High-temperature current conduction through three kinds of Schottky diodes

Fundamentals of the Schottky contacts and the high-temperature current conduction through three kinds of Schottky diodes are studied. N-Si Schottky diodes, GaN Schottky diodes and AlGaN/GaN Schottky diodes are investigated by I-V-T measurements ranging from 300 to 523 K. For these Schottky diodes, a rise in temperature is accompanied with an increase in barrier height and a reduction in ideality factor. Mechanisms are suggested, including thermionic emission, field emission, trap-assisted tunnelling and so on. The most remarkable finding in the present paper is that these three kinds of Schottky diodes are revealed to have different behaviours of high-temperature reverse currents. For the n-Si Schottky diode, a rise in temperature is accompanied by an increase in reverse current. The reverse current of the GaN Schottky diode decreases first and then increases with rising temperature. The AlGaN/GaN Schottky diode has a trend opposite to that of the GaN Schottky diode, and the dominant mechanisms are the effects of the piezoelectric polarization field and variation of two-dimensional electron gas charge density.

The Electrical Properties of Al/Methylene-Blue/n-Si/Au Schottky Diodes

We studied the electrical characteristics of Al/methylene-blue/n-Si/Au Schottky diodes such as current-voltage, conductance-capacitance-voltage, and conductance-capacitance-frequency. We plotted rectification ratio vs. voltage (RR-V) of the diode. From I-V plots of the diodes, saturation current (Io), and ideality factor (n) were calculated. Barrier height (eΦB) and series resistance (RS) were calculated with Norde functions. The results show that in the Al/methylene-blue/n-Si/Au diode, the methylene-blue layer has a significant impact on electrical properties such as series resistance, barrier height, ideality factor, conductance, rectification ratio, and capacitance.

Investigations on mesa width design for 4H–SiC trench super junction Schottky diodes

Mesa width （WM） is a key design parameter for SiC super junction （SJ） Schottky diodes （SBD） fabricated by the trench-etching-and-sidewall-implant method. This paper carries out a comprehensive investigation on how the mesa width design determines the device electrical performances and how it affects the degree of performance degradation induced by process variations. It is found that structures designed with narrower mesa widths can tolerant substantially larger charge imbalance for a given BV target, but have poor specific on-resistances. On the contrary, structures with wider mesa widths have superior on-state performances but their breakdown voltages are more sensitive to p-type doping variation. Medium WM structures （-2 p.m） exhibit stronger robustness against the process variation resulting from SiC deep trench etching. Devices with 2-p.m mesa width were fabricated and electrically characterized. The fabricated SiC SJ SBDs have achieved a breakdown voltage of 1350 V with a specific on-resistance as low as 0.98 mΩ2.cm2. The estimated specific drift on- resistance by subtracting substrate resistance is well below the theoretical one-dimensional unipolar limit of SiC material. The robustness of the voltage blocking capability against trench dimension variations has also been experimentally verified for the proposed SiC SJ SBD devices.

Comparison of time-related electrical properties of PN junctions and Schottky diodes for Zn O-based betavoltaic batteries

Schottky diodes and PN junctions were utilized as energy converting structures in ZnO-based betavoltaic batteries,in which 0.101121 Ci 63Ni was selected as the beta source.The time-related electrical properties were obtained using Monte Carlo simulations.For the n-type ZnO,the Pt/ZnO Schottky diode had the highest energy conversion efficiency,and the Ni/ZnO Schottky diode had the largest Isc.The overall electrical performance of PN junctions is better than that of Schottky diodes.The lifetimes of Pt/ZnO and Ni/ZnO are longer than for other Schottky devices,coming close to those of PN junctions.Considering that Schottky diodes are easier to fabricate and independent of p-type semiconductors,Pt/ZnO and Ni/ZnO diodes offer alternatives to PN-junction-based betavoltaic batteries.

A novel physical parameter extraction approach for Schottky diodes

Parameter extraction is an important step for circuit simulation methods that are based on physical models of semiconductor devices. A novel physical parameter extraction approach for Schottky diodes is proposed in this paper. By employing a set of analytical formulas, this approach extracts all of the necessary physical parameters of the diode chip in a unique way. It then extracts the package parasitic parameters with a curve-fitting method. To validate the proposed approach, a model HSMS-282 c commercial Schottky diode is taken as an example. Its physical parameters are extracted and used to simulate the diode＇s electrical characteristics. The simulated results based on the extracted parameters are compared with the measurements and a good agreement is obtained, which verifies the feasibility and accuracy of the proposed approach.

