A novel silicon-on-insulator （SOI） high-voltage device based on epitaxy-separation by implantation oxygen （SIMOX） with a partial buried n＋-layer silicon-on-insulator （PBN SOI） is proposed in this paper. Based o...A novel silicon-on-insulator （SOI） high-voltage device based on epitaxy-separation by implantation oxygen （SIMOX） with a partial buried n＋-layer silicon-on-insulator （PBN SOI） is proposed in this paper. Based on the proposed expressions of the vertical interface electric field, the high concentration interface charges which are accumu- lated on the interface between top silicon layer and buried oxide layer （BOX） effectively enhance the electric field of the BOX （EI）, resulting in a high breakdown voltage （BV） for the device. For the same thicknesses of top silicon layer （10 μm） and BOX （0.375 μm）, the EI and BV of PBN SOI are improved by 186.5% and 45.4% in comparison with those of the conventional SOI, respectively.展开更多
The hardening of the buried oxide （BOX） layer of separation by implanted oxygen （SIMOX） silicon-on-insulator （SOI） wafers against total-dose irradiation was investigated by implanting ions into the BOX layers. T...The hardening of the buried oxide （BOX） layer of separation by implanted oxygen （SIMOX） silicon-on-insulator （SOI） wafers against total-dose irradiation was investigated by implanting ions into the BOX layers. The tolerance to total-dose irradiation of the BOX layers was characterized by the comparison of the transfer characteristics of SOI NMOS transistors before and after irradiation to a total dose of 2.7 Mrad（SiO2）. The experimental results show that the implantation of silicon ions into the BOX layer can improve the tolerance of the BOX layers to total-dose irradiation. The investigation of the mechanism of the improvement suggests that the deep electron traps introduced by silicon implantation play an important role in the remarkable improvement in radiation hardness of SIMOX SOI wafers.展开更多
In recent years, novel structure SOI materials have been fabricated successfully. Also, SiGeOI (SGOI)material, an ideal substrate for realizing strained-silicon structures, has been investigated by modified SIMOX tech...In recent years, novel structure SOI materials have been fabricated successfully. Also, SiGeOI (SGOI)material, an ideal substrate for realizing strained-silicon structures, has been investigated by modified SIMOX technology.From 2002, the 100 mm, 125 mm and 150 mm SIMOX wafers have been successfully produced by ShanghaiSimgui Technology Co. Ltd, a commercial spin-off of Shanghai Institute of Microsystem and Information Technology(SIMIT), Chinese Academy of Sciences (CAS), and shipped to the semiconductor industry worldwide. This paperpresents an outlook for R & D on SOI technologies, and the recent status and future prospect of SIMOX wafers inChina.展开更多
In this paper,we investigated the dose window of forming a continuous buried oxide(BOX) layer by single implantation at the implantation energy of 200 keV. Then,an improved two-step implantation process with second im...In this paper,we investigated the dose window of forming a continuous buried oxide(BOX) layer by single implantation at the implantation energy of 200 keV. Then,an improved two-step implantation process with second implantation dose of 3×1015 cm-2 was developed to fabricate high quality separation by implanted oxygen(SIMOX) silicon on insulator(SOI) wafers. Compared with traditional single implantation,the implantation dose is reduced by 18.2%. In addition,the thickness and uniformity of the BOX layers were evaluated by spectroscopic ellipsometry. Defect-free top Si as well as atomic-scale sharp top Si/buried oxide interfaces were observed by transmission electron microscopy,indicating a high crystal quality and a perfect structure of the SOI fabricated by two step implantation. The top Si/BOX interface morphology of the SOI wafers fabricated by single or two-step implantation was also investigated by atomic force microscopy.展开更多
基金supported by the Natural Science Foundation of Chongqing Science and Technology Commission (CQ CSTC) of China (Grant No.cstcjjA40008)
文摘A novel silicon-on-insulator （SOI） high-voltage device based on epitaxy-separation by implantation oxygen （SIMOX） with a partial buried n＋-layer silicon-on-insulator （PBN SOI） is proposed in this paper. Based on the proposed expressions of the vertical interface electric field, the high concentration interface charges which are accumu- lated on the interface between top silicon layer and buried oxide layer （BOX） effectively enhance the electric field of the BOX （EI）, resulting in a high breakdown voltage （BV） for the device. For the same thicknesses of top silicon layer （10 μm） and BOX （0.375 μm）, the EI and BV of PBN SOI are improved by 186.5% and 45.4% in comparison with those of the conventional SOI, respectively.
基金Project supported by the National Fund for Distinguished Young Scholars （Grant No 59925205）, the Basic Research Program of Shanghai （Grant No 02DJ14069）, and the National Natural Science Foundation of China （Grant No 10305018）.
文摘The hardening of the buried oxide （BOX） layer of separation by implanted oxygen （SIMOX） silicon-on-insulator （SOI） wafers against total-dose irradiation was investigated by implanting ions into the BOX layers. The tolerance to total-dose irradiation of the BOX layers was characterized by the comparison of the transfer characteristics of SOI NMOS transistors before and after irradiation to a total dose of 2.7 Mrad（SiO2）. The experimental results show that the implantation of silicon ions into the BOX layer can improve the tolerance of the BOX layers to total-dose irradiation. The investigation of the mechanism of the improvement suggests that the deep electron traps introduced by silicon implantation play an important role in the remarkable improvement in radiation hardness of SIMOX SOI wafers.
文摘In recent years, novel structure SOI materials have been fabricated successfully. Also, SiGeOI (SGOI)material, an ideal substrate for realizing strained-silicon structures, has been investigated by modified SIMOX technology.From 2002, the 100 mm, 125 mm and 150 mm SIMOX wafers have been successfully produced by ShanghaiSimgui Technology Co. Ltd, a commercial spin-off of Shanghai Institute of Microsystem and Information Technology(SIMIT), Chinese Academy of Sciences (CAS), and shipped to the semiconductor industry worldwide. This paperpresents an outlook for R & D on SOI technologies, and the recent status and future prospect of SIMOX wafers inChina.
基金supported by the National Science and Technology Major Projects of China (2009ZX02040)the National Basic Research Program of China (2010CB832906)+2 种基金the National Natural Science Foundation of China (60721004 and 61006088)Shanghai Foundation for Development of Science and Technology (08520740100)the Natural Science Foundation of Shanghai (10ZR1436100)
文摘In this paper,we investigated the dose window of forming a continuous buried oxide(BOX) layer by single implantation at the implantation energy of 200 keV. Then,an improved two-step implantation process with second implantation dose of 3×1015 cm-2 was developed to fabricate high quality separation by implanted oxygen(SIMOX) silicon on insulator(SOI) wafers. Compared with traditional single implantation,the implantation dose is reduced by 18.2%. In addition,the thickness and uniformity of the BOX layers were evaluated by spectroscopic ellipsometry. Defect-free top Si as well as atomic-scale sharp top Si/buried oxide interfaces were observed by transmission electron microscopy,indicating a high crystal quality and a perfect structure of the SOI fabricated by two step implantation. The top Si/BOX interface morphology of the SOI wafers fabricated by single or two-step implantation was also investigated by atomic force microscopy.
