Microstructure and Thermal Properties of SiCp/Cu Composites with Mo Coating on SiC Particles

SiCp/Cu composites with a compact microstructure were successfully fabricated by vacuum hot-pressing method. In order to suppress the detrimental interfacial reactions and ameliorate the interfacial bonding between copper and silicon carbide, molybdenum coating was deposited on the surface of silicon carbide by magnetron sputtering method and crystallized heat-treatment. The effects of the interfacial design on the thermo-physical properties of Si Cp/Cu composites were studied in detail. Thermal conductivity and expansion test results showed that silicon carbide particles coated with uniform and compact molybdenum coating have improved the comprehensive thermal properties of the Si Cp/Cu composites. Furthermore, the adhesion of the interface between silicon carbide and copper was significantly strengthened after molybdenum coating. Si Cp/Cu composites with a maximum thermal conductivity of 274.056 W/（m·K） and a coefficient of thermal expansion of 9 ppm/K were successfully prepared when the volume of silicon carbide was about 50%, and these Si Cp/Cu composites have potential applications for the electronic packageing of the high integration electronic devices.

Recent Advances in Interface Modification of Cu/graphite Composites and Layered Ternary Carbides of Modified Layer Candidate

We review the fundamental properties and significant issues related to Cu/graphite composites.In particular,recent research on the interfacial modification of Cu/graphite composites is addressed,including the metal-modified layer,carbide-modified layer,and combined modified layer.Additionally,we propose the use of ternary layered carbide as an interface modification layer for Cu/graphite composites.

Microstructure and properties of Cu matrix composites reinforced with surface-modified Kovar particles

The thermal conductivity of Cu/Kovar composites was improved by suppressing element diffusion at the interfaces through the formation of FeWO_(4)coating on the Kovar particles via vacuum deposition.Cu matrix composites reinforced with unmodified(Cu/Kovar)and modified Kovar(Cu/Kovar@)particles were prepared by hot pressing.The results demonstrate that the interfaces of Cu/FeWO_(4)and FeWO_(4)/Kovar in the Cu/Kovar@composites exhibit strong bonding,and no secondary phase is generated.The presence of FeWO_(4)impedes interfacial diffusion within the composite,resulting in an increase in grain size and a decrease in dislocation density.After surface modification of the Kovar particle,the thermal conductivity of Cu/Kovar@composite is increased by 110%from 40.6 to 85.6 W·m^(-1)·K^(-1).Moreover,the thermal expansion coefficient of the Cu/Kovar@composite is 9.8×10^(-6)K^(-1),meeting the electronic packaging requirements.

Microstructure characteristics and thermodynamic properties of A357-SiCp/A357 layered composites prepared by semi-solid vacuum stirring suction casting

A357-SiCp/A357 layered composites were prepared using a semi-solid vacuum stirring suction casting method.The microstructures,mechanical properties,and thermal conductivities of the composites fabricated under different suction casting processes were compared.Additionally,the microstructural evolution characteristics and performance enhancement mechanism of the A357-SiCp/A357 layered composites were discussed.The results demonstrate that suction casting at 610°C with a low solid phase ratio can significantly enhance the material density and reduce the agglomeration of SiCp.The A357-SiC_(p)/A357 interface is clear and straight with good bonding.With an increase in the suction casting temperature,the bending resistance and thermal conductivity of the A357-SiC_(p)/A357 layered composites exhibit a trend of significantly increase at first and then slowly decrease owing to casting defects,interface bonding,and SiCp distribution.Compared with SiCp/A357 composites,the bending strength,deflection,and thermal conductivity of the A357-SiCp/A357 layered composites increase from 257 MPa,1.07 mm,and 155.72 W·(m·K)^(-1) to 298 MPa,2.1 mm,and 169.86 W·(m·K)^(-1),respectively.This study provides a reference for improving the rheological casting of aluminum matrix layered composites.

