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DEEP LEVEL DEFECTS IN SI-IMPLANTED LEC UNDOPED Si-GaAs
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作者 粱振宪 罗晋生 《Journal of Electronics(China)》 1991年第3期276-282,共7页
The residual electrically active defects in(4×10<sup>12</sup>cm<sup>-2</sup>(30KeV)+5×10<sup>12</sup>cm<sup>-2</sup>(130KeV))si-implanted LEC undoped si-Ga... The residual electrically active defects in(4×10<sup>12</sup>cm<sup>-2</sup>(30KeV)+5×10<sup>12</sup>cm<sup>-2</sup>(130KeV))si-implanted LEC undoped si-GaAs activated by two-step rapid thermal annealing(RTA)LABELED AS 970℃(9S)+750℃(12S)have been investigated with deep level transient spec-troscopy(DLTS).Two electron traps ET<sub>1</sub>(E<sub>c</sub>-0.53eV,σ<sub>n</sub>=2.3×10<sup>-16</sup>cm<sup>2</sup>)and ET<sub>2</sub>(E<sub>c</sub>-0.81eV,σ<sub>n</sub>=9.7×10(-13)cm<sup>2</sup>)are detected.Furthermore,the noticeable variations of trap’s con-centration and energy level in the forbidden gap with the depth profile of defects induced by ion im-plantation and RTA process have also been observed.The[As<sub>i</sub>·V<sub>As</sub>·As<sub>Ga</sub>]and[V<sub>As</sub>·As<sub>i</sub>·V<sub>Ga</sub>·As<sub>Ga</sub>]are proposed to be the possible atomic configurations of ET<sub>1</sub> and ET<sub>2</sub>,respectively to explaintheir RTA behaviors. 展开更多
关键词 si:gaas Rapid thermal ANNEALING Ion IMPLANTATION Deep level
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