单晶SiC基片干式摩擦化学机械抛光初探

针对碳化硅(SiC)基片在抛光过程中效率低、费用高、环境污染大等问题,提出了一种在干式状态下对SiC基片进行摩擦化学机械抛光的方法(dry tribochemical mechanical polishing,DTCMP)。探究不同工艺参数(磨料种类、磨粒粒径、磨粒含量、抛光盘转速、抛光载荷、固相氧化剂含量)对单晶SiC基片抛光效率和表面质量的影响规律。研究结果表明:金刚石磨粒更适合SiC的摩擦化学机械抛光;当磨粒粒径为W1,磨粒质量为4 g,抛光盘转速为70r/min,抛光载荷为20.685 k Pa,固相氧化剂过碳酸钠添加量为10g时,其为最优工艺参数。采用最优工艺参数对表面粗糙度约为20nm的单晶6H-SiC基片进行干式抛光加工,最终获得表面粗糙度R_(a)为3.214 nm。DTCMP方法抛光SiC基片比水基抛光法热量损失少,所产生的界面温度更高,反应所需的活化能更低,可以实现SiC基片的绿色、高效和高质量抛光。

SiC功率模块用氮化硅陶瓷AMB覆铜基板的研究进展

国内新能源汽车领域对SiC功率模块的高压、大功率和高可靠的要求,为氮化硅陶瓷活性金属焊接(AMB)覆铜基板的大规模应用提供了支撑。从氮化硅陶瓷AMB覆铜基板制备工艺流程入手,重点介绍国内氮化硅陶瓷AMB覆铜基板的研究现状。综述了氮化硅陶瓷基板的国内外研究进展,并总结了提升氮化硅陶瓷基板热导率和强度的主要方法。汇总了氮化硅陶瓷AMB覆铜用活性焊料的类型、作用机理和应用方法。阐述了获得低空洞率氮化硅陶瓷AMB覆铜基板的钎焊方法。简述了氮化硅陶瓷AMB覆铜基板刻蚀的工艺流程。从镀液选择、镀覆时间、镀液温度等方面,详细论述了氮化硅陶瓷AMB覆铜基板在镀覆工艺中的注意事项。最后指出了国内氮化硅陶瓷AMB覆铜基板在材料性能和生产工艺上的不足,并展望了未来氮化硅陶瓷AMB覆铜基板的研究及发展方向。

Spectroscopic and scanning probe analysis on large-area epitaxial graphene grown under pressure of 4 mbar on 4H-SiC(0001)substrates

We produced epitaxial graphene under a moderate pressure of 4 mbar （about 400 Pa） at temperature 1600 ℃. Raman spectroscopy and optical microscopy were used to confirm that epitaxial graphene has taken shape continually with slight thickness variations and regularly with a centimeter order of magnitude on 4H-SiC （0001） substrates. Then using X-ray photoelectron spectroscopy and Auger electron spectroscopy, we analyzed the chemical compositions and estimated the layer number of epitaxial graphene. Finally, an atomic force microscope and a scanning force microscope were used to characterize the morphological structure. Our results showed that under 4-mbar pressure, epitaxial graphene could be produced on a SiC substrate with a large area, uniform thickness but a limited morphological property. We hope our work will be of benefit to understanding the formation process of epitaxial graphene on SiC substrate in detail.

A comparison of the field emission characteristics of vertically aligned graphene sheets grown on different SiC substrates

The field emission （FE） properties of vertically aligned graphene sheets （VAGSs） grown on different SiC substrates are reported. The VAGSs grown on nonpolar SiC （10-10） substrate show an ordered alignment with the graphene basal plane-parallel to each other, and show better FE features, with a lower turn-on field and a larger field enhancement factor. The VAGSs grown on polar SiC （000-1 ） substrate reveal a random petaloid-shaped arrangement and stable current emission over 8 hours with a maximum emission current fluctuation of only 4%. The reasons behind the differing FE characteristics of the VAGSs on different SiC substrates are analyzed and discussed.

