5 critical quality characteristics must be controlled in the surface mount and wire-bond process in semiconductor packaging. And these characteristics are correlated with each other. So the principal components analy...5 critical quality characteristics must be controlled in the surface mount and wire-bond process in semiconductor packaging. And these characteristics are correlated with each other. So the principal components analysis（PCA） is used in the analysis of the sample data firstly. And then the process is controlled with hotelling T^2 control chart for the first several principal components which contain sufficient information. Furthermore, a software tool is developed for this kind of problems. And with sample data from a surface mounting device（SMD） process, it is demonstrated that the T^2 control chart with PCA gets the same conclusion as without PCA, but the problem is transformed from high-dimensional one to a lower dimensional one, i.e., from 5 to 2 in this demonstration.展开更多
It is important to determine the dielectric characteristics of semiconductor encapsulation materials based on epoxy resins.We employed the dielectric spectroscopy technique to investigate the dielectric relaxation in ...It is important to determine the dielectric characteristics of semiconductor encapsulation materials based on epoxy resins.We employed the dielectric spectroscopy technique to investigate the dielectric relaxation in the presence of water and how it changes the relaxation.It was observed that the dielectric relaxation of the material was significantly influenced by absorbed water,the local segmental motion(also known as Johari-Goldstein(β)relaxation)was influenced most by the presence of the water,it was modified by the wet sample compared to dry one,and required high activation energy.The relaxation related to the glass transition was contributed by the cooperative motion(the a-relaxation)of the epoxy resin system.The a-relaxation was shifted to a low temperature in the wet sample compared to dry one.The relaxation was modeled with a clear Vogel-Fulcher-Tammann-Hesse(VFTH)behavior;the Vogel temperature of the wet sample was 8 K lower than the dry sample.The presence of water acts as a plasticizer for the molecular relaxation,and speed-up the cooperative process.The measured data were also used to estimate the electrical properties of the resin system by employing an effective-medium model together with a porous media continuum model by taking into account the physical properties of the system.It is already known that the influence of water in semiconductor packaging is important in sensitive applications.The presented measurements and the analysis method would be appreciated within the semiconductor packaging community to improve material selection and performance evaluation efforts.展开更多
基金This project is supported by National Natural Science Foundation of China (No.70372062)Hi-Tech Program of Tianjin city,China (No.04310881R).
文摘5 critical quality characteristics must be controlled in the surface mount and wire-bond process in semiconductor packaging. And these characteristics are correlated with each other. So the principal components analysis（PCA） is used in the analysis of the sample data firstly. And then the process is controlled with hotelling T^2 control chart for the first several principal components which contain sufficient information. Furthermore, a software tool is developed for this kind of problems. And with sample data from a surface mounting device（SMD） process, it is demonstrated that the T^2 control chart with PCA gets the same conclusion as without PCA, but the problem is transformed from high-dimensional one to a lower dimensional one, i.e., from 5 to 2 in this demonstration.
文摘It is important to determine the dielectric characteristics of semiconductor encapsulation materials based on epoxy resins.We employed the dielectric spectroscopy technique to investigate the dielectric relaxation in the presence of water and how it changes the relaxation.It was observed that the dielectric relaxation of the material was significantly influenced by absorbed water,the local segmental motion(also known as Johari-Goldstein(β)relaxation)was influenced most by the presence of the water,it was modified by the wet sample compared to dry one,and required high activation energy.The relaxation related to the glass transition was contributed by the cooperative motion(the a-relaxation)of the epoxy resin system.The a-relaxation was shifted to a low temperature in the wet sample compared to dry one.The relaxation was modeled with a clear Vogel-Fulcher-Tammann-Hesse(VFTH)behavior;the Vogel temperature of the wet sample was 8 K lower than the dry sample.The presence of water acts as a plasticizer for the molecular relaxation,and speed-up the cooperative process.The measured data were also used to estimate the electrical properties of the resin system by employing an effective-medium model together with a porous media continuum model by taking into account the physical properties of the system.It is already known that the influence of water in semiconductor packaging is important in sensitive applications.The presented measurements and the analysis method would be appreciated within the semiconductor packaging community to improve material selection and performance evaluation efforts.
