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Deep-subwavelength single grooves prepared by femtosecond laser direct writing on Si
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作者 叶瑞熙 黄敏 《Chinese Physics B》 SCIE EI CAS CSCD 2024年第8期108-115,共8页
It is well known that femtosecond laser pulses can easily spontaneously induce deep-subwavelength periodic surface structures on transparent dielectrics but not on non-transparent semiconductors.Nevertheless,in this s... It is well known that femtosecond laser pulses can easily spontaneously induce deep-subwavelength periodic surface structures on transparent dielectrics but not on non-transparent semiconductors.Nevertheless,in this study,we demonstrate that using high-numerical-aperture 800 nm femtosecond laser direct writing with controlled pulse energy and scanning speed in the near-damage-threshold regime,polarization-dependent deep-subwavelength single grooves with linewidths of~180 nm can be controllably prepared on Si.Generally,the single-groove linewidth increases slightly with increase in the pulse energy and decrease in the scanning speed,whereas the single-groove depth significantly increases from~300 nm to~600 nm with decrease in the scanning speed,or even to over 1μm with multi-processing,indicating the characteristics of transverse clamping and longitudinal growth of such deep-subwavelength single grooves.Energy dispersive spectroscopy composition analysis of the near-groove region confirms that single-groove formation tends to be an ultrafast,non-thermal ablation process,and the oxidized deposits near the grooves are easy to clean up.Furthermore,the results,showing both the strong dependence of groove orientation on laser polarization and the occurrence of double-groove structures due to the interference of pre-formed orthogonal grooves,indicate that the extraordinary field enhancement of strong polarization sensitivity in the deep-subwavelength groove plays an important role in single-groove growth with high stability and collimation. 展开更多
关键词 femtosecond-laser direct writing of si deep-subwavelength single grooves polarization dependence high numerical aperture ultrafast non-thermal ablation
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新型电极Mg_(2)SiNi_(3)与Mg_(2)Si的连接和界面行为研究
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作者 陈彦佐 陈少平 +1 位作者 樊文浩 徐礼彬 《热加工工艺》 北大核心 2024年第8期93-97,103,共6页
Mg_(2)Si基热电材料是中温区间最有前途的热电材料之一。为了提高Mg_(2)Si基热电接头的界面性能,提出了一种新型电极材料Mg_(2)SiNi_(3)作为Mg_(2)Si的电极材料,并采用放电等离子烧结技术(SPS)实现了Mg_(2)SiNi_(3)和Mg_(2)Si的连接。同... Mg_(2)Si基热电材料是中温区间最有前途的热电材料之一。为了提高Mg_(2)Si基热电接头的界面性能,提出了一种新型电极材料Mg_(2)SiNi_(3)作为Mg_(2)Si的电极材料,并采用放电等离子烧结技术(SPS)实现了Mg_(2)SiNi_(3)和Mg_(2)Si的连接。同时,测试分析了所得接头的界面微观形貌、界面电性能、力学性能以及稳定性。结果表明,Mg_(2)SiNi_(3)与Mg_(2)Si烧结后形成了完整的冶金结合,界面处各组成元素均实现了均匀过渡;界面接触电阻得到了有效地优化,而且接头以及界面稳定性良好;时效前后,界面性能均未出现大幅的退化。Mg_(2)SiNi_(3)的提出为Mg_(2)Si基热电器件设计和集成提供了一种新的思路。 展开更多
关键词 扩散连接 Mg_(2)si Mg_(2)siNi_(3) 热电接头 界面性能
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直接熔化制备Al-Si-Al_(2)O_(3)复合材料的组织和性能
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作者 赖旭平 李天方 +1 位作者 刘瑞 孙红亮 《热加工工艺》 北大核心 2024年第16期134-136,142,共4页
