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Enhanced Electrical Properties of Bi_(2−x)Sb_(x)Te_(3)Nanoflake Thin Films Through Interface Engineering
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作者 Xudong Wu Junjie Ding +8 位作者 Wenjun Cui Weixiao Lin Zefan Xue Zhi Yang Jiahui Liu Xiaolei Nie Wanting Zhu Gustaaf Van Tendeloo Xiahan Sang 《Energy & Environmental Materials》 SCIE EI CAS CSCD 2024年第6期359-366,共8页
The structure–property relationship at interfaces is difficult to probe for thermoelectric materials with a complex interfacial microstructure.Designing thermoelectric materials with a simple,structurally-uniform int... The structure–property relationship at interfaces is difficult to probe for thermoelectric materials with a complex interfacial microstructure.Designing thermoelectric materials with a simple,structurally-uniform interface provides a facile way to understand how these interfaces influence the transport properties.Here,we synthesized Bi_(2−x)Sb_(x)Te_(3)(x=0,0.1,0.2,0.4)nanoflakes using a hydrothermal method,and prepared Bi_(2−x)Sb_(x)Te_(3)thin films with predominantly(0001)interfaces by stacking the nanoflakes through spin coating.The influence of the annealing temperature and Sb content on the(0001)interface structure was systematically investigated at atomic scale using aberration-corrected scanning transmission electron microscopy.Annealing and Sb doping facilitate atom diffusion and migration between adjacent nanoflakes along the(0001)interface.As such it enhances interfacial connectivity and improves the electrical transport properties.Interfac reactions create new interfaces that increase the scattering and the Seebeck coefficient.Due to the simultaneous optimization of electrical conductivity and Seebeck coefficient,the maximum power factor of the Bi_(1.8)Sb_(0.2)Te_(3)nanoflake films reaches 1.72 mW m^(−1)K^(−2),which is 43%higher than that of a pure Bi_(2)Te_(3)thin film. 展开更多
关键词 bi_(2)te_(3)nanoflakes interface engineering scanning transmission electron microscopy thermoelectric thin film
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Construction of a cement-rebar nanoarchitecture for a solution-processed and flexible film of a Bi_(2)Te_(3)/CNT hybrid toward low thermal conductivity and high thermoelectric performance
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作者 Zhijun Chen Haicai Lv +2 位作者 Qichun Zhang Hanfu Wang Guangming Chen 《Carbon Energy》 SCIE CAS 2022年第1期115-128,共14页
Solution processability and flexibility still remain major challenges for many thermoelectric(TE)materials,including bismuth telluride(Bi_(2)Te_(3)),a typical and commercially available TE material.Here,we report a ne... Solution processability and flexibility still remain major challenges for many thermoelectric(TE)materials,including bismuth telluride(Bi_(2)Te_(3)),a typical and commercially available TE material.Here,we report a new solutionprocessed method to prepare a flexible film of a Bi_(2)Te_(3)/single-walled