Effect of Ni content on the wear behavior of Al-Si-Cu-Mg-Ni/SiC particles composites

In recent years,the addition of Ni has been widely acknowledged to be capable of enhancing the mechanical properties of Al-Si alloys.However,the effect of Ni on the wear behaviors of Al-Si alloys and Al matrix composites,particularly at elevated temperat-ures,remains an understudied area.In this study,Al-Si-Cu-Mg-Ni/20wt%SiC particles(SiCp)composites with varying Ni contents were prepared by using a semisolid stir casting method.The effect of Ni content on the dry sliding wear behavior of the prepared compos-ites was investigated through sliding tests at 25 and 350℃.Results indicated that theθ-Al_(2)Cu phase gradually diminished and eventually disappeared as the Ni content increased from 0wt%to 3wt%.This change was accompanied by the formation and increase inδ-Al_(3)CuNi andε-Al_(3)Ni phases in microstructures.The hardness and ultimate tensile strength of the as-cast composites improved,and the wear rates of the composites decreased from 5.29×10^(−4)to 1.94×10^(−4)mm^(3)/(N∙m)at 25℃and from 20.2×10^(−4)to 7×10^(−4)mm^(3)/(N∙m)at 350℃with the increase in Ni content from 0wt%to 2wt%.The enhancement in performance was due to the presence of strengthening network structures and additional Ni-containing phases in the composites.However,the wear rate of the 3Ni composite was approximately two times higher than that of the 2Ni composite due to the fracture and debonding of theε-Al_(3)Ni phase.Abrasive wear,delamination wear,and oxidation wear were the predominant wear mechanisms of the investigated composites at 25℃,whereas delamination wear and oxid-ation wear were dominant during sliding at 350℃.

Multi-scale Modeling and Finite Element Analyses of Thermal Conductivity of 3D C/SiC Composites Fabricating by Flexible-Oriented Woven Process

Thermal conductivity is one of the most significant criterion of three-dimensional carbon fiber-reinforced SiC matrix composites(3D C/SiC).Represent volume element(RVE)models of microscale,void/matrix and mesoscale proposed in this work are used to simulate the thermal conductivity behaviors of the 3D C/SiC composites.An entirely new process is introduced to weave the preform with three-dimensional orthogonal architecture.The 3D steady-state analysis step is created for assessing the thermal conductivity behaviors of the composites by applying periodic temperature boundary conditions.Three RVE models of cuboid,hexagonal and fiber random distribution are respectively developed to comparatively study the influence of fiber package pattern on the thermal conductivities at the microscale.Besides,the effect of void morphology on the thermal conductivity of the matrix is analyzed by the void/matrix models.The prediction results at the mesoscale correspond closely to the experimental values.The effect of the porosities and fiber volume fractions on the thermal conductivities is also taken into consideration.The multi-scale models mentioned in this paper can be used to predict the thermal conductivity behaviors of other composites with complex structures.

Tensile Mechanical Behavior and Failure Mechanism of a Plain-Woven SiCf/SiC Composites at Room and Elevated Temperatures

Ceramic matrix composites (CMCs) are the preferred materials for solving advanced aerospace high-temperature structural components;it has the comprehensive advantages of higher temperature (~1500˚C) and low density. In service environments, CMCs exhibit complex damage mechanisms and failure modes, which are affected by constituent materials, meso-architecture and inhere defects. In this paper, the in-plane tensile mechanical behavior of a plain-woven SiCf/SiC composite at room and elevated temperatures was investigated, and the factors affecting the tensile strength of the material were discussed in depth. The results show that the tensile modulus and strength of SiCf/SiC composites at high temperature are lower, but the fracture strain increases and the toughness of the composites is enhanced;the stitching holes significantly weaken the tensile strength of the material, resulting in the material is easy to break at the cross-section with stitching holes.

Microstructure and thermophysical properties of SiC/Al composites mixed with diamond

The thermophysical properties of the SiC /Al composites mixed with diamond（SiC-Dia/Al） were studied through theoretical calculation and experiments. The thermal conductivity and the thermal expansion coefficient of the SiC-Dia/Al were calculated by differential effective medium（DEM） theoretical model and extended Turner model, respectively. The microstructure of the SiC-Dia/Al shows that the combination between SiC particles and Al is close, while that between diamond particles and Al is not close. The experimental results of the thermophysical properties of the SiC-Dia/Al are consistent with the calculated ones. The calculation results show that when the volume ratio of the diamond particles to the SiC particles is 3：7, the thermal conductivity and the thermal expansion coefficient can be improved by 39% and 30% compared to SiC/Al composites, respectively. In other words, by adding a small amount of diamond particles, the thermophysical properties of the composites can be improved effectively, while the cost increases little.