采用光学显微、XRD、SEM和EDS分析了Si含量分别为10.00wt%、7.64wt%的Al-Si-Al_(2)O_(3)复合材料的显微组织形貌以及物相组成。结果表明:Al-10.00wt%Si试样的组织细小,孔隙率较高。基体晶粒Al呈细小圆形,Si颗粒主要在基体晶界周围聚集长... 采用光学显微、XRD、SEM和EDS分析了Si含量分别为10.00wt%、7.64wt%的Al-Si-Al_(2)O_(3)复合材料的显微组织形貌以及物相组成。结果表明:Al-10.00wt%Si试样的组织细小,孔隙率较高。基体晶粒Al呈细小圆形,Si颗粒主要在基体晶界周围聚集长大,部分向基体晶粒内部生长;而Al-7.64wt%Si试样组织略微粗大,孔隙率较低。基体晶粒Al呈不规则形状,Si颗粒聚集长大现象更为明显。原位反应成功进行,Al-10.00wt%Si复合材料以Al为基体生成的Al_(2)O_(3)是增强相;另一生成物Si没有细小弥散的分布于Al基体中,而是聚集附着在基体Al晶界周围,且有部分SiO_(2)残留存在于基体晶界周围。在加热升温过程中,混合原料只出现了部分熔化现象,金属液滴从混合原料中析出,凝结为含Al量极高的合金液滴。合金液滴致密度较高,固溶体呈枝晶状,Si呈条状或针状;且有小颗粒第二相的存在,含有Al、Si、C元素。 展开更多
关键词 直接熔化 感应加热 显微组织 Al-si-Al_(2)O_(3)复合材料
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Al-50%Si合金电磁定向凝固提纯过程中初晶硅富集行为研究
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作者 刘家旭 张银涛 +5 位作者 唐洪 陈嘉慧 陈广玉 何占伟 赵紫薇 高忙忙 《人工晶体学报》 CAS 北大核心 2024年第7期1186-1195,共10页
采用Al-Si合金提纯制备多晶硅过程中,初晶硅的富集可以有效减少后续酸洗过程中铝和酸的消耗,进而降低高纯初晶硅的分离成本。电磁定向凝固具有工艺简单、可控性强等优点,是目前提纯制备多晶硅最佳方法之一,但各工艺参数对初晶硅的富集... 采用Al-Si合金提纯制备多晶硅过程中,初晶硅的富集可以有效减少后续酸洗过程中铝和酸的消耗,进而降低高纯初晶硅的分离成本。电磁定向凝固具有工艺简单、可控性强等优点,是目前提纯制备多晶硅最佳方法之一,但各工艺参数对初晶硅的富集影响规律还缺乏系统研究。为此,本文研究了初始凝固温度、坩埚初始位置和下移速率对Al-50%Si(质量分数)合金凝固过程中初晶硅富集行为的影响,并对富集区内初晶硅晶粒的形貌进行了表征。结果表明,初始凝固温度为950℃,坩埚初始位置为-5 mm及坩埚下移速率为2 mm/h时,初晶硅主要富集在铸锭的下部区域,最高富集率为79.1%,是最佳的工艺组合。同时,随着初晶硅富集程度的增加,初晶硅晶粒由盘片状向粗大的球状转变,这有利于降低初晶硅的夹杂,并提高其纯度。 展开更多
关键词 AL-si合金 电磁定向凝固 初晶硅 硅富集 温度梯度 初晶硅形貌
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Effect of the Fourth Element on Bonding of Silicon Nitride Ceramics with Y_2O_3-Al_2O_3-SiO_2 Glass Solders 被引量:1
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作者 周飞 《Journal of Rare Earths》 SCIE EI CAS CSCD 2001年第2期90-96,共7页
Bonding of Si 3N 4 ceramic was performed with Y 2O 3 Al 2O 3 SiO 2(YAS) X glass solders,which were mixed with TiO 2 (YT) and Si 3N 4 (YN), respectively. The effects of bonding conditions and interfacial r... Bonding of Si 3N 4 ceramic was performed with Y 2O 3 Al 2O 3 SiO 2(YAS) X glass solders,which were mixed with TiO 2 (YT) and Si 3N 4 (YN), respectively. The effects of bonding conditions and interfacial reaction on the joint strength were studied. The joint strength in different bonding conditions was measured by four point bending tests. The interfacial microstructures were observed and analyzed by SEM, EPMA and XRD. It is shown that with the increase of bonding temperature and holding time, the joint strength increases reaching a peak, and then decreases. When TiO 2 is put into YAS solder,the bonding interface with Si 3N 4/(Y Sialon glass+TiN)/TiN/Y Sialon glass is formed. When YAS solder is mixed with Si 3N 4 powder, the interfacial residual thermal stress may be decreased, and then the joint strength is enhanced. According to microanalyses, the bonding strength is related to interfacial reaction. 展开更多
关键词 rare earths si 3N 4 ceramic YTTRIA titanium oxide oxynitride glass bonding
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Bonding performance of diamond grit to a Co-Si alloy 被引量:1
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作者 孙凤莲 冯吉才 +2 位作者 张杰 于彦东 孙平忠 《China Welding》 EI CAS 1998年第2期35-39,共5页
The bonding performance between synthetic diamond grit and adhesive ( Co-Si alloy) in polycrystalline diamond compact ( PDC) has been investigated. The results indicate that the carbide-forming element Si diffuses tow... The bonding performance between synthetic diamond grit and adhesive ( Co-Si alloy) in polycrystalline diamond compact ( PDC) has been investigated. The results indicate that the carbide-forming element Si diffuses towards the diamond grit and the quantity of Si element in the inter layer of diamond grit-adhesives is about two times higher than that in the other area. New compound SiC exists in the inter layer of diamond-adhesives. The formation of SiC enhances the strength and prolongs the service life of PDC. The sintering time is important to the formation of SiC. 展开更多