carbon nanotube(SWCNT)hybrid,where the dissolved Bi_(2)Te_(3) ion precursors are mixed with dispersed SWCNTs in solution and recrystallized on the SWCNT surfaces to form a“cement-rebar”-like architecture.The hybrid film shows an n-type characteristic,with a stable Seebeck coefficient of^(−1)00.00±1.69μVK^(−1) in air.Furthermore,an extremely low in-plane thermal conductivity of∼0.33Wm^(−1) K^(−1) is achieved at 300 K,and the figure of merit(ZT)reaches 0.47±0.02.In addition,the TE performance is independent of mechanical bending.The unique“cement-rebar”-like architecture is believed to be responsible for the excellent TE performances and the high flexibility.The results provide a new avenue for the fabrication of solution-processable and flexible TE hybrid films and will speed up the applications of flexible electronics and energy conversion. 展开更多
关键词 bi_(2)te_(3) carbon nanotube hybrid solution-processed thermoelectricS
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Enhanced electrical and mechanical properties of Bi_(2)Te_(3)-based thermoelectric thick films enabled by a practical dynamic regulation strategy
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作者 Jie Zhou Wei Zhu +6 位作者 Qingqing Zhang Guangyu Han YuTong Liu Zhanpeng Guo Siming Guo Yue Huang Yuan Deng 《Journal of Materiomics》 SCIE CSCD 2024年第2期480-489,共10页
The application of high-density and high-performance micro thermoelectric devices is still in its infancy,mainly restricted by the low performance of Bi_(2)Te_(3)-based thick film as well as the limited device inte-gr... The application of high-density and high-performance micro thermoelectric devices is still in its infancy,mainly restricted by the low performance of Bi_(2)Te_(3)-based thick film as well as the limited device inte-gration.In this study,we proposed a dynamic regulation strategy to simultaneously strengthen the thermoelectric and mechanical properties for n-type Bi_(2)Te_(3)-based thick films.The effects of growth temperature and time on thermoelectric properties have been firstly explored.As the thermoelectric properties exhibit consistent degradation with increasing thickness at static growth temperature,an effective rising temperature method is introduced to dynamically regulate the nucleation rate and growing diffusion ability.Thus,the grain refinement with compact texture structure leads to a relatively large carrier mobility(77.1 cm^(2)·V^(-1)·s^(-1))and appropriate concentration(5.25×10^(19)cm^(-3))as well as further 12%improvement of power factor with an average value up to 12.0 mW·cm^(-1)·K^(-2)over a wide temperature ranging from 313 K to 453 K.Furthermore,significant enhancement of mechanical property is also achieved with high elastic modules(56.03 GPa),hardness(0.63 GPa)and large energy dissipation capacity to prevent micro-cracks.This study provides a practical solution with dynamic temperature control to fabricate high-performance Bi_(2)Te_(3) thick films with enhanced mechanical property and pro-cessing feasibility for micro thermoelectric devices. 展开更多
