The reactive process for Al/SiC P composite was studied. SiC particles were in situ coated by the exothermal reaction of SiC Ti powder compact in Al melt bath, and easily incorporated into Al melt. The detailed study ...The reactive process for Al/SiC P composite was studied. SiC particles were in situ coated by the exothermal reaction of SiC Ti powder compact in Al melt bath, and easily incorporated into Al melt. The detailed study was carried out to understand the microstructures of the reacted SiC particles. During the reaction and consequent mixing, the successive processes include in situ coating on the reacted SiC particles, coat dissolution and SiC P splitting. The tensile mechanical properties of 6013Al/SiC P composite processed by the present technology showed that the reacted SiC P considerably reinforced the 6013 matrix.展开更多
The rapid development of electronic packaging industry has resulted in higher requirement for packaging materials.The packaging material of SiC reinforced A356 aluminum alloy was fabricated by mechanical mixing method...The rapid development of electronic packaging industry has resulted in higher requirement for packaging materials.The packaging material of SiC reinforced A356 aluminum alloy was fabricated by mechanical mixing method,and the SiCp/Al composite billet was formed by thixo-forging to manufacture the electronic packaging shell.The microstructure of the produced part was investigated.Two different thixo-forging procedures for manufacturing electronic packaging shell were analyzed.The results show that after being heated to 600 ℃ and held for 3 h,SiCp has good compatibility with A356 aluminum alloy and the SiCp/A356 composite billet can meet the requirements of thixo-forging.When the billet was remelted to 580℃,held for 10 min,the homogeneous microstructure with the best thixo-formability can be realized.The thixo-forging of electronic packaging shell is feasible.展开更多
文摘The reactive process for Al/SiC P composite was studied. SiC particles were in situ coated by the exothermal reaction of SiC Ti powder compact in Al melt bath, and easily incorporated into Al melt. The detailed study was carried out to understand the microstructures of the reacted SiC particles. During the reaction and consequent mixing, the successive processes include in situ coating on the reacted SiC particles, coat dissolution and SiC P splitting. The tensile mechanical properties of 6013Al/SiC P composite processed by the present technology showed that the reacted SiC P considerably reinforced the 6013 matrix.
基金Project (2007AA03Z119) supported by the National High Technology Research and Development Program of Chinaprojects (2102029,2072012) supported by Beijing Natural Science Foundation,China
文摘The rapid development of electronic packaging industry has resulted in higher requirement for packaging materials.The packaging material of SiC reinforced A356 aluminum alloy was fabricated by mechanical mixing method,and the SiCp/Al composite billet was formed by thixo-forging to manufacture the electronic packaging shell.The microstructure of the produced part was investigated.Two different thixo-forging procedures for manufacturing electronic packaging shell were analyzed.The results show that after being heated to 600 ℃ and held for 3 h,SiCp has good compatibility with A356 aluminum alloy and the SiCp/A356 composite billet can meet the requirements of thixo-forging.When the billet was remelted to 580℃,held for 10 min,the homogeneous microstructure with the best thixo-formability can be realized.The thixo-forging of electronic packaging shell is feasible.