关键词 DIAMOND Co-si alloy bonding
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Bonding of Silicon Nitride Ceramic Composite with RE_2O_3Al_2O_3SiO_2 Glass Solders
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作者 周飞 李志章 罗启富 《Journal of Rare Earths》 SCIE EI CAS CSCD 1999年第3期194-199,共6页
Liquid bonding of Si 3N 4 ceramic composite was carried out with RE 2O 3 Al 2O 3 SiO 2 glass solders. The effect of bonding conditions and interfacial reaction on the joint strength was studied. The joint st... Liquid bonding of Si 3N 4 ceramic composite was carried out with RE 2O 3 Al 2O 3 SiO 2 glass solders. The effect of bonding conditions and interfacial reaction on the joint strength was studied. The joint strength under different bonding conditions was measured by four point bending tests. The interfacial microstructures were observed and analyzed by SEM, EPMA and XRD. It is shown that the liquid glass solders react with Si 3N 4 at interface, forming the Si 3N 4/Si 2N 2O/Y(La) sialon glass/Y(La) sialon glass gradient interface. With the increase of bonding temperature and holding time, the joint strength first increased reaching a peak, and then decreased. According to microanalyses, LaYO 3 precipitated from joint glass improves joint strength at room and high temperature. 展开更多
关键词 Rare earths si 3N 4 ceramic composite LANTHANA YTTRIA bonding
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Study of New Way about Si/Si Bonding
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作者 刘玉岭 王新 +3 位作者 张文智 徐晓辉 张德臣 张志花 《Rare Metals》 SCIE EI CAS CSCD 2000年第4期290-296,共7页
A new set of technique was adopted in bonding Si-Si by using Ge (Ⅳ element),which is used as the substitute for the common hydrophilic method. The bond layer has no holes, and the edge bond-rate amounts to above 98%,... A new set of technique was adopted in bonding Si-Si by using Ge (Ⅳ element),which is used as the substitute for the common hydrophilic method. The bond layer has no holes, and the edge bond-rate amounts to above 98%, and the bond strength is above 2156 Pa. By doping the same kind of dopant with low-resistance in Ge, the stress compensation was realized. 展开更多
关键词 si Ge bonding mechanism
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Solid-liquid state pressure bonding of Si_3N_4 ceramics with aluminum based alloys and its mechanism
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作者 邹贵生 吴爱萍 任家烈 《中国有色金属学会会刊:英文版》 CSCD 2001年第2期177-182,共5页
Solid liquid state pressure bonding of Si 3N 4 ceramics with aluminum based alloys, which contain a small amount of intermetallic compounds Al 3Ti or Al 3Zr, was investigated. With this new method, the heat resistant ... Solid liquid state pressure bonding of Si 3N 4 ceramics with aluminum based alloys, which contain a small amount of intermetallic compounds Al 3Ti or Al 3Zr, was investigated. With this new method, the heat resistant properties of the bonding zone metal are improved, and the joints’ strengths at high temperature is increased. The joints’ shear strength at room temperature and at 600 ℃ reach 126~133 MPa and 32~34 MPa, respectively, with suitable bonding pressure. The reaction between aluminum and Si 3N 4 ceramics, which produces Al Si N O type compounds is the dominant interfacial reaction, while the reactions between the second active element Ti or Zr in the aluminum based alloys and Si 3N 4 ceramics also occur to some extend. [ 展开更多