SiC功率模块封装材料的研究进展

随着SiC功率模块的高频高速、高压大电流、高温、高散热和高可靠发展趋势,基于封装结构和封装材料的SiC功率模块封装技术也在不断地更新换代。与封装结构相比,SiC功率模块封装材料的相关研究报道较少。该文从封装材料角度出发,综述近年来陶瓷覆铜基板、散热底板、黏结材料、互连材料及灌封材料的研究进展,同时引出相关封装材料的研究重点,以满足SiC功率模块的应用需求。

Effect of surface morphology on the electron mobility of epitaxial graphene grown on 0° and 8° Si-terminated 4H-SiC substrates

Graphene with different surface morphologies were fabricated on 8°-off-axis and on-axis 4H-SiC（0001） substrates by high-temperature thermal decompositions. Graphene grown on Si-terminated 8°-off-axis 4H-SiC（0001） shows lower Hall mobility than the counterpart of on-axis SiC substrates. The terrace width is not responsible for the different electron mobility of graphene grown on different substrates, as the terrace width is much larger than the mean free path of the electrons. The electron mobility of graphene remains unchanged with an increasing terrace width on Si- terminated on-axis SiC. Interface scattering and short-range scattering are the main factors affecting the mobility of epitaxial graphene. After the optimization of the growth process, the Hall mobility of the graphene reaches 1770 cm^2/V.s at a carrier density of 9.8.×10^12 cm^-2. Wafer-size graphene was successfully achieved with an excellent double-layer thickness uniformity of 89.7% on a 3-inch SiC substrate.

Raman analysis of epitaxial graphene grown on 4H-SiC (0001) substrate under low pressure condition

In this paper, we report a feasible route of growing epitaxial graphene on 4H-SiC （0001） substrate in a low pressure of 4 mbar （1 bar=105 Pa） with an argon flux of 2 standard liters per minute at 1200, 1300, 1400, and 1500 ℃ in a commercial chemical vapour deposition SiC reactor. Using Raman spectroscopy and scanning electron microscopy, we confirm that epitaxial graphene evidently forms on SiC surface above 1300 ℃ with a size of several microns. By fitting the 2D band of Raman data with two-Lorentzian function, and comparing with the published reports, we conclude that epitaxial graphene grown at 1300 ℃ is four-layer graphene.

Comparison of the formation epitaxial graphenes on Si- and process and properties of C-face 6H-SiC substrates

In this paper, the epitaxial graphene layers grown on Si- and C-face 6H-SiC substrates are investigated under a low pressure of 400 Pa at 1600℃ By using atomic force microscopy and Raman spectroscopy, we find that there are distinct differences in the formation and the properties between the epitaxial graphene layers grown on the Si-face and the C-face substrates, including the hydrogen etching process, the stacking type, and the number of layers. Hopefully, our results will be useful for improving the quality of the epitaxial graphene on SiC substrate.

Comparative Study of Monolayer and Bilayer Epitaxial Graphene Field-Effect Transistors on SiC Substrates

Monolayer and bilayer graphenes have generated tremendous excitement as the potentially useful electronic materials due to their unique features. We report on monolayer and bilayer epitaxial graphene field-effect transistors （GFETs） fabricated on SiC substrates. Compared with monolayer GFETs, the bilayer GFETs exhibit a significant improvement in dc characteristics, including increasing current density I DS, improved transconductance g m, reduced sheet resistance lion, and current saturation. The improved electrical properties and tunable bandgap in the bilayer graphene lead to the excellent dc performance of the bilayer GFETs. Furthermore, the improved dc characteristics enhance a better rf performance for bilayer graphene devices, demonstrating that the quasifree-standing bilayer graphene on SiC substrates has a great application potential for the future graphene-based electronics.

High-Quality and Strain-Relaxation GaN Epilayer Grown on SiC Substrates Using AIN Buffer and AlGaN Interlayer

We study the effect of the AlGaN interlayer on structural quality and strain engineering of the GaN films grown on SiC substrates with an AlN buffer layer, hnproved structural quality and tensile stress releasing are realized in unintentionally doped GaN thin films grown on 6H-SiC substrates by metal organic chemical vapor deposition. Using the optimized AlGaN interlayer, we find that the full width at half maximum of x-ray diffraction peaks for GaN decreases dramatically, indicating an improved crystalline quality. Meanwhile, it is revealed that the biaxial tensile stress in the GaN film is significantly reduced from the Raman results. Photoluminescence spectra exhibit a shift of the peak position of the near-band-edge emission, as well as the integrated intensity ratio variation of the near-band-edge emission to the yellow luminescence band. Thus by optimizing the AlGaN interlayer, we could acquire the high-quality and strain-relaxation GaN epilayer with large thickness on SiC substrates.

