Hermetic packaging is often an essential requirement to enable proper functionality throughout the device＇s lifetime and ensure the optimal performance of a micro electronic mechanical system （MEMS） device. Solid-l...Hermetic packaging is often an essential requirement to enable proper functionality throughout the device＇s lifetime and ensure the optimal performance of a micro electronic mechanical system （MEMS） device. Solid-liquid interdiffusion （SLID） bonding is a novel and attractive way to encapsulate MEMS devices at a wafer level. SLID bonding utilizes a low-melting-point metal to reduce the bonding process temperature; and metallic seal rings take out less of the valuable surface area and have a lower gas permeability compared to polymer or glass- based sealing materials. In addition, ductile metals can adopt mechanical and thermo-mechanical stresses during their service lifetime, which improves their reliability. In this study, the principles of Au-Sn and Cu-Sn SLID bonding are presented, which are meant to be used for wafer-level hermetic sealing of MEMS resonators. Seal rings in 15.24 cm silicon wafers were bonded at a width of 60 gin, electroplated, and used with Au-Sn and Cu-Sn layer structures. The wafer bonding temperature varied between 300 ℃ and 350 ℃, and the bonding force was 3.5 kN under the ambient pressure, that is, it was less than 0.1 Pa. A shear test was used to compare the mechanical properties of the interconnections between both material systems, in addition, important factors pertaining to bond ring design are discussed according to their effects on the failure mechanisms. The results show that the design ofmetal structures can significantly affect the reliability of bond rings.展开更多
This paper considers setting different dips for different sub-faults to fit the actual rupture situation based on the fault rupture of the 2013 Lushan M_(S)7.0 earthquake.Meanwhile,combined with the coseismic GNSS dat...This paper considers setting different dips for different sub-faults to fit the actual rupture situation based on the fault rupture of the 2013 Lushan M_(S)7.0 earthquake.Meanwhile,combined with the coseismic GNSS data of the Lushan earthquake,the source parameters and sliding distribution of the Lushan earthquake fault are inversed.Firstly,we use the gradient based optimizer(GBO)in nonlinear inversion to obtain the source parameters of this seismic fault.The inversion results indicate that the strike of the fault is 206.52°,the dip is 44.10°,the length is 21.92 km,and the depth is 12.79 km.To refine the sliding distribution of the seismic fault,the seismic fault is divided into 3×3 sub-faults.Then,we fix the central sub-fault dip of 44.10°;the dip of other sub-faults is obtained by iteration.After that,the model is further divided into a fault layer model composed of 23×19 sub fault slices,and using the Matlab fitting function is used to fit the dip of the 23×19 sub faults.Finally,the Lushan seismic fault plane is established as a shovel structure with steep upper and gentle lower,steep south and gentle north.The slip distribution inversion results indicate that the depth of the slip peak is 13 km,the corresponding maximum slip momentum is 0.67 m,the seismic moment is 1.10×10^(19)N·m and the corresponding moment magnitude is MW6.66.The results above are consistent with the research results of seismology.展开更多
基金This work has been carried out as part of a Tekes Project:Real_metal(Grants Nos.40009/12,40010/12)the Finnish Funding Agency for Technology and Innovation(Tekes),Okmetic Oyj,and Murata Electronics for funding
文摘Hermetic packaging is often an essential requirement to enable proper functionality throughout the device＇s lifetime and ensure the optimal performance of a micro electronic mechanical system （MEMS） device. Solid-liquid interdiffusion （SLID） bonding is a novel and attractive way to encapsulate MEMS devices at a wafer level. SLID bonding utilizes a low-melting-point metal to reduce the bonding process temperature; and metallic seal rings take out less of the valuable surface area and have a lower gas permeability compared to polymer or glass- based sealing materials. In addition, ductile metals can adopt mechanical and thermo-mechanical stresses during their service lifetime, which improves their reliability. In this study, the principles of Au-Sn and Cu-Sn SLID bonding are presented, which are meant to be used for wafer-level hermetic sealing of MEMS resonators. Seal rings in 15.24 cm silicon wafers were bonded at a width of 60 gin, electroplated, and used with Au-Sn and Cu-Sn layer structures. The wafer bonding temperature varied between 300 ℃ and 350 ℃, and the bonding force was 3.5 kN under the ambient pressure, that is, it was less than 0.1 Pa. A shear test was used to compare the mechanical properties of the interconnections between both material systems, in addition, important factors pertaining to bond ring design are discussed according to their effects on the failure mechanisms. The results show that the design ofmetal structures can significantly affect the reliability of bond rings.
基金funded by the National Natural Science Foundation of China(42174011)。
文摘This paper considers setting different dips for different sub-faults to fit the actual rupture situation based on the fault rupture of the 2013 Lushan M_(S)7.0 earthquake.Meanwhile,combined with the coseismic GNSS data of the Lushan earthquake,the source parameters and sliding distribution of the Lushan earthquake fault are inversed.Firstly,we use the gradient based optimizer(GBO)in nonlinear inversion to obtain the source parameters of this seismic fault.The inversion results indicate that the strike of the fault is 206.52°,the dip is 44.10°,the length is 21.92 km,and the depth is 12.79 km.To refine the sliding distribution of the seismic fault,the seismic fault is divided into 3×3 sub-faults.Then,we fix the central sub-fault dip of 44.10°;the dip of other sub-faults is obtained by iteration.After that,the model is further divided into a fault layer model composed of 23×19 sub fault slices,and using the Matlab fitting function is used to fit the dip of the 23×19 sub faults.Finally,the Lushan seismic fault plane is established as a shovel structure with steep upper and gentle lower,steep south and gentle north.The slip distribution inversion results indicate that the depth of the slip peak is 13 km,the corresponding maximum slip momentum is 0.67 m,the seismic moment is 1.10×10^(19)N·m and the corresponding moment magnitude is MW6.66.The results above are consistent with the research results of seismology.