关键词 solid liquid state pressure bonding si 3N 4 ceramics intermetallic compounds high temperature properties
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以Si-CaO/Al_(2)O_(3)-Si为连接层的C/C复合材料扩散连接接头微观组织及其剪切强度
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作者 贾建刚 高康博 王晓昱 《中国有色金属学报》 EI CAS CSCD 北大核心 2023年第3期829-838,共10页
CaO/Al_(2)O_(3)用于SiC之间的扩散连接,具有接头强度高、连接可靠等优点,但CaO/Al_(2)O_(3)与C/C复合材料的润湿性差,不宜直接用于C/C复合材料的扩散连接。为解决C/C复合材料难以焊接以及连接接头强度较低的问题,本文采用Si-CaO/Al_(2)... CaO/Al_(2)O_(3)用于SiC之间的扩散连接,具有接头强度高、连接可靠等优点,但CaO/Al_(2)O_(3)与C/C复合材料的润湿性差,不宜直接用于C/C复合材料的扩散连接。为解决C/C复合材料难以焊接以及连接接头强度较低的问题,本文采用Si-CaO/Al_(2)O_(3)-Si复合夹层作为连接层,对C/C复合材料进行扩散连接,通过Si与C/C在高温下反应生成SiC以及SiC与CaO/Al_(2)O_(3)之间的相互作用,获得高强度接头。结果表明,随着保温时间的延长,接头的剪切强度先升高后下降。1500℃保温90 min的接头,剪切强度达到38.17 MPa,连接接头内部形成“富Si的过渡层-中间层-富Si的过渡层”对称结构,接头中生成的物相主要包含SiC以及由Al_(2)SiO_(5)、SiO_(2)、CaAl_(4)O_(7)等构成的复合玻璃相,剪切断裂主要发生在C/C基体上,说明接头强度及其与基体的结合强度超过了基体强度,是一种非常可靠的连接方式。 展开更多
关键词 si-CaO/Al_(2)O_(3)-si夹层 C/C复合材料 扩散连接 微观组织 剪切强度
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主轴转向对再生Al-Si-Fe-Mg合金多道次搅拌摩擦加工区组织和性能的影响
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作者 龚航 刘厚根 +1 位作者 陈立 宋斌 《机械工程材料》 CAS CSCD 北大核心 2023年第9期33-40,共8页
对4.5 mm厚的再生Al-7.0Si-0.85Fe-0.30Mg合金板进行相同主轴转向1~3道次和改变第2道次主轴转向2,3道次的搅拌摩擦加工,研究了主轴转向对搅拌摩擦加工区组织和力学性能的影响。结果表明:随着加工道次的增加,加工区的面积以及前进侧热机... 对4.5 mm厚的再生Al-7.0Si-0.85Fe-0.30Mg合金板进行相同主轴转向1~3道次和改变第2道次主轴转向2,3道次的搅拌摩擦加工,研究了主轴转向对搅拌摩擦加工区组织和力学性能的影响。结果表明:随着加工道次的增加,加工区的面积以及前进侧热机影响区的宽度增大,加工核心区的富铁相、共晶硅等第二相颗粒长度减小,圆整度提高,强度和硬度无显著改变,断后伸长率显著提高。改变第2道次主轴转向后加工区面积较相同主轴转向时减小,但组织对称性提高,前进侧热机影响区宽度减小;改变主轴转向后,第二相颗粒尺寸变化不明显,但圆整度显著降低,强度和硬度的变化也不明显,断后伸长率略有提高。 展开更多
关键词 搅拌摩擦加工 再生Al-Fe-si-Mg合金 主轴转向 富铁相 拉伸性能
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Reconstruction of broken Si–O–Si bonds in iron ore tailings (IOTs) in concrete 被引量:12
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作者 Juan-hong Liu Yu-cheng Zhou +1 位作者 Ai-xiang Wu Hong-jiang Wang 《International Journal of Minerals,Metallurgy and Materials》 SCIE EI CAS CSCD 2019年第10期1329-1336,共8页
This paper reports a study on the reconstruction of broken Si O Si bonds in iron ore tailings (IOTs) in concrete. Limestone and IOTs were used to investigate the influence of different types of coarse aggregates on th... This paper reports a study on the reconstruction of broken Si O Si bonds in iron ore tailings (IOTs) in concrete. Limestone and IOTs were used to investigate the influence of different types of coarse aggregates on the compressive strengths of concrete samples. The dif- ferences in interfacial transition zones (ITZs) between aggregate and paste were analyzed by scanning electron microscopy (SEM) and ener- gy-dispersive spectroscopy (EDS). Meanwhile, X-ray diffraction (XRD) and infrared spectroscopy (IR) were used to study microscopic changes in limestone and IOTs powders in a simple alkaline environment that simulated cement. The results show that the compressive strengths of IOTs concrete or paste are higher than those of limestone concrete or paste under identical conditions. The Ca/Si atom ratios in the ITZs of IOTs con- crete samples are lower than those of limestone concrete;the diffraction peak of the calcium silicate phase at 2θ = 29.5°, as well as the bands of Si O bonds shifting to lower wavenumbers, indicates reconstruction of the broken Si-O-Si bonds on the surfaces of IOTs with Ca(OH)2. 展开更多
