLETED SIMOX MOSFET'S
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作者 Liu Hongxia Hao Yue Zhu Jiangang (Microelectronics Institute, Xidian University, Xi’an 710071) 《Journal of Electronics(China)》 2002年第1期50-56,共7页
The hot-carrier-induced oxide regions in the front and back interfaces are systematically studied for partially depleted SOI MOSFET's. The gate oxide properties are investigated for channel hot-carrier effects. Th... The hot-carrier-induced oxide regions in the front and back interfaces are systematically studied for partially depleted SOI MOSFET's. The gate oxide properties are investigated for channel hot-carrier effects. The hot-carrier-induced device degradations are analyzed using stress experiments with three typical hot-carrier injection, i.e., the maximum gate current, maximum substrate current and parasitic bipolar transistor action. Experiments show that PMOSFET's degradation is caused by hot carriers injected into the drain side of the gate oxide and the types of trapped hot carrier depend on the bias conditions, and NMOSFET's degradation is caused by hot holes. This paper reports for the first time that the electric characteristics of NMOSFET's and PMOSFET's are significantly different after the gate oxide breakdown, and an extensive discussion of the experimental findings is provided. 展开更多
关键词 Hot-Carrier Effects (HCE) Device lifetime SOI MOSFET simox
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