Microstructure and properties of Al/Si/SiC composites for electronic packaging

The Al/Si/SiC composites with medium volume fraction for electronic packaging were fabricated by gas pressure infiltration.On the premise of keeping the machinability of the composites,the silicon carbide particles,which have the similar size with silicon particles（average 13 μm）,were added to replace silicon particles of same volume fraction,and microstructure and properties of the composites were investigated.The results show that reinforcing particles are distributed uniformly and no apparent pores are observed in the composites.It is also observed that higher thermal conductivity（TC） and flexural strength will be obtained with the addition of SiC particles.Meanwhile,coefficient of thermal expansion（CTE） changes smaller than TC.Models for predicting thermal properties were also discussed.Equivalent effective conductivity（EEC） was proposed to make H-J model suitable for hybrid particles and multimodal particle size distribution.

Microstructures and properties of Al-50%SiC composites for electronic packaging applications

Al？50%SiC （volume fraction） composites containing different sizesofSiC particles （average sizesof 23, 38 and 75 μm） were prepared by powder metallurgy. The influences of SiC particle sizes and annealing on the propertiesof the compositeswere investigated. The results show that SiC particles are distributed uniformly in the Al matrix. The coarse SiC particles result in higher coefficient of thermal expansion （CTE） and higher thermal conductivity （TC）, while fine SiC particles decrease CTE and improve flexural strength of the composites. The morphology and size of SiC particles in the composite are not influenced by the annealing treatment at 400℃for 6h. However, the CTE and the flexural strength of annealed composites are decreased slightly, and the TCis improved. The TC, CTE and flexural strength of the Al/SiC composite with averageSiC particlesize of75 μm are 156 W/（m·K）, 11.6×10^-6K^-1 and 229 MPa, respectively.

Effect of heat treatment on microstructure and thermophysical properties of diamond/2024 Al composites

50%diamond particle （5μm） reinforced 2024 aluminum matrix （diamond/2024 Al） composites were prepared by pressure infiltration method. Diamond particles were distributed uniformly without any particle clustering, and no apparent porosities or significant casting defects were observed in the composites. The diamond-Al interfaces of as-cast and annealed diamond/2024 Al composites were clean, smooth and free from interfacial reaction product. However, a large number of Al2Cu precipitates were found at diamond-Al interface after aging treatment. Moreover, needle-shaped Al2MgCu precipitates in Al matrix were observed after aging treatment. The coefficient of thermal expansion （CTE） of diamond/2024 Al composites was about 8.5×10-6 °C-1 between 20 and 100 °C, which was compatible with that with chip materials. Annealing treatment showed little effect on thermal expansion behavior, and aging treatment could further decrease the CTE of the composites. The thermal conductivity of obtained diamond/2024 Al composites was about 100 W/（m？K）, and it was slightly increased after annealing while decreased after aging treatment.

Microstructure and interface thermal stability of C/Mo double-coated SiC fiber reinforced γ-TiAl matrix composites

C/Mo duplex coating interfacially modified SiC fiber-reinforced γ-TiAl matrix composite （SiCf/C/Mo/γ-TiA1） was prepared by foil-fiber-foil method to investigate its interfacial modification effect. SiCf/C/TiAl composites were also prepared under the same processing condition for comparision. Both kinds of the composites were thermally exposed in vacuum at 800 and 900℃ for different durations in order to study thermal stability of the interfacial zone. With the aids of scanning electron microscope （SEM） and energy dispersive spectrometer （EDS）, the interracial microstructures of the composites were investigated. The results reveal that, although adding the Mo coating, the interfacial reaction product of the SiCf/C/Mo/TiAl composite is the same with that of the SiCf/C/TiA1 composite, which is TiC/Ti2AlC between the coating and the matrix. However, C/Mo duplex coating is more efficient in hindering interfacial reaction than C single coating at 900 ℃ and below. In addition, a new layer of interfacial reaction product was found between Ti2AlC and the matrix after 900 ℃, 200 h thermal exposure, which is rich in V and close to the chemical composition of B2 phase.