关键词 iron ore TAILINGS broken si O si bondS ALKALINE environment RECONSTRUCTION
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Ni-Cr-B-Si合金预连接金刚石磨粒及其阻焊的研究
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作者 刘明超 王超 +1 位作者 高子伟 马伯江 《青岛科技大学学报(自然科学版)》 CAS 2023年第4期84-89,共6页
利用Ni-Cr-B-Si合金预连接金刚石,然后阻焊焊接在基体上,旨在为有序排布的金刚石工具磨粒的精确固定或焊补修复工具损毁磨粒服务。利用扫描电子显微镜(SEM)、能谱仪(EDS)、X射线衍射仪(XRD)、拉曼光谱仪对处理后的金刚石磨粒进行表征,... 利用Ni-Cr-B-Si合金预连接金刚石,然后阻焊焊接在基体上,旨在为有序排布的金刚石工具磨粒的精确固定或焊补修复工具损毁磨粒服务。利用扫描电子显微镜(SEM)、能谱仪(EDS)、X射线衍射仪(XRD)、拉曼光谱仪对处理后的金刚石磨粒进行表征,采用磨削试验评定其磨削性能。研究表明:在1050℃保温60 s的预连接工艺下,金刚石表面生成Cr7C3和Cr3C2两种碳化物;阻焊后金刚石磨粒仍然棱角分明,预连接层与基体结合良好;阻焊金刚石所受最大压应力为0.46 GPa,对比样钎焊金刚石所受最大压应力为0.13 GPa,阻焊金刚石受到的把持力更强;磨削试验显示,阻焊金刚石对加工材料的去除量高于钎焊金刚石,表现出更好的磨削性能。 展开更多
关键词 Ni-Cr-B-si合金 金刚石 预连接 阻焊 有序排布
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Simultaneously removal of P and B from Si by Sr and Zr co-addition during Al–Si low-temperature solvent refining
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作者 Chen Chen Jingwei Li +2 位作者 Qiuxia Zuo Boyuan Ban Jian Chen 《International Journal of Minerals,Metallurgy and Materials》 SCIE EI CAS CSCD 2023年第2期365-377,共13页
To remove the key impurity elements,P and B,from primary Si simultaneously,Sr and Zr co-addition to Al-Si alloy systems during solvent refining has been investigated.Sr reacts with Al,Si,and P in the melt to form a P-... To remove the key impurity elements,P and B,from primary Si simultaneously,Sr and Zr co-addition to Al-Si alloy systems during solvent refining has been investigated.Sr reacts with Al,Si,and P in the melt to form a P-containing Al_(2)Si_(2)Sr phase and Zr reacts with B to form a ZrB_(2) phase.In the Al-Si-Sr-Zr system,high removal fractions of P and B in the primary Si,with 84.8%-98.4%and 90.7%-96.7%,respectively,are achieved at the same time,respectively.The best removal effect is obtained in the sample with the addition of Sr-32000+Zr-3000μg·kg^(-1),and the removal fractions of P and B in the purified Si reach 98.4%and 96.1%.Compared with the Sr/Zr single-addition,the removal effects of Sr and Zr co-addition on P and B do not show a significant downward trend,indicating that the nucleation and growth of the B/P-containing impurity phases are mutually independent.Finally,an evolution model is proposed to describe the nucleation and the growth stages of Sr/Zr-containing compound phases,which reveals the interaction between the impurity phases and the primary Si. 展开更多
关键词 Al2si2Sr phase zirconium boride phase phase directional solidification solvent refining
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石墨烯压力传感器Au-Si共晶键合的气密性封装
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作者 吴天金 王俊强 《电子元件与材料》 CAS 北大核心 2023年第5期539-544,共6页
针对石墨烯压力传感器的高气密性封装要求,设计了一种应用于石墨烯压力传感器的Au-Si键合工艺。采用Au-Si键合工艺只需要在传感器的密封基板表面生长一层100 nm的SiO_(2),并在生长的SiO_(2)表面溅射金属密封环,密封环金属采用50 nm/300... 针对石墨烯压力传感器的高气密性封装要求,设计了一种应用于石墨烯压力传感器的Au-Si键合工艺。采用Au-Si键合工艺只需要在传感器的密封基板表面生长一层100 nm的SiO_(2),并在生长的SiO_(2)表面溅射金属密封环,密封环金属采用50 nm/300 nm的Ti/Au。使用倒装焊机在380℃以及16 kN的压力环境下保持20 min完成传感器芯片与基板的键合,实现石墨烯压力传感器的气密性封装。键合完成后对键合指标进行表征测试,平均剪切力可达19.596 MPa,平均泄露率为4.589×10^(-4) Pa·cm3/s。通过对键合前后石墨烯传感器芯片电阻检测,电阻输出平均值变化了3.36%,键合前后电阻输出相对稳定。对传感器进行静态压力检测,其灵敏度>0.3 kΩ/MPa,非线性<1%FS。实验结果表明,石墨烯压力传感器采用Au-Si键合工艺进行气密封装不仅工艺简单,且强度高。 展开更多