Revealing the Role of Defect in 3D Graphene-Based Photocatalytic Composite for Efficient Elimination of Antibiotic and Heavy Metal Combined Pollution

Defect engineering can give birth to novel properties for adsorption and photocatalysis in the control of antibiotics and heavy metal combined pollution with photocatalytic composites.However,the role of defects and the process mechanism are complicated and indefinable.Herein,TiO_(2)/CN/3DC was fabricated and defects were introduced into the tripartite structure with separate O_(2)plasma treatment for the single component.We find that defect engineering can improve the photocatalytic activity,attributing to the increase of the contribution from h^(+)and OH.In contrast to TiO_(2)/CN/3DC with a photocatalytic tetracycline removal rate of 75.2%,the removal rate of TC with D-TiO_(2)/CN/3DC has increased to 88.5%.Moreover,the reactive sites of tetracycline can be increased by adsorbing on the defective composites.The defect construction on TiO_(2)shows the advantages in tetracycline degradation and Cu^(2+)adsorption,but also suffers significant inhibition for the tetracycline degradation in a tetracycline/Cu^(2+)combined system.In contrast,the defect construction on graphene can achieve the cooperative removal of tetracycline and Cu^(2+).These findings can provide new insights into water treatment strategies with defect engineering.

Investigation on the Novel High-performance Copper/Graphene Composite Conductor for High Power Density Motor

High-performance Cu/Graphene composite wire synergistically strengthened by nano Cr_(3)C_(2) phase was directly synthesized via hot press sintering followed by severe cold plastic deformation, using liquid paraffin and CuCr alloy powder as the raw materials. Since graphene is in situ formed under the catalysis of copper powder during the sintering process, the problem that graphene is easy to agglomerate and difficult to disperse uniformly in the copper matrix has been solved. The nano Cr_(3)C_(2)-particles nailed at the interface favor to improve the interface bonding. The Cu/Graphene composite possesses high electrical conductivity, hardness, and plasticity. The composite wire exhibits high electrical conductivity of 96.93% IACS, great tensile strength of 488MPa, and excellent resistance to softening. Even after annealing at 400℃ for 1 h, the tensile strength can still reach 268 MPa with a conductivity of about 99.14% IACS.The wire's temperature coefficient of resistance(TCR) is largely reduced to 0.0035/℃ due to the complex structure,which leads the wire to present low resistivity at higher temperatures. Such Cu/Graphene composite wire with excellent comprehensive performance has a good application prospect in high-power density motors.

Oxidation mechanism of high-volume fraction SiCp/Al composite under laser irradiation and subsequent machining

Conventional mechanical machining of a composite material comprising an aluminum matrix reinforced with a high volume fraction of SiC particles(hereinafter referred to as an SiCp/Al composite)faces problems such as rapid tool wear,high specific cutting force,and poor surface integrity.Instead,a promising method for solving these problems is laser-induced oxidation-assisted milling(LOAM):under laser irradiation,the local workpiece material reacts with oxygen,thus forming loose and porous oxides that are easily removed.In the present work,the oxidation mechanism of SiCp/Al irradiated by a nanosecond pulsed laser is studied to better understand the laser-induced oxidation behavior and control the characteristics of the oxides,with laser irradiation experiments performed on a 65%SiCp/Al composite with various laser parameters and auxiliary gases(oxygen,nitrogen,and argon).With increasing laser pulse energy density,both the ablated groove depth and the width of the heat-affected zone increase.When oxygen is used as the auxiliary gas,an oxide layer composed of SiO_(2)and Al2O3 forms,and CO_(2)is produced and escapes from the material,thereby forming pores in the oxides.However,when nitrogen or argon is used as the auxiliary gas,a recast layer is produced that is relatively difficult to remove.Under laser irradiation,the sputtered material reacts with oxygen to form oxides on both sides of the ablated groove,and as the laser scanning path advances,the produced oxides accumulate to form an oxide layer.LOAM and conventional milling are compared using the same milling parameters,and LOAM is found to be better for reduced milling force and tool wear and improved machined surface quality.