Comparison of the formation process and properties of epitaxial graphenes on Si-and C-face 6H-SiC substrates

In this paper,the epitaxial graphene layers grown on Si-and C-face 6H-SiC substrates are investigated under a low pressure of 400 Pa at 1600 C.By using atomic force microscopy and Raman spectroscopy,we find that there are distinct differences in the formation and the properties between the epitaxial graphene layers grown on the Si-face and the C-face substrates,including the hydrogen etching process,the stacking type,and the number of layers.Hopefully,our results will be useful for improving the quality of the epitaxial graphene on SiC substrate.

核用SiC_f/SiC复合材料研究进展

核用SiC_f/SiC复合材料是国际上材料研究的一个热点,本文简要介绍了SiC_f/SiC复合材料的制备工艺,重点综述了SiC_f/SiC复合材料的抗辐照性能和耐腐蚀性能等方面的研究成果,详细介绍了SiC_f/SiC复合材料燃料包壳管的研究进展,并对核用SiC_f/SiC复合材料研究中需要关注的重点问题提出了几点思考。

用CVI方法制备SiC_f/SiC复合材料的弯曲断裂强度

对Ｓａｔｉｎｅ、Ｐｌａｉｎ 两种编织方式和不同涂层的Ｈｉ－Ｎｉｃａｌｏｎ 纤维，采用气相浸渍（ＣＶＩ）工艺技术制备出纤维强化型ＳｉＣｆ／ＳｉＣ复合材料，获得其室温至１７７３Ｋ温度范围内３ 点弯曲实验断裂强度曲线。分析Ｓａｔｉｎｅ、Ｐｌａｉｎ 两种二维纺织方法以及纤维涂层（碳、ＢＮ）对ＳｉＣｆ／ＳｉＣ复合材料弯曲断裂强度的影响。结果表明，Ｓａｔｉｎｅ样品的平均断裂强度高于Ｐｌａｉｎ 样品。而纤维涂层虽然使ＳｉＣｆ／ＳｉＣ复合材料的断裂强度有不同程度的下降，但其宏观塑性（挠度）得到明显提高，而且ＢＮ 涂层还使其高温强度增加。热处理工艺对样品弯曲断裂强度影响的实验表明，随着热处理温度升高，材料强度下降，宏观塑性提高。

基于国产单晶衬底的150 mm 4H-SiC同质外延技术进展

高阻断电压、大功率密度、高转化效率是电力电子器件技术持续追求的目标,基于4H-SiC优异的材料特性,在电力电子器件应用方面具有广阔的发展前景。围绕SiC MOSFET器件对外延材料的需求,介绍了国内外主流的SiC外延设备及国产SiC衬底的发展,并重点介绍了宽禁带半导体电力电子器件国家重点实验室在国产150 mm(6英寸)SiC衬底上的高速外延技术进展。通过关键技术攻关,实现了150 mm SiC外延材料表面缺陷密度≤0.5 cm-2,BPD缺陷密度≤0.1 cm-2,片内掺杂浓度不均匀性≤5%,片内厚度不均匀性≤1%。基于自主外延材料,实现了650~1200 V SiC MOSFET产品商业化以及6.5~15 kV高压SiC MOSFET器件的产品定型。