关键词 Au-si键合 石墨烯 压力传感器 气密封装
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SYNTHESIS AND CHARACTERISTIC OF POLYSILANES CONTAINING Si-H BOND 被引量:1
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作者 Ying Kui LI Zhao Hui CHEN 《Chinese Chemical Letters》 SCIE CAS CSCD 1992年第10期799-800,共2页
Three kinds of polysilanes containing Si-H bond, ■CH_3SiCH_3■_x■CH_3SiH■_y■_n and■PhSiPh■_π■CH_3SiH■_y■CH_3SiCH_3■, have been synthesized. The structures of these copolymers were investigated by IR, ~1H-NM... Three kinds of polysilanes containing Si-H bond, ■CH_3SiCH_3■_x■CH_3SiH■_y■_n and■PhSiPh■_π■CH_3SiH■_y■CH_3SiCH_3■, have been synthesized. The structures of these copolymers were investigated by IR, ~1H-NMR and ^(13)C-NMR and their molecular weights were measured. 展开更多
关键词 Figure SYNTHEsiS AND CHARACTERISTIC OF POLYsiLANES CONTAINING si-H bond si
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In-situ observation of porosity formation during directional solidification of Al-Si casting alloys 被引量:2
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作者 Zhao Lei Liao Hengcheng +2 位作者 Pan Ye Wang Qigui Sun Guoxiong 《China Foundry》 SCIE CAS 2011年第1期14-18,共5页
In-situ observation of porosity formation during directional solidification of two Al-Si alloys (7%Si and 13%Si) was made by using of micro-focus X-ray imaging.In both alloys,small spherical pores initially form in th... In-situ observation of porosity formation during directional solidification of two Al-Si alloys (7%Si and 13%Si) was made by using of micro-focus X-ray imaging.In both alloys,small spherical pores initially form in the melt far away from the eutectic solid-liquid (S/L) interface and then grow and coagulate during solidification.Some pores can float and escape from the solidifying melt front at a relatively high velocity.At the end of solidification,the remaining pores maintain spherical morphology in the near eutectic alloy but become irregular in the hypoeutectic alloy.This is attributed to different solidification modes and aluminum dendrite interactions between the two alloys.The mechanism of the porosity formation is briefly discussed in this paper. 展开更多
关键词 在原处观察 孔形成 扔合金的 Al-si 微焦点的 X 光检查 方向性的团结
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Effect of Sr content on porosity formation in directionally solidified Al-12.3wt.%Si alloy 被引量:1
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作者 Liao Hengcheng Wu Yuna +1 位作者 Fan Ran Wang Qigui 《China Foundry》 SCIE CAS 2014年第5期435-439,共5页
The influence of Sr addition on pore formation in directionally solidified Al-12.3wt.% alloy was investigated using X-ray detection, optical microscope, and SEM-EDX. Results indicate that addition of Sr significantly ... The influence of Sr addition on pore formation in directionally solidified Al-12.3wt.% alloy was investigated using X-ray detection, optical microscope, and SEM-EDX. Results indicate that addition of Sr significantly increases the number density and volume fraction of porosity. The considerable rise in volume fraction of porosity is attributed to the remarkable increase in the numbers of pores formed. It is found that Sr solute in liquid Al-Si alloy can diffuse into the oxide inclusions to form loose oxide aggregations which have more activity as the nucleation sites for porosity. Adding more Sr considerably increases the numbers of active nucleation sites. There is an obvious fluctuation of pore number density during steady state solidification, which is believed to be related to a fluctuation of local hydrogen supersaturation induced by the competition of pore nucleation and growth for hydrogen solute supplement. 展开更多
