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An Irregular Wave Maker of Active Absorption with VOF Method 被引量:4
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作者 任冰 李雪临 王永学 《China Ocean Engineering》 SCIE EI 2008年第4期623-634,共12页
A numerical irregular wave flume with active absorption of re-reflected waves is simulated by use of volume of fluid (VOF) method. An active 'absorbing wave-maker based on linear wave theory is set on the left boun... A numerical irregular wave flume with active absorption of re-reflected waves is simulated by use of volume of fluid (VOF) method. An active 'absorbing wave-maker based on linear wave theory is set on the left boundary of the wave flume. The progressive waves and the absorbing waves are generated simultaneously at the active wave generating-absorbing boundary. The absorbing waves are generated to eliminate the waves coming back to the generating boundary due to reflection from the outflow boundary and the structures. SIRW method proposed by Frigaard and Brorsen (1995) is used to separate the incident waves and reflected waves. The digital filters are designed based on the surface elevation signals of the two wave gauges. The corrected velocity of the wave-maker paddle is the output from the digital filter in real time. The numerical results of regular and irregular waves by the active absorbing-generating boundary are compared with the numerical results by the ordinary generating boundary to verify the performance of the active absorbing-generator boundary. The differences between the initial incident waves and the estimated incident waves are analyzed. 展开更多
关键词 VOF irregular wave sirw method active absorbing wave-maker
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基片集成脊波导毫米波板间垂直互联结构研究 被引量:4
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作者 张凯 《微波学报》 CSCD 北大核心 2017年第3期86-88,92,共4页
在毫米波系统级封装(System-On-Package,SOP)中,需要一种宽带、小型化、易集成的板间垂直互联电路,以实现不同功能层之间毫米波信号的可靠互联。不同于常规基片集成波导(SIW),提出一种基于Z向基片集成脊波导(Substrate-Integrated-Riged... 在毫米波系统级封装(System-On-Package,SOP)中,需要一种宽带、小型化、易集成的板间垂直互联电路,以实现不同功能层之间毫米波信号的可靠互联。不同于常规基片集成波导(SIW),提出一种基于Z向基片集成脊波导(Substrate-Integrated-Riged-Waveguide,SIRW)的毫米波板间垂直互联结构。该结构体积小、易集成,可与多层基板加工工艺兼容、一体化同步实现。最后利用低温共烧陶瓷(Low Temperature Co-fired Ceramic,LTCC)加工工艺,制作了背靠背互联实物,电路接口尺寸2.2 mm×1.3 mm,经测试在28~36 GHz频带内实现单个互联插损小于0.45dB,带内平坦度优于±0.5 dB,回波损耗优于-12 dB。 展开更多
关键词 系统级封装 毫米波 基片集成脊波导 垂直互联
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