High-performance 4H-SiC junction barrier Schottky diodes with double resistive termination extensions

4H-SiC junction barrier Schottky （JBS） diodes with a high-temperature annealed resistive termination extension （HARTE） are designed, fabricated and characterized in this work. The differential specific on-state resistance of the device is as low as 3.64 mΩ·cm^2 with a total active area of 2.46× 10 ^-3 cm^2. Ti is the Schottky contact metal with a Schottky barrier height of 1.08 V and a low onset voltage of 0.7 V. The ideality factor is calculated to be 1.06. Al implantation annealing is performed at 1250 ℃ in Ar, while good reverse characteristics are achieved. The maximum breakdown voltage is 1000 V with a leakage current of 9× 10^-5 A on chip level. These experimental results show good consistence with the simulation results and demonstrate that high-performance 4H-SiC JBS diodes can be obtained based on the double HARTE structure.

Novel layout design of 4H-SiC merged PiN Schottky diodes leading to improved surge robustness

A method to improve the surge current capability of silicon carbide(SiC)merged PiN Schottky(MPS)diodes is presented and investigated via three-dimensional electro-thermal simulations.When compared with a conventional MPS diode,the proposed structure has a more uniform current distribution during bipolar conduction due to the help of the continuous P+surface,which can avoid the formation of local hotspots during the surge process.The Silvaco simulation results show that the proposed structure has a 20.29%higher surge capability and a 15.06%higher surge energy compared with a conventional MPS diode.The bipolar on-state voltage of the proposed structure is 4.69 V,which is 56.29%lower than that of a conventional MPS diode,enabling the device to enter the bipolar mode earlier during the surge process.Furthermore,the proposed structure can suppress the occurrence of‘snapback'phenomena when switching from the unipolar to the bipolar operation mode.In addition,an analysis of the surge process of MPS diodes is carried out in detail.

Effect of annealing on the electrical performance of N-polarity GaN Schottky barrier diodes

A nitrogen-polarity(N-polarity)GaN-based high electron mobility transistor(HEMT)shows great potential for high-fre-quency solid-state power amplifier applications because its two-dimensional electron gas(2DEG)density and mobility are mini-mally affected by device scaling.However,the Schottky barrier height(SBH)of N-polarity GaN is low.This leads to a large gate leakage in N-polarity GaN-based HEMTs.In this work,we investigate the effect of annealing on the electrical characteristics of N-polarity GaN-based Schottky barrier diodes(SBDs)with Ni/Au electrodes.Our results show that the annealing time and tem-perature have a large influence on the electrical properties of N-polarity GaN SBDs.Compared to the N-polarity SBD without annealing,the SBH and rectification ratio at±5 V of the SBD are increased from 0.51 eV and 30 to 0.77 eV and 7700,respec-tively,and the ideal factor of the SBD is decreased from 1.66 to 1.54 after an optimized annealing process.Our analysis results suggest that the improvement of the electrical properties of SBDs after annealing is mainly due to the reduction of the inter-face state density between Schottky contact metals and N-polarity GaN and the increase of barrier height for the electron emis-sion from the trap state at low reverse bias.

Preparation and characteristic study of Schottky diodes based on Ga_(2)O_(3)thin films

This study uses atomic layer deposition(ALD)to grow Ga_(2)O_(3)films on SiO_(2)substrates and investigates the influence of film thickness and annealing temperature on film quality.Schottky diode devices are fabricated based on the grown Ga_(2)O_(3)films,and the effects of annealing temperature,electrode size,and electrode spacing on the electrical characteristics of the devices are studied.The results show that as the film thickness increases,the breakdown voltage of the fabricated devices also increases.A Schottky diode with a thickness of 240 nm can achieve a reverse breakdown voltage of 300 V.The film quality significantly improves as the annealing temperature of the film increases.At a voltage of 5 V,the current of the film annealed at 900℃is 64 times that of the film annealed at 700℃.The optimum annealing temperature for Ohmic contact electrodes is 450℃.At 550℃,the Ohmic contact metal tends to burn,and the performance of the device is reduced.Reducing the electrode spacing increases the forward current of the device but decreases the reverse breakdown voltage.Increasing the Schottky contact electrode size increases the forward current,but the change is not significant,and there is no significant change in the reverse breakdown voltage.The device also performs well at high temperatures,with a reverse breakdown voltage of 220 V at 125℃.

