50 vol.% SiCp/Al composites with high thermal and mechanical properties were successfully produced by spark plasma sintering technique. The influences of sintering temperature on the thermal conductivity, coefficient ...50 vol.% SiCp/Al composites with high thermal and mechanical properties were successfully produced by spark plasma sintering technique. The influences of sintering temperature on the thermal conductivity, coefficient of thermal expansion and bending strength of the SiCp/Al composites were carefully investigated. The results show that the SiCp/Al composites sintered at 520℃ exhibits a thermal conductivity of 189 W/(m·K), a coefficient of thermal expansion (50.200℃) of 10.03×10^-6 K^-1 and a bending strength of 649 MPa. The high thermal and mechanical properties can be ascribed to the nearly full density and the well interfacial bonding between the alloy matrix and the SiC particles. This work provides a promising pathway for producing materials to meet the needs of high performance electronic packaging.展开更多
基金Project(2014DFA50860) supported by the International Science & Technology Cooperation Program of Ministry of Science and Technology of China
文摘50 vol.% SiCp/Al composites with high thermal and mechanical properties were successfully produced by spark plasma sintering technique. The influences of sintering temperature on the thermal conductivity, coefficient of thermal expansion and bending strength of the SiCp/Al composites were carefully investigated. The results show that the SiCp/Al composites sintered at 520℃ exhibits a thermal conductivity of 189 W/(m·K), a coefficient of thermal expansion (50.200℃) of 10.03×10^-6 K^-1 and a bending strength of 649 MPa. The high thermal and mechanical properties can be ascribed to the nearly full density and the well interfacial bonding between the alloy matrix and the SiC particles. This work provides a promising pathway for producing materials to meet the needs of high performance electronic packaging.