Experimental study and numerical analysis on dry friction and wear performance of co-continuous SiC/Fe-40Cr against SiC/2618 Al alloy composites

The dry friction and wear behaviors of co-continuous composites SiC/Fe–40Cr against SiC/Al 2618 alloy were investigated on a ring-on-ring friction and wear tester at sliding speed of 30-105 m/s under the load of 1.0-2.5 MPa. The experimental result reveals that the characteristic of two body abrasive wear and oxidation wear mechanisms are present for SiCn/2618 Al composite under higher load and sliding speed. SiC ceramic continuous network as the reinforcement can avoid composite from the third body wear that usually occurs in traditional particle reinforced composite. The mechanically mixed layer (MML) controls greatly the wear rate and friction coefficient of the composites. The composites tested at higher sliding speed exhibit higher value of friction coefficient and fluctuation, which is associated with the intermittent formation and removal of the MML. The wear and stress—strain behaviors of SiCn/Fe–40Cr against SiCn/Al 2168 at 30-105 m/s under 1.0-2.5 MPa were analyzed by finite element method with the software Solidwork2012 Simulation, respectively. The wear and stress–strain behavior of the composite predicted by the FEM correlated well with the experimental results.

Effects of thermal oxidation on microwave-absorbing and mechanical properties of SiC_f/SiC composites with PyC interphase

The SiCf/SiC composites containing PyC interphase were prepared by chemical vapor infiltration process. The influences of thermal oxidation on the complex permittivity and microwave absorption properties of Si Cf/Si C composites were investigated in the frequency range of 8.2-12.4 GHz. Both the real and imaginary parts of the complex permittivity decreased after thermal oxidation. The composites after 100 h thermal oxidation showed that reflection loss exceeded-10 d B in the frequency of 9.7-11.9 GHz and the minimum value was-11.4 d B at 11.0 GHz. The flexural strength of composites decreased but fracture behavior was improved obviously after thermal oxidation. These results indicate that the SiCf/SiC composites containing PyC interphase after thermal oxidation possess good microwave absorbing property and fracture behavior.

INVESTIGATION ON MECHANICAL PROPERTIES OF ZN-AL/SIC PARTICULATE COMPOSITES

In order to improve the properties of ZA 27 and ZA4-3 zinc alloys and broaden their application ranges,SiC particlj1Ale composites, prepared by means of rheological casting technology, are investigated individually on their rT..t'llanical properties. The results of ne-cural strength, impact strensttl, compressive strength, hardness values and wear rate of the composites show that the addition of SiCp, leads to the increase of the compressive strength and hardness values at both room and higher temperature, and wear resistance of the materials, accompanying with the slight decrease of the fie-cural strength and sharp reduction of the impacttoughness. The factors affecting the mechanical properties of the composites are discussed in the paper.

Microstructures and mechanical properties of 2024Al/Gr/SiC hybrid composites fabricated by vacuum hot pressing

The 2024Al/Gr/SiC hybrid composite plates with 5%-10% SiC particles （volume fraction） and 3%-6% flaky graphite （Gr） （volume fraction） were fabricated by vacuum hot pressing and hot extrusion processing. The effects of SiC and Gr on the microstructures and mechanical properties of the composites aged at 160, 175 and 190℃ were studied by optical microscopy, scanning electron microscopy （SEM）, and hardness and tensile tests. The results indicate that the SiC particles have a more obvious effect on accelerating the aging response as compared with the Gr. Both the tensile strength and elongation are reduced by the Gr and SiC particles added into the matrix, while the Gr has a more negative influence on the elongation than the SiC particles. The tensile strength （ab）, yield stress （as） and elongation （δ） of the 2024Al/3Gr/10SiC composite aged at 165℃ for 8 h are 387 MPa, 280.3 MPa and 5.7%, respectively. The hybrid composites are characterized by ductile fracture, which is associated with the ductile fracture of the matrix and the tearing of the interface between the matrix and the particles.

