The silicon epitaxial wafter for X band double Read-type DDR IMPATT diodes has been fabricatedby normal-low pressure growth technique. The hyperabrupt impurity profile and very thin p-layer, n-layerwere achieved.
A method to improve Ge n＋/p junction diode performance by excimer laser annealing （ELA） and epitaxial Si passi- vation under a low ion implantation dose is demonstrated. The epitaxial Si passivation layer can unpin...A method to improve Ge n＋/p junction diode performance by excimer laser annealing （ELA） and epitaxial Si passi- vation under a low ion implantation dose is demonstrated. The epitaxial Si passivation layer can unpin the Fermi level of the contact of Al/n-Ge to some extent and reduce the contact resistance. In addition, the fabricated Ge n ：/p junction diode by ELA plus epitaxial Si passivation exhibits a decreased reverse current density and an increased forward current density, resulting in a rectification ratio of about 6.5 x 10^6 beyond two orders magnitude larger than that by ELA alone. The reduced specific contact resistivity of metal on n-doped germanium and well-behaved germanium n＋/p diode arc beneficial for the performance improvement of Ge n-MOSFETs and other opto-electronic devices.展开更多
The growth of polycrystalline silicon layers on glass from tin solutions at low temperatures is presented.This approach is based on the steady-state solution growth of Si crystallites on nanocrystalline seed layers, w...The growth of polycrystalline silicon layers on glass from tin solutions at low temperatures is presented.This approach is based on the steady-state solution growth of Si crystallites on nanocrystalline seed layers, which are prepared in a preceding process step. Scanning electron microscopy and atomic force microscopy investigations reveal details about the seed layer surfaces, which consist of small hillocks, as well as about Sn inclusions and gaps along the glass substrate after solution growth. The successful growth of continuous microcrystalline Si layers with grain sizes up to several ten micrometers shows the feasibility of the process and makes it interesting for photovoltaics.展开更多
文摘The silicon epitaxial wafter for X band double Read-type DDR IMPATT diodes has been fabricatedby normal-low pressure growth technique. The hyperabrupt impurity profile and very thin p-layer, n-layerwere achieved.
基金Project supported by the High Level Talent Project of Xiamen University of Technology,China(Grant No.YKJ16012R)
文摘A method to improve Ge n＋/p junction diode performance by excimer laser annealing （ELA） and epitaxial Si passi- vation under a low ion implantation dose is demonstrated. The epitaxial Si passivation layer can unpin the Fermi level of the contact of Al/n-Ge to some extent and reduce the contact resistance. In addition, the fabricated Ge n ：/p junction diode by ELA plus epitaxial Si passivation exhibits a decreased reverse current density and an increased forward current density, resulting in a rectification ratio of about 6.5 x 10^6 beyond two orders magnitude larger than that by ELA alone. The reduced specific contact resistivity of metal on n-doped germanium and well-behaved germanium n＋/p diode arc beneficial for the performance improvement of Ge n-MOSFETs and other opto-electronic devices.
基金Project supported by the German Research Foundation(DFG)(No.BO 1129/5-1)
文摘The growth of polycrystalline silicon layers on glass from tin solutions at low temperatures is presented.This approach is based on the steady-state solution growth of Si crystallites on nanocrystalline seed layers, which are prepared in a preceding process step. Scanning electron microscopy and atomic force microscopy investigations reveal details about the seed layer surfaces, which consist of small hillocks, as well as about Sn inclusions and gaps along the glass substrate after solution growth. The successful growth of continuous microcrystalline Si layers with grain sizes up to several ten micrometers shows the feasibility of the process and makes it interesting for photovoltaics.