关键词 Al-si alloy porosity OXIDES pore formation STRONTIUM directional solidification
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Microstructure Development of Directionally Solidified Nb-Ti-Si Based Ultrahigh Temperature Alloy 被引量:1
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作者 Guo Haisheng Guo Xiping Yao Chengfang 《稀有金属材料与工程》 SCIE EI CAS CSCD 北大核心 2009年第A03期24-27,共4页
Integrally directional solidification of an Nb-Ti-Si based ultrahigh temperature alloy was performed in an ultrahigh temperature and high thermal gradient furnace with the use of ceramic crucibles. The microstructural... Integrally directional solidification of an Nb-Ti-Si based ultrahigh temperature alloy was performed in an ultrahigh temperature and high thermal gradient furnace with the use of ceramic crucibles. The microstructural evolution with the withdrawing rate increasing during directional solidification was revealed. The integrally directionally solidified microstructure was composed of couple grown lamellar (Nbss+(Nb,X)5Si3) eutectic colonies and a few hexagonally cross-sectioned (Nb,X)5Si3 columns (X represents Ti and Hf elements). All the directionally solidified microstructure was straightly aligned along the longitudinal axis of the specimens. With increasing of the withdrawing rate, the average diameter of the eutectic cells and inter lamella spacings in the eutectic cell decreased. The near-planar solid/liquid interface appeared when the withdrawing rate was 1μm/s, and the cellular solid/liquid interface formed when the withdrawing rate was 5 μm/s. 展开更多
关键词 超高温合金 物理性能 热梯度 定向凝固组织
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Laser Direct Writing of Ag Films from Solution on Si Substrate
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作者 KeSUN CaibeiZHANG YanZHAO 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2003年第6期634-636,共3页
Pulsed Nd:YAG laser was used to irradiate Si substrate immersed in AgNO3 ethylene glycol solution to deposit Ag films along the lines scanned by laser on the substrate, which is a photo-thermal decomposing process. Th... Pulsed Nd:YAG laser was used to irradiate Si substrate immersed in AgNO3 ethylene glycol solution to deposit Ag films along the lines scanned by laser on the substrate, which is a photo-thermal decomposing process. The decomposed Ag atoms congregate and form polycrystalline Ag particles. The Ag concentration changes greatly with the total laser energyA absorbed by substrate. Transmission electron microscopy (TEM) observation shows the Ag particles are inlaid in the Si substrate. Auger electron spectrum (AES) shows that the Ag concentration decreases with the increase of the sputtering depth, and there is no oxygen element on the surface of the deposited Ag films. 展开更多
关键词 Pulsed Nd:YAG laser Laser direct writing Ag deposited film si substrate
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