Laser-weldable Si_p-SiC_p/Al hybrid composites with bilayer structure for electronic packaging

Laser-weldable Sip-SiCp/Al hybrid composites with high volume fraction （60%-65%） of SiC reinforcement were fabricated by compression moulding and vacuum gas pressure infiltration technology. Microscopic observation displayed that the Sip-SiCp/Al hybrid composites with bilayer structure were compact without gas pores and the intergradation between Sip/Al layer and SiCp/Al layer was homogeneous and continuous. Further investigation revealed that the Sip-SiCp/Al hybrid composites possessed low density （2.96 g/cm^3）, high gas tightness （1.0 mPa·cm^3）/s）, excellent thermal management function as a result of high thermal conductivity （194 W/（m·K） and low coefficient of thermal expansion （7.0×10^-6 K-1）. Additionally, Sip-SiCp/Al hybrid composites had outstanding laser welding adaptability, which is significantly important for electronic packaging applications. The gas tightness of components after laser welding （48 mPa·cm^3）/s） can well match the requirement of advanced electronic packaging. Several kinds of these precision components passed tests and were put into production.

Effects of dip-coated BN interphase on mechanical properties of SiC_f/SiC composites prepared by CVI process

BN interphase was successfully synthesized on SiC fiber fabrics by dip-coating process using boric acid and urea as precursors under N2 atmosphere. The morphology of BN interphase was observed by SEM, and the structure was characterized by XRD and FT-IR spectra. The SiCf/SiC composites with dip-coated BN interphase were fabricated by chemical vapor infiltration （CVI） process, and the effects ofBN interphase on the mechanical properties of composites were investigated. The results show that the SiC fibers are fully covered by BN interphase with smooth surface and turbostratic structure （t-BN）, and the thickness is about 0.4 μm. The flexural strengths of SiCf/SiC composites with and without BN interphase are about 180 and 95 MPa, respectively. Compared with the as-received SiCf/SiC composites, the composites with BN interphase exhibit an obvious toughened fracture behavior. From the microstructural analysis, it can be confirmed that the BN interphase plays a key part in protecting the fibers from chemical attack during matrix infiltration and weakening interfacial bonding, which can improve the mechanical properties of SiCf/SiC composites remarkably.

Damping properties and mechanism of aluminum matrix composites reinforced with glass cenospheres

The damping properties were improved by preparing Al matrix composites reinforced with glass cenospheres through the pressure infiltration method.Transmission electron microscopy and scanning electron microscopy were employed to characterize the microstructure of the composites.The low-frequency damping properties were examined by using a dynamic mechanical thermal analyzer,aiming at exploring the changing trend of damping capacity with strain,temperature,and frequency.The findings demonstrated that the damping value rose as temperature and strain increased,with a maximum value of 0.15.Additionally,the damping value decreased when the frequency increased.Dislocation damping under strain and interfacial damping under temperature served as the two primary damping mechanisms.The increase in the density of dislocation strong pinning points following heat treatment reduced the damping value,which was attributed to the heat treatment enhancement of the interfacial bonding force of the composites.

Microstructure,interfacial reaction behavior,and mechanical properties of Ti_(3)AlC_(2)reinforced Al6061 composites

The interfacial reaction behavior of Al and Ti_(3)AlC_(2)at different pouring temperatures and its effect on the microstructure and mechanical properties of the composites were investigated.The results show that the addition of3.0 wt.%Ti_(3)AlC_(2)refines the average grain size ofα(Al)in the composite by 50.1%compared to Al6061 alloy.Morphological analyses indicate that an in-situ Al_(3Ti)transition layer of-180 nm in thickness is generated around the edge of Ti_(3)AlC_(2)at 720℃,forming a well-bonded Al-Al_(3Ti)interface.At this processing temperature,the ultimate tensile strength of A16061-3.0 wt.%Ti_(3)AlC_(2)composite is 199.2 MPa,an improvement of 41.5%over the Al6061 matrix.Mechanism analyses further elucidate that 720℃is favourable for forming the nano-sized transition layer at the Ti_(3)AlC_(2)edges.And,the thermal mismatch strengthening plays a dominant role in this state,with a strengthening contribution of about 74.8%.

Microstructure evolution,mechanical properties and fracture behavior of Al-xSi/AZ91D bimetallic composites prepared by a compound casting

