The intermetallic compound (IMC) is hard and brittle,and its forming and growth at soldering joint interface is an important issue in joint reliability.The data obtained by digital optical electronic microscope indica...The intermetallic compound (IMC) is hard and brittle,and its forming and growth at soldering joint interface is an important issue in joint reliability.The data obtained by digital optical electronic microscope indicate that the addition of element Co changes the IMC morphology from ball-like and bar-like to distinct and sharp in crest lines and edges.The addition of elements Ni and Co in Sn-3Ag-0.5Cu solder promotes the nucleation and makes the IMC size finer.The electron probe microanalysis (EPMA) determines the chemical compositions and confirms that the IMC is changed into the (Cu,Co,Ni)6Sn5+(Cu,Co,Ni)3Sn4 mixed type from the type of Cu6Sn5 with the elements Ni and Co in the solder.展开更多
In the as-cast Ti-55 alloy, the intragranular rare earth-rich phase particles are about 1. 0～14 μm in diameter, elliptical, and rich in Nd, Sn, and O. The contents of Nd and Sn on the grain boundaries are higher th...In the as-cast Ti-55 alloy, the intragranular rare earth-rich phase particles are about 1. 0～14 μm in diameter, elliptical, and rich in Nd, Sn, and O. The contents of Nd and Sn on the grain boundaries are higher than those at other sites. The intragranular phases grow preferably at the region on the grain boundaries, which causes the formation of the elliptical morphology of the intragranular phases.展开更多
文摘研究了在Cu-9.5Ni-2.3Sn合金中添加质量分数为0.15%的Si后对该合金铸态及时效态微观组织、电导率和硬度的影响.结果表明:添加0.15%的Si后,合金出现发达的树枝状晶体,且有Ni_2Si、Ni_3Si、Ni_3Sn和Ni_4Sn相出现.经400℃×4 h时效处理后,Ni_2Si、Ni_3Si相的析出使得合金得到强化.合金电导率随时效时间的延长和温度的提高而升高,硬度在时效初期随时效温度的提高和时效时间的延长而提高,在430℃时效2 h和在400℃时效8 h得到峰值,较佳时效工艺为400℃×8 h.
文摘The intermetallic compound (IMC) is hard and brittle,and its forming and growth at soldering joint interface is an important issue in joint reliability.The data obtained by digital optical electronic microscope indicate that the addition of element Co changes the IMC morphology from ball-like and bar-like to distinct and sharp in crest lines and edges.The addition of elements Ni and Co in Sn-3Ag-0.5Cu solder promotes the nucleation and makes the IMC size finer.The electron probe microanalysis (EPMA) determines the chemical compositions and confirms that the IMC is changed into the (Cu,Co,Ni)6Sn5+(Cu,Co,Ni)3Sn4 mixed type from the type of Cu6Sn5 with the elements Ni and Co in the solder.
文摘In the as-cast Ti-55 alloy, the intragranular rare earth-rich phase particles are about 1. 0～14 μm in diameter, elliptical, and rich in Nd, Sn, and O. The contents of Nd and Sn on the grain boundaries are higher than those at other sites. The intragranular phases grow preferably at the region on the grain boundaries, which causes the formation of the elliptical morphology of the intragranular phases.