关键词 bi_(2)te_(3)material Thick film Magnetron sputter Dynamic temperature thermoelectric property Mechanical property
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Bi_(2)Te_(3)柔性热电器件的制备与发电性能研究 被引量:5
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作者 杨龙 尤汉 +3 位作者 唐可琛 唐昊 鄢永高 唐新峰 《传感器与微系统》 CSCD 北大核心 2021年第10期14-16,20,共4页
基于热电发电器件的环境能量收集对于下一代免充电电子设备的发展具有重要意义。通过选择聚酰亚胺膜(PI膜)柔性基板材料,设计基板及热电粒子尺寸,并对基板进行无损分割等方法,设计制作了一种垂直结构微型柔性热电器件。该微型柔性热电... 基于热电发电器件的环境能量收集对于下一代免充电电子设备的发展具有重要意义。通过选择聚酰亚胺膜(PI膜)柔性基板材料,设计基板及热电粒子尺寸,并对基板进行无损分割等方法,设计制作了一种垂直结构微型柔性热电器件。该微型柔性热电器件在热端温度33℃,冷端温度13℃时,可产生155.1 mV的开路电压,其最大输出功率可达到0.81 mW,功率密度为9.34 mW/g(2.53 mW/cm^(2)),器件最小弯曲半径可以达到9 mm。结果表明:本文设计方法合理,器件与粒子微型化,基板柔性化的方法,解决了碲化铋(Bi_(2)Te_(3))材料因为本征脆性而难以制作柔性热电器件的难题,可以在保证器件发电能力的基础上使器件具有一定的柔性,使其能更好地贴合热源表面工作,为可穿戴设备如体表传感器进行供电。 展开更多
关键词 柔性热电器件 聚酰亚胺膜 碲化铋 发电性能
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高性能Bi_(2)Te_(3-x)Se_(x)热电薄膜的可控生长 被引量:5
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作者 陈赟斐 魏锋 +2 位作者 王赫 赵未昀 邓元 《物理学报》 SCIE EI CAS CSCD 北大核心 2021年第20期265-271,共7页
碲化铋基材料一直被认为是室温下性能最优异的热电材料之一,也是商用热电器件首选的块体材料.然而面对柔性或高密度设备等应用需求时,薄膜热电材料比块体材料更具优势.因此,提升薄膜材料热电性能及可控制备技术至关重要.与碲化铋基块体... 碲化铋基材料一直被认为是室温下性能最优异的热电材料之一,也是商用热电器件首选的块体材料.然而面对柔性或高密度设备等应用需求时,薄膜热电材料比块体材料更具优势.因此,提升薄膜材料热电性能及可控制备技术至关重要.与碲化铋基块体材料和P型碲化铋基薄膜相比,N型碲化铋基薄膜的性能相对偏低.本工作利用磁控溅射法制备了一系列N型碲化铋薄膜,研究衬底温度和工作压强对薄膜生长模式的影响规律,从而通过溅射参数精确调控薄膜的形貌、结构和生长取向,在合适的衬底温度和工作压强的共同作用下,制备出(00l)方向层状生长的高质量致密薄膜.由于层状结构薄膜具有超高的面内载流子迁移率,该薄膜实现了大于10^(5) S/m的超高电导率.由于兼具高电导率与高Seebeck系数,该层状薄膜试样在室温下的功率因子高达42.5μW/(cm·K^(2)),克服了N型碲化铋基薄膜材料难以匹配P型碲化铋基薄膜材料的困难. 展开更多
关键词 bi_(2)te_(3–x)Se_(x)薄膜 磁控溅射 热电 功率因子
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表面多孔化Bi_(2)Te_(3)柔性薄膜的制备及热电性能研究
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作者 刘帅 薛家乐 +4 位作者 韩文静 陈国祥 刘迎港 徐若君 余历军 《功能材料》 CAS CSCD 北大核心 2022年第4期4162-4165,4181,共5页
柔性热电器件能够满足复杂环境的热量收集和转化需求,是目前研究的重要方向之一。但受制于材料电/声输运性能的强关联作用,柔性热电器件的能量转化效率仍然较低。以聚酰亚胺为柔性衬底,采用磁控溅射的方式制备Bi_(2)Te_(3)柔性热电薄膜... 柔性热电器件能够满足复杂环境的热量收集和转化需求,是目前研究的重要方向之一。但受制于材料电/声输运性能的强关联作用,柔性热电器件的能量转化效率仍然较低。以聚酰亚胺为柔性衬底,采用磁控溅射的方式制备Bi_(2)Te_(3)柔性热电薄膜,并通过退火对薄膜表面进行改性。结果表明,高温退火能够诱导Bi_(2)Te_(3)薄膜表面产生多孔化结构,且孔隙密度和尺寸可通过退火工艺调控;多孔结构对薄膜的电/声输运性能具有协同优化作用,薄膜热导率较退火前降低约50%,Bi_(2)Te_(3)柔性薄膜的热电优值显著提升。 展开更多
关键词 bi_(2)te_(3) 柔性薄膜 表面改性 热电性能
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氧化石墨烯诱导高织构Mo掺杂Bi_(2)Te_(3)薄膜的热电性能
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作者 方文强 朱文艳 +1 位作者 李康银 斯剑霄 《浙江师范大学学报(自然科学版)》 CAS 2022年第3期284-290,共7页
为提高Bi_(2)Te_(3)薄膜的热电性能,采用磁控溅射技术在旋涂有氧化石墨烯(GO)缓冲层的玻璃衬底上共溅制备的Mo掺杂的n型Bi_(2)Te_(3)薄膜.通过对其形貌、组成及热电特性的表征,研究了(00 l)择优取向的不同Mo溅射功率(P=0,15,25,35,45 W)... 为提高Bi_(2)Te_(3)薄膜的热电性能,采用磁控溅射技术在旋涂有氧化石墨烯(GO)缓冲层的玻璃衬底上共溅制备的Mo掺杂的n型Bi_(2)Te_(3)薄膜.通过对其形貌、组成及热电特性的表征,研究了(00 l)择优取向的不同Mo溅射功率(P=0,15,25,35,45 W)对Bi_(2)Te_(3)的热电性能的影响.结果表明:GO缓冲层的存在可以实现高度取向(00 l)的Bi_(2)Te_(3)薄膜制备,室温下薄膜迁移率为48 cm^(2)·V^(-1)·s^(-1);Mo掺杂有效提高了Bi_(2)Te_(3)薄膜的载流子浓度,使得P_(Mo)=25 W时的Bi_(2)Te_(3)薄膜在室温下最大电导率为944S·cm^(-1),其在400 K时最大功率因子达到2074.6μW·m^(-1)·K^(-2).表明氧化石墨烯诱导高织构Mo掺杂可以优化n型Bi_(2)Te_(3)薄膜的热电性能. 展开更多