In this paper,the effect of the Si content on microstructure evolution,mechanical properties,and fracture behavior of the Al-xSi/AZ91D bimetallic composites prepared by compound casting was investigated systematically.The obtained results showed that all the Al-xSi/AZ91D bimetallic composites had a metallurgical reaction layer(MRL),whose thickness increased with increasing Si content for the hypoeutectic Al-Si/AZ91D composites,while the hypereutectic Al-Si/AZ91D composites were opposite.The MRL included eutectic layer(E layer),intermetallic compound layer(IMC layer)and transition region layer(T layer).In the IMC layer,the hypereutectic Al-Si/AZ91D composites contained some Si solid solution and flocculent Mg_(2)Si+Al-Mg IMCs phases not presented in the hypoeutectic Al-Si/AZ91D composites.Besides,increasing Si content,the thickness proportion of the T layer increased,forming an inconsistent preferred orientation of the MRL.The shear strengths of the Al-xSi/AZ91D bimetallic composites enhanced with increasing Si content,and the Al-15Si/AZ91D composite obtained a maximum shear strength of 58.6 MPa,which was 73.4% higher than the Al-6Si/AZ91D composite.The fractures of the Al-xSi/AZ91D bimetallic composites transformed from the T layer into the E layer with the increase of the Si content.The improvement of the shear strength of the Al-xSi/AZ91D bimetallic composites was attributed to the synergistic action of the Mg_(2)Si particle reinforcement,the reduction of oxidizing inclusions and the ratio of Al-Mg IMCs as well as the orientation change of the MRL.

Particle Removal Mechanism of High Volume Fraction SiCp/Al Composites by Single Diamond Grit Tool

Particle removal mechanism was presented during machining particle SiC/Al composites with diamond grinding tool. The relevant removal modes and their mechanisms were discussed considering the impact and squeezing effect of diamond grit on the SiC particle. The experimental results show that the aluminum matrix has larger plastic deformation, so the aluminum mixed with the surplus SiC particles is cut from the surface. The SiC particles can be removed in multiple ways, such as broken/fractured, micro cracks, shearing and pulled out, etc. More particles removed by shearing, and less particles removed by fractured during material removal progress can produce a better machined surface.

Research on the Characters of the Cutting Force in Vibration Cutting Particle Reinforced Metal Matrix Composites SiC_p/Al

In this paper, turning experiments of machining particle reinforced metal matri x composites(PRMMCs) SiC p/Al with PCD tools have been carried out. The cutting force characteristics in ultrasonic vibration turning compared with that in com mon turning were studied. Through the single factor experiments and multiple fac tor orthogonal experiments, the influences of three kinds of cutting conditions such as cutting velocity, amount of feed and cutting depth on cutting force were analyzed in detail. Meanwhile, according to the experimental data, the empirica l formula of main cutting force in ultrasonic vibration turning was conclude d. According to the test results, the cutting force is direct proportion to cutt ing depth basically according to the relation between cutting force and other fa ctors, which is similar to that of common cutting, so is the feed rate, but the influence is not so big. The influence of cutting speed is larger than that of f eed rate on cutting force because the efficient cutting time increases in vibrat ion cycle with the increase of cutting speed, which causes cutting force to incr ease. The research results indicate: (1) Ultrasonic vibration turning possesses much lower main cutting force than that in common turning when adopting smaller cutting parameters. If using larger cutting parameters, the difference will inco nspicuous. (2) There are remarkable differences of cutting force-cutting veloci ty characteristics in ultrasonic vibration turning from that in common turning m ainly because built-up edge does not emerge in ultrasonic turning unlike common turning in corresponding velocity range. (3) In ultrasonic vibration cutting, t he influence of cutting velocity on cutting force is most obvious among thre e cutting parameters and the influence of feed is smallest. So adopting lower cu tting velocity and larger cutting depth not only can reduce cutting force effect ively but also can ensure cutting efficiency. (4) The conclusions are useful in precision and super precision manufacturing thin-wall pieces.

Microstructure and thermal conductivity of copper matrix composites reinforced with mixtures of diamond and SiC particles

The thermal conductivity of diamond hybrid SiC/Cu,diamond/Cu and SiC/Cu composite were calculated by using the extended differential effective medium (DEM) theoretical model in this paper.The effects of the particle volume fraction,the particle size and the volume ratio of the diamond particles to the total particles on the thermal conductivity of the composite were studied.The DEM theoretical calculation results show that,for the diamond hybrid SiC/Cu composite,when the particle volume fraction is above 46% and the volume ratio of the diamond particles to the SiC particles is above 13:12,the thermal conductivity of the composite can reach 500 W·m-1·K-1.The thermal conduc-tivity of the composite has little change when the particle size is above 200μm.The experimental results show that Ti can improve the wettability of the SiC and Cu.The thermal conductivity of the diamond hybrid SiCTi/Cu is almost two times better than that of the diamond hybrid SiC/Cu.It is feasible to predict the thermal conductivity of the composite by DEM theoretical model.