The integrated circuit (IC) manufacturing process is capital intensive and complex. The production process of unit product (or die, as it is commonly referred to) takes several weeks. Semiconductor factories (fabs) co...The integrated circuit (IC) manufacturing process is capital intensive and complex. The production process of unit product (or die, as it is commonly referred to) takes several weeks. Semiconductor factories (fabs) continuously attempt to improve their productivity, as measured in output and cycle time (or mean flow time). The conflicting objective of producing maximum units at minimal production cycle time and at the highest quality, as measured by die yield, is discussed in this paper. The inter-related effects are characterized, and a model is proposed to address this multi-objective function. We then show that, with this model, die cost can be optimized for any given operating conditions of a fab. A numerical example is provided to illustrate the practicality of the model and the proposed optimization method.展开更多
In the paper, the results of investigations of temperature and frequency dependences of dielectric permeability and dielectric loss of compositions LDPE + xvol%Bi<sub>2</sub>Te<sub>3</sub> are ...In the paper, the results of investigations of temperature and frequency dependences of dielectric permeability and dielectric loss of compositions LDPE + xvol%Bi<sub>2</sub>Te<sub>3</sub> are stated. The investigations were carried out at frequency 10 – 10<sup>5</sup> Hz and temperature 20°C - 150°C intervals, respectively. It was revealed that increase of percentage of the filler Bi<sub>2</sub>Te<sub>3</sub> in the matrix, reduces to increase of dielectric permeability and dielectric loss of composites LDPE + xvol%Bi<sub>2</sub>Te<sub>3</sub> in connection with the change reducing to Maxwell-Wagner’s volume polarization and emergence of comparative strong inner field in semiconductor clusters.展开更多
文摘The integrated circuit (IC) manufacturing process is capital intensive and complex. The production process of unit product (or die, as it is commonly referred to) takes several weeks. Semiconductor factories (fabs) continuously attempt to improve their productivity, as measured in output and cycle time (or mean flow time). The conflicting objective of producing maximum units at minimal production cycle time and at the highest quality, as measured by die yield, is discussed in this paper. The inter-related effects are characterized, and a model is proposed to address this multi-objective function. We then show that, with this model, die cost can be optimized for any given operating conditions of a fab. A numerical example is provided to illustrate the practicality of the model and the proposed optimization method.
文摘In the paper, the results of investigations of temperature and frequency dependences of dielectric permeability and dielectric loss of compositions LDPE + xvol%Bi<sub>2</sub>Te<sub>3</sub> are stated. The investigations were carried out at frequency 10 – 10<sup>5</sup> Hz and temperature 20°C - 150°C intervals, respectively. It was revealed that increase of percentage of the filler Bi<sub>2</sub>Te<sub>3</sub> in the matrix, reduces to increase of dielectric permeability and dielectric loss of composites LDPE + xvol%Bi<sub>2</sub>Te<sub>3</sub> in connection with the change reducing to Maxwell-Wagner’s volume polarization and emergence of comparative strong inner field in semiconductor clusters.