关键词 bi_(2)te_(3)薄膜 氧化石墨烯 取向 Mo掺杂 热电性能
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A flexible thermoelectric device based on a Bi_(2)Te_(3)-carbon nanotube hybrid 被引量:4
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作者 Ying Li Jixiang Qiao +6 位作者 Yang Zhao Qing Lan Pengyan Mao Jianhang Qiu Kaiping Tai Chang Liu Huiming Cheng 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2020年第23期80-85,共6页
Thermoelectric(TE)materials and devices have attracted great attention due to their ability to convert waste heat to electrical power and active cooling.However,the conventional bulk TE materials are inorganic semicon... Thermoelectric(TE)materials and devices have attracted great attention due to their ability to convert waste heat to electrical power and active cooling.However,the conventional bulk TE materials are inorganic semiconductors with inherent brittleness and rigidity.They cannot closely contact curved heat sources and sinks,which limits their application in modern electronics.It remains a big challenge to fabricate high-performance TE materials and devices with good flexibility.Here,we report a flexible TE device comprised of a single wall carbon nanotube(SWCNT)network and(0001)-textured Bi_(2)Te_(3)nanocrystals prepared by a magnetron sputtering technique.The unique Bi_(2)Te_(3)-SWCNT hybrid structure has a TE figure of merit(ZT)value of^0.23 at^330 K.A prototype TE device made of this hybrid gives a maximum output power density of^0.93 m W cm^(-2)under a temperature difference of 25 K at ambient temperature and shows good flexibility under bending.Our results open up a new way to the development of flexible TEs and their application in self-powered portable devices. 展开更多
关键词 bi_(2)te_(3) Carbon nanotube thermoelectric hybrid Flexible thermoelectrics thermoelectric generator
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A comprehensive review on Bi_(2)Te_(3)-based thin films: Thermoelectrics and beyond 被引量:8
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作者 Xinfeng Tang Ziwei Li +2 位作者 Wei Liu ingjie Zhang Ctirad Uher 《Interdisciplinary Materials》 2022年第1期88-115,共28页
Bi_(2)Te_(3)-based materials are not only the most important and widely used room temperature thermoelectric(TE)materials but are also canonical examples of topological insulators in which the topological surface stat... Bi_(2)Te_(3)-based materials are not only the most important and widely used room temperature thermoelectric(TE)materials but are also canonical examples of topological insulators in which the topological surface states are protected by the time-reversal symmetry.High-performance thin films based on Bi_(2)Te_(3)- have attracted worldwide attention during the past two decades due primarily to their outstanding TE performance as highly efficient TE coolers and as miniature and flexible TE power generators for a variety of electronic