Influences of ICP etching damages on the electronic properties of metal field plate 4H-SiC Schottky diodes

Inductively coupled plasma （ICP） etching of 4H-SiC using SF6/Oa gas mixture was studied systemati- cally and the effect of etching was examined by metal field plate SiC Schottky diodes （SBDs）. It was found that the etch rate as well as SiC surface morphology were related with ICP power, RF power, pressure, the flow of SF6 and O2. Etching damages （the cone-in-pits and pits） generated at high chuck self-bias were observed, and they were thought to be caused by SiC defects. The degradation of both the reverse and forward I-V performances of SiC SBDs was ascribed to the cone-in-pits and pits. Moreover, the absolute value of forward current is even less than the reverse counterpart in the absolute value voltage range of 0-50 V for SiC SBDs with etching damages.

Millimeter-wave fixed-tuned subharmonic mixers with planar Schottky diodes

Two different frequency bandwidth subharmonic mixers（SHM） using planar Schottky mixing diodes are discussed and fabricated.Full-wave analysis is carried out to find the optimum diode embedding impedances with a lumped port for modeling the nonlinear junction.The SHM circuit is divided into several different parts and each part is optimized using the calculated diode impedances.The divided parts are then combined and optimized together.The exported S-parameter files of the global circuit are used for conversion loss（CL） discussion.For the 150 GHz SHM,the lowest measured CL is 10.7 dB at 153 GHz,and typical CL is 12.5 dB in the frequency range of 135-165 GHz.The lowest measured CL of the 180 GHz SHM is 5.8 dB at 240 GHz,and typical CL is 13.5 dB and 11.5 dB in the frequency range of 165-200 GHz and 210-240 GHz,respectively.

High-Voltage Ti /6H-SiC Schottky Barrier Diodes

The fabrication and electrical characterization of Scho tt ky barrier diodes (SBD) on 6H-SiC,via thermal evaporation of Ni are reported.Th e Schottky barrier diodes are fabricated during the 6H-SiC epilayers grow n by using chemical vapor deposition on commercially available single-crystal 6 H-SiC wafers.The I-V characteristics of these diodes exhibit a sharp break down,with the breakdown voltage of 450V at room temperature.The diodes are demon strated to be of a low reverse leakage current of 5×10 -4 A·cm -2 at the bias voltage of -200V.The ideal factor and barrier height are 1 09 and 1 24-1 26eV,respectively.

A landscape of β-Ga_(2)O_(3) Schottky power diodes

β-Ga_(2)O_(3) Schottky barrier diodes have undergone rapid progress in research and development for power electronic applications.This paper reviews state-of-the-art β-Ga_(2)O_(3) rectifier technologies,including advanced diode architectures that have enabled lower reverse leakage current via the reduced-surface-field effect.Characteristic device properties including onresistance,breakdown voltage,rectification ratio,dynamic switching,and nonideal effects are summarized for the different devices.Notable results on the high-temperature resilience of β-Ga_(2)O_(3) Schottky diodes,together with the enabling thermal packaging solutions,are also presented.

High-temperature characteristics of Al_xGa_(1-x)N/GaN Schottky diodes

High-temperature characteristics of the metal/AlxGa1-xN/GaN M/S/S （M/S/S） diodes have been studied with current-voltage （I-V） and capacitance-voltage （C-V） measurements at high temperatures. Due to the presence of the piezoelectric polarization field and a quantum well at the AlxGa1-xN/GaN interface, the AlxGal-xN/GaN diodes show properties distinctly different from those of the AlxGa1-xN diodes. For the AlxGa1-xN/GaN diodes, an increase in temperature accompanies an increase in barrier height and a decrease in ideality factor, while the AlxGa1-xN diodes are opposite. Furthermore, at room temperature, both reverse leakage current and reverse breakdown voltage are superior for the AlxGa1-xN/GaN diodes to those for the AlxGa1-xN diodes.

Theoretical and Experimental Studies of Schottky Diodes that Use Aligned Arrays of Single-Walled Carbon Nanotubes

We present theoretical and experimental studies of Schottky diodes that use aligned arrays of single-walled carbon nanotubes. A simple physical model, taking into account the basic physics of current rectification, can adequately describe the single-tube and array devices. We show that for as-grown array diodes, the rectification ratio, defined by the maximum-to-minimum-current-ratio, is low due to the presence of metallic-single-walled nanotube (SWNT) shunts. These tubes can be eliminated in a single voltage sweep resulting in a high rectification array device. Further analysis also shows that the channel resistance, and not the intrinsic nanotube diode properties, limits the rectification in devices with channel length up to 10 μm.

