A method to improve Ge n＋/p junction diode performance by excimer laser annealing （ELA） and epitaxial Si passi- vation under a low ion implantation dose is demonstrated. The epitaxial Si passivation layer can unpin...A method to improve Ge n＋/p junction diode performance by excimer laser annealing （ELA） and epitaxial Si passi- vation under a low ion implantation dose is demonstrated. The epitaxial Si passivation layer can unpin the Fermi level of the contact of Al/n-Ge to some extent and reduce the contact resistance. In addition, the fabricated Ge n ：/p junction diode by ELA plus epitaxial Si passivation exhibits a decreased reverse current density and an increased forward current density, resulting in a rectification ratio of about 6.5 x 10^6 beyond two orders magnitude larger than that by ELA alone. The reduced specific contact resistivity of metal on n-doped germanium and well-behaved germanium n＋/p diode arc beneficial for the performance improvement of Ge n-MOSFETs and other opto-electronic devices.展开更多
为寻求以低成本制备n型太阳电池的pn结,进行了Al-17.6wt%Si合金熔体中(001)n型单晶硅衬底上液相外延生长p型掺杂硅实验。所用方法为垂直浸渍法,实验了过冷恒温生长与回熔处理后连续冷却生长两种模式,过程中体系以流动高纯氩保护。对所...为寻求以低成本制备n型太阳电池的pn结,进行了Al-17.6wt%Si合金熔体中(001)n型单晶硅衬底上液相外延生长p型掺杂硅实验。所用方法为垂直浸渍法,实验了过冷恒温生长与回熔处理后连续冷却生长两种模式,过程中体系以流动高纯氩保护。对所得外延生长晶体结构、形貌及所得pn结开路电压进行了分析和测定。结果显示,合金熔体中硅晶体(001)液相外延生长能够实现,但一般呈离散分布的金字塔型岛状生长;只有衬底回熔处理后原位连续降温生长模式可获得连续外延薄膜,之后在其上出现岛状生长,呈现Stranski-Krastanov生长模式。所得连续外延薄膜形成的pn结开路电压比恒温生长所得的提升约100 m V;连续外延薄膜形成后期出现的岛状生长使开路电压明显下降;生长速度提高会使连续降温外延生长pn结开路电压略有降低。展开更多
基金Project supported by the High Level Talent Project of Xiamen University of Technology,China(Grant No.YKJ16012R)
文摘A method to improve Ge n＋/p junction diode performance by excimer laser annealing （ELA） and epitaxial Si passi- vation under a low ion implantation dose is demonstrated. The epitaxial Si passivation layer can unpin the Fermi level of the contact of Al/n-Ge to some extent and reduce the contact resistance. In addition, the fabricated Ge n ：/p junction diode by ELA plus epitaxial Si passivation exhibits a decreased reverse current density and an increased forward current density, resulting in a rectification ratio of about 6.5 x 10^6 beyond two orders magnitude larger than that by ELA alone. The reduced specific contact resistivity of metal on n-doped germanium and well-behaved germanium n＋/p diode arc beneficial for the performance improvement of Ge n-MOSFETs and other opto-electronic devices.
文摘为寻求以低成本制备n型太阳电池的pn结,进行了Al-17.6wt%Si合金熔体中(001)n型单晶硅衬底上液相外延生长p型掺杂硅实验。所用方法为垂直浸渍法,实验了过冷恒温生长与回熔处理后连续冷却生长两种模式,过程中体系以流动高纯氩保护。对所得外延生长晶体结构、形貌及所得pn结开路电压进行了分析和测定。结果显示,合金熔体中硅晶体(001)液相外延生长能够实现,但一般呈离散分布的金字塔型岛状生长;只有衬底回熔处理后原位连续降温生长模式可获得连续外延薄膜,之后在其上出现岛状生长,呈现Stranski-Krastanov生长模式。所得连续外延薄膜形成的pn结开路电压比恒温生长所得的提升约100 m V;连续外延薄膜形成后期出现的岛状生长使开路电压明显下降;生长速度提高会使连续降温外延生长pn结开路电压略有降低。