devices.Moreover,intriguing topological phenomena,such as the quantum anomalous Hall effect and topological superconductivity discovered in Bi_(2)Te_(3)-based thin films and heterostructures,have shaped research directions in the field of condensed matter physics.In Bi_(2)Te_(3)-based films and heterostructures,delicate control of the carrier transport,film composition,and microstructure are prerequisites for successful device operations as well as for experimental verification of exotic topological phenomena.This review summarizes the recent progress made in atomic defect engineering,carrier tuning,and band engineering down to a nanoscale regime and how it relates to the growth and fabrication of high-quality Bi_(2)Te_(3)-based films.The review also briefly discusses the physical insight into the exciting field of topological phenomena that were so dramatically realized in Bi_(2)Te_(3)-and Bi_(2)Se_(3)‐based structures.It is expected that Bi_(2)Te_(3)-based thin films and heterostructures will play an ever more prominent role as flexible TE devices collecting and converting low-level(body)heat into electricity for numerous electronic applications.It is also likely that such films will continue to be a remarkable platform for the realization of novel topological phenomena. 展开更多
关键词 bi_(2)te_(3)-based thin films and heterostructures device applications thermoelectric topological phenomena
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Nanostructure and thermal power of highly-textured and single-crystal-like Bi_(2)Te_(3) thin films 被引量:1
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作者 Heng Zhang Jamo Momand +6 位作者 Joshua Levinsky Qikai Guo Xiaotian Zhu Gert H ten Brink Graeme R.Blake George Palasantzas Bart J.Kooi 《Nano Research》 SCIE EI CSCD 2022年第3期2382-2390,共9页
Bi_(2)Te_(3)-based alloys are known to have outstanding thermoelectric properties.Although structure–property relations have been studied,still,detailed analysis of the atomic and nano-scale structure of Bi_(2)Te_(3)... Bi_(2)Te_(3)-based alloys are known to have outstanding thermoelectric properties.Although structure–property relations have been studied,still,detailed analysis of the atomic and nano-scale structure of Bi_(2)Te_(3)thin film in relation to their thermoelectric properties remains poorly explored.Herein,highly-textured(HT)and single-crystal-like(SCL)Bi_(2)Te_(3)films have been grown using pulsed laser deposition(PLD)on Si wafer covered with(native or thermal)SiOx and mica substrates.All films are highly textured with c-axis out-of-plane,but the in-plane orientation is random for the films grown on oxide and single-crystal-like for the ones grown on mica.The power factor of the film on thermal oxide is about four times higher(56.8μW·cm^(−1)·K^(−2))than that of the film on mica(12.8μW·cm^(−1)·K^(−2)),which is comparable to the one of the polycrystalline ingot at room temperature(RT).Reduced electron scattering in the textured thin films results in high electrical