Millimeter wave broadband high sensitivity detectors with zero-bias Schottky diodes

Two broadband detectors at W-band and D-band are analyzed and designed with low barrier Schottky diodes. The input circuit of the detectors is realized by low and high impedance microstrip lines, and their output circuit is composed of a radio frequency （RF） bandstop filter and a tuning line for optimum reflection phase of the RF signal. S-parameters of the complete circuit are exported to a circuit simulator for voltage sensitivity analysis. For the W band detectors, the highest measured voltage sensitivity is 11800 mV/mW at 100 GHz, and the sensitivity is higher than 2000 mV/mW in 80-104 GHz. Measured tangential sensitivity （TSS） is higher than -38 dBm, and its linearity is superior than 0.99992 at 95 GHz. For the D band detector, the highest measured voltage sensitivity is 1600 mV/mW, and the typical sensitivity is 600 mV/mW in 110-170 GHz. TSS is higher than -29 dBm, and its linearity is superior than 0.99961 at 150 GHz.

A 5.4mW and 6.1% efficiency fixed-tuned 214GHz frequency doubler with Schottky barrier diodes

A Y-band frequency doubler is analyzed and designed with GaAs planar Schottky diode, which is flip-chip solded into a 50 μm thick quartz substrate. Diode embedding impedance is found by full- wave analysis with lumped port to model the nonlinear junction for impedance matching without the need of diode equivalent circuit model. All the matching circuit is designed ＂on-chip＂ and the mul- tiplier is self-biasing. To the doubler, a conversion efficiency of 6.1% and output power of 5.4mW are measured at 214GHz with input power of 88mW, and the typical measured efficiency is 4.5% in 200 - 225 GHz.

Study and optimal simulation of 4H-SiC floating junction Schottky barrier diodes' structures and electric properties

This paper stuides the structures of 4H SiC floating junction Schottky barrier diodes. Some structure parameters of devices are optimized with commercial simulator based on forward and reverse electrical characteristics. Compared with conventional power Schottky barrier diodes, the devices are featured by highly doped drift region and embedded floating junction layers, which can ensure high breakdown voltage while keeping lower specific on-state resistance, and solve the contradiction between forward voltage drop and breakdown voltage. The simulation results show that with optimized structure parameter, the breakdown voltage can reach 4.36 kV and the specific on-resistance is 5.8 mΩ.cm2 when the Baliga figure of merit value of 13.1 GW/cm2 is achieved.

A simulation study of field plate termination in Ga2O3 Schottky barrier diodes

In this work, the field plate termination is studied for Ga2O3Schottky barrier diodes(SBDs) by simulation. The influence of field plate overlap, dielectric material and thickness on the termination electric field distribution are demonstrated.It is found that the optimal thickness increases with reverse bias increasing for all the three dielectrics of SiO2, Al2O3, and HfO2. As the thickness increases, the maximum electric field intensity decreases in SiO2and Al2O3, but increases in HfO2.Furthermore, it is found that SiO2and HfO2are suitable for the 600 V rate Ga2O3SBD, and Al2O3is suitable for both600 V and 1200 V rate Ga2O3SBD. In addition, the comparison of Ga2O3SBDs between the SiC and GaN counterpart reveals that for Ga2O3, the breakdown voltage bottleneck is the dielectric. While, for SiC and GaN, the bottleneck is mainly the semiconductor itself.

Effect of diode size and series resistance on barrier height and ideality factor in nearly ideal Au/n type-GaAs micro Schottky contact diodes

Small high-quality Au/n type-GaAs Schottky barrier diodes （SBDs） with low reverse leakage current are produced using lithography. Their effective barrier heights （BHs） and ideality factors from current-voltage （I-V） characteristics are measured by a Pico ampere meter and home-built I-V instrument. In spite of the identical preparation of the diodes there is a diode-to-diode variation in ideality factor and barrier height parameters. Measurement of topology of a surface of a thin metal film with atomic force microscope （AFM） shows that Au-n type-GaAS SD consists of a set of parallel-connected micro and nanocontacts diodes with sizes approximately in a range of 100-200 nm. Between barrier height and ideality factor there is an inversely proportional dependency. With the diameter of contact increasing from 5 μm up to 200 μm, the barrier height increases from 0.833 up to 0.933 eV and its ideality factor decreases from 1.11 down to 1.006. These dependencies show the reduction of the contribution of the peripheral current with the diameter of contact increasing. We find the effect of series resistance on barrier height and ideality factor.