界面层对SiC_f/SiC复合材料力学性能及氧化行为的影响

为研究界面层对SiC_f/SiC复合材料力学性能及氧化行为的影响,采用先驱体浸渍裂解工艺制备了3种不同界面层体系的SiC_f/SiC复合材料。3种界面层分别为热解碳(PyC)、PyC+BN-Ⅰ和PyC+BN-Ⅱ(其中BN-Ⅰ表示B质量分数大约2%,BN-Ⅱ表示B质量分数大约20%)。研究表明,具有PyC界面层的SiC_f/SiC复合材料常温力学性能最高,其常温弯曲强度达到380MPa,而双界面层体系中,SiC_f/SiC复合材料常温弯曲强度分别为282MPa(PyC+BN-Ⅰ)和259MPa(PyC+BN-Ⅱ)。1200℃氧化试验表明,具有PyC+BN-Ⅱ界面层的SiC_f/SiC复合材料弯曲强度保留率最高,为54%。3种不同界面层体系的SiC_f/SiC复合材料在氧化后均表现为脆性断裂。微观结构显示,界面和纤维被氧化是导致材料最终失效的原因;能谱分析表明,具有PyC+BN-Ⅰ和PyC+BN-Ⅱ界面层的SiC_f/SiC复合材料纤维内部未检测到O原子存在,证实BN有保护纤维的作用。

添加树脂碳对针刺C/C-SiC材料熔渗行为及性能的影响

以2.5D无纬布/网胎叠层针刺预制体为增强体,采用化学气相渗透和树脂浸渍裂解法制备了密度约1.35 g/cm 3的热解碳C/C、热解碳+树脂碳C/C两种坯体,再经反应熔渗获得C/C-SiC复合材料,分析了不同碳基体组分C/C材料的熔渗特性及其微结构、拉伸性能及氧乙炔烧蚀性能的变化规律。结果表明:相比热解碳的“薄壳”型孔隙结构,树脂碳的“狭缝”型孔结构增大了液Si与碳基体的接触面积,提高了熔渗动力,获得致密度和SiC含量高的C/C-SiC复合材料,提升抗烧蚀性能,在氧乙炔火焰下经400~600 s烧蚀的线烧蚀率降低24%,但树脂碳对液Si的诱导渗透增加了骨架承载体的损伤,使树脂碳+热解碳基C/C-SiC复合材料室温拉伸强度(104±3)MPa低于热解碳基C/C-SiC的(118±3)MPa。

Graphene films grown on sapphire substrates via solid source molecular beam epitaxy

A method for growing graphene on a sapphire substrate by depositing an SiC buffer layer and then annealing at high temperature in solid source molecular beam epitaxy（SSMBE） equipment was presented.The structural and electronic properties of the samples were characterized by reflection high energy diffraction（RHEED）,X-ray diffraction Φ scans,Raman spectroscopy,and near edge X-ray absorption fine structure（NEXAFS） spectroscopy.The results of the RHEED and Φ scan,as well as the Raman spectra,showed that an epitaxial hexagonal α-SiC layer was grown on the sapphire substrate.The results of the Raman and NEXAFS spectra revealed that the graphene films with the AB Bernal stacking structure were formed on the sapphire substrate after annealing.The layer number of the graphene was between four and five,and the thickness of the unreacted SiC layer was about 1-1.5 nm.

SiC功率LDMOS器件发展现状及新进展

集成化和小型化是未来电力电子技术的发展方向,SiC-横向扩散金属氧化物半导体(LDMOS)器件兼有SiC材料优势和LDMOS器件优势,击穿电压高、比导通电阻低、易与其他器件集成,在单片功率集成和小型化应用中起着重要的作用,但受限于晶圆材料和部分工艺加工技术而发展有限。综述了国内外SiC晶圆材料和SiC-LDMOS器件结构的发展现状,着重从衬底材料、晶体取向和器件结构优化方面阐述了SiC-LDMOS的研究进展,指出了SiC-LDMOS全面发展的瓶颈所在,展望了未来SiC-LDMOS的发展方向。

SiC激光改质剥离工艺材料损耗控制技术

论述了激光改质剥离技术的基本原理,分析了激光改质加工过程中造成材料损耗的问题,针对性提出了球差校正、温度控制、形位误差综合补偿等方法,有效减小了SiC激光改质剥离工艺过程中的材料损耗。

基于应力差改善的SiC模块用氮化硅衬板匹配性研究

功率半导体器件的快速发展,特别是SiC功率模块的广泛应用对模块中的陶瓷覆铜衬板提出了更高要求,模块封装中陶瓷覆铜衬板的翘曲将影响其可靠性。文章研究了陶瓷覆铜衬板的应力状态以及应力与衬板翘曲的关系,并提供了包括延长冷却时间、降低峰值温度、调整铜体积比在内的减小翘曲度的改善方案,使衬板与SiC模块匹配性得到提升,从而提升了模块可靠性。