conductivity,where the SCL film shows the highest conductivity.However,its Seebeck coefficient shows a low value.The measured properties are correlated with the atomic structure details unveiled by scanning transmission electron microscopy.For instance,the high concentration of stacking defects observed in the HT film is considered responsible for the increase of Seebeck coefficient compared to the SCL film.This study demonstrates the influence of nanoscale structural effects on thermoelectric properties,which sheds light on tailoring thermoelectric thin films towards high performance. 展开更多
关键词 bi_(2)te_(3)films highly-textured structure single-crystal-like structure thermoelectric properties pulsed laser deposition
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碲化铋基热电薄膜与器件研究进展 被引量:1
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作者 胡少雄 周曼 +4 位作者 任超杰 张博涵 祝薇 赵未昀 邓元 《中国材料进展》 CAS CSCD 北大核心 2022年第12期1005-1017,1056,共14页
随着微电子技术的快速进步,电子器件不断朝着高性能、微型化、低功耗、自供电的方向发展。在器件性能和集成度不断提高的同时,小空间的快速散热问题成为制约其发展的关键瓶颈之一。热电薄膜器件是一种以热电薄膜材料为核心的半导体能源... 随着微电子技术的快速进步,电子器件不断朝着高性能、微型化、低功耗、自供电的方向发展。在器件性能和集成度不断提高的同时,小空间的快速散热问题成为制约其发展的关键瓶颈之一。热电薄膜器件是一种以热电薄膜材料为核心的半导体能源转换器件,具有全固态、无噪音、免维护、体积小等优点,在高热流密度电子元器件快速散热和低功耗电子器件自供电等领域具有迫切的应用需求和广阔的市场前景。Bi_(2)Te_(3)基热电材料是目前室温条件下性能最好的热电材料,以Bi_(2)Te_(3)基热电薄膜材料与器件为核心,重点介绍了常用热电薄膜材料的制备与性能优化方法,热电薄膜器件的结构设计、制备工艺以及界面优化手段,并对热电薄膜器件在热电发电和热电制冷领域的应用做了简要介绍。 展开更多
关键词 bi_(2)te_(3) 薄膜 热电材料 热电器件 制备方法 性能优化
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柔性、可拉伸变形微型热电器件的设计与集成
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作者 刘瑞 于治 +7 位作者 赵洋 李晓齐 喻海龙 何娟 聂鹏程 王春雨 邰凯平 刘畅 《金属学报》 SCIE EI CAS CSCD 北大核心 2024年第3期348-356,共9页
在能源匮乏、环境污染严重的今天,研发可循环利用、环境友好的新型能源材料与器件具有重要意义。热电材料可直接实现热能与电能的相互转换,为解决这一问题提供了新的途径。特别是,近年来由于柔性热电器件展现出自供电、可穿戴等优势,受... 在能源匮乏、环境污染严重的今天,研发可循环利用、环境友好的新型能源材料与器件具有重要意义。热电材料可直接实现热能与电能的相互转换,为解决这一问题提供了新的途径。特别是,近年来由于柔性热电器件展现出自供电、可穿戴等优势,受到了人们的高度重视。本工作通过引入聚二甲基硅氧烷(polydimethylsiloxane,PDMS)基底,利用单壁碳纳米管(single-wall carbon nanotube,SWCNT)/Bi_(2)Te_(3)热电复合薄膜材料优异的热电性能和柔韧性,设计制作了一种可拉伸变形的三维拱形结构的微型热电发电器件。该器件充分利用薄膜材料面内最佳热电性能方向,通过器件内外温差获得热-电性能转换,在电极两端产生电势差,实现发电。该微型柔性热电器件在温差为4 K时,输出电压为4.8 m V,最大输出功率达2.6×10^(-9)W,功率密度为3.9×10^(-9)W/cm^(2),器件的最小弯曲半径为3 mm。这种微型柔性热电器件的制备工艺简单易行、成本低廉,为柔性热电薄膜发电器件的研制提供了新途径。 展开更多
关键词 swcnt/bi_(2)te_(3)热电复合薄膜 可拉伸变形 微型柔性热电器件
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柔性可穿戴碲化铋基热电器件的研究进展
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作者 张彤 李杰 +3 位作者 叶施莹 吴凯 任松 方剑 《复合材料学报》 EI CAS CSCD 北大核心 2024年第7期3515-3524,共10页
随着全球能源的消耗加剧,热电器件的开发应用成为解决能源消耗问题的有效途径之一,其中,碲化铋(Bi_(2)Te_(3))基柔性热电器件因在可穿戴领域逐步实现应用,得到了学界和业界的广泛关注。然而,受其材料成本较高、刚性结构等多方面因素的限... 随着全球能源的消耗加剧,热电器件的开发应用成为解决能源消耗问题的有效途径之一,其中,碲化铋(Bi_(2)Te_(3))基柔性热电器件因在可穿戴领域逐步实现应用,得到了学界和业界的广泛关注。然而,受其材料成本较高、刚性结构等多方面因素的限制,Bi_(2)Te_(3)基柔性热电器件难以在保持高效热电性能的同时,实现柔性可穿戴化应用。本文系统地阐述了当前Bi_(2)Te_(3)基柔性热电器件在材料复合与柔性结构设计上的研究进展,特别是在柔性结构设计上,涵盖了块状、膜类及纱线型3种结构。最后,总结分析了Bi_(2)Te_(3)柔性热电器件未来可能面临的挑战与发展趋势,以期促进热电器件在可穿戴领域实现广泛应用。 展开更多
关键词 碲化铋 热电材料 热电器件 热电薄膜 热电织物 可穿戴热电
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