Near-net shaped Al/SiCP composites via vacuum-pressure infiltration combined with gelcasting

To solve the problem of difficult machining, the near-net shaped Al/SiCP composites with high volume fraction of SiC particles were fabricated by vacuum-pressure infiltration. The SiCP preform with a complex shape was prepared by gelcasting. Pure Al, Al4Mg, and Al4Mg2Si were used as the matrices, respectively. The results indicate that the optimal parameters of SiCP suspension in gelcasting process are pH value of 10, TMAH content of 0.5 wt.%, and solid loading of 52 vol.%. The Al matrix alloyed with Mg contributes to improving the interfacial wettability of the matrix and SiC particles, which increases the relative density of the composite. The Al matrix alloyed with Si is beneficial to inhibiting the formation of the detrimental Al4C3 phases. The Al4Mg2Si/SiCP composite exhibits high relative density of 99.2%, good thermal conductivity of 150 W·m^-1·K^-1, low coefficient of thermal expansion of 10.1×10^-6 K^-1, and excellent bending strength of 489 MPa.

Improvement of Joint Strength of SiCp/Al Metal Matrix Composite in Transient Liquid Phase Bonding Using Cu/Ni/Cu Film Interlayer

The compact oxide on the surface of SiCp/Al metal matrix composite （SiCp/Al MMC） greatly depends on the property of the joint. Inlaid sputtering target was applied to etch the oxide completely on the bonding surface of SiCp/Al MMC by plasma erosion. Cu/Ni/Cu film of 5μm in thickness was prepared by magnetron sputtering method on the clean bonding surface in the same vacuum chamber, which was acted as an interlayer in transient liquid phase （TLP） bonding process. Compared with the same thickness of single Cu foil and Ni foil interlayer, the shear strength of 200 MPa was obtained using Cu/Ni/Cu film interlayer during TLP bonding, which was 89.7% that of base metal. In addition, homogenization of the bonding region and no particle segregation in interfacial region were found by analysis of the joint microstructure. Scanning electron microscopy （SEM） was used to observe the micrograph of the joint interface. The result shows that a homogenous microstructure of joint was achieved, which is similar with that of based metal.

Morphology and Frictional Characteristics Under Electrical Currents of Al_2O_3/Cu Composites Prepared by Internal Oxidation

Two Al2O3/Cu composites containing 0.24 wt.% Al2O3 and 0.60 wt.% Al2O3 separately are prepared by internal oxidation. Effects of sliding speed and pressure on the frictional characteristics of the composites and copper against brass are investigated and compared. The changes in morphology of the sliding surface and subsurface are examined with scanning electron microscope （SEM） and energy dispersive X-ray spectrum （EDS）. The results show that the wear resistance of the Al2O3/Cu composites is superior to that of copper under the same conditions, Under a given electrical current, the wear rate of Al2O3/Cu composites decreases as the Al2O3-content increases, However, the wear rates of the Al2O3/Cu composites and copper increase as the sliding speed and pressure increase under dry sliding condition. The main wear mechanisms for Al2O3/Cu composites are of abrasion and adhesion; for copper, it is adhesion, although wear by oxidation and electrical erosion can also be observed as the speed and pressure rise.

Effect of electrical current on tribological property of Cu matrix composite reinforced by carbon nanotubes

Cu matrix composite reinforced with 10%（volume fraction） carbon nanotubes（CNTs/Cu） and pure Cu bulk were prepared by powder metallurgy techniques under the same consolidation processing condition.The effect of electrical current on tribological property of the materials was investigated by using a pin-on-disk friction and wear tester.The results show that the friction coefficient and wear rate of CNTs/Cu composite as well as those of pure Cu bulk increase with increasing the electrical current without exception,and the effect of electrical current is more obvious on tribological property of pure Cu bulk than on that of CNTs/Cu composite;the dominant wear mechanisms are arc erosion wear and plastic flow deformation,respectively;CNTs can improve tribological property of Cu matrix composites with electrical current.

Properties and microstructure of Cu/diamond composites prepared by spark plasma sintering method

Cu/diamond composites have been considered as the next generation of thermal management material for electronic packages and heat sinks applications. Cu/diamond composites with different volume fractions of diamond were successfully prepared by spark plasma sintering（SPS） method. The sintering temperatures and volume fractions（50%, 60% and 70%） of diamond were changed to investigate their effects on the relative density, homogeneity of the microstructure and thermal conductivity of the composites. The results show that the relative density, homogeneity of the microstructure and thermal conductivity of the composites increase with decreasing the diamond volume fraction; the relative density and thermal conductivity of the composites increase with increasing the sintering temperature. The thermal conductivity of the composites is a result of the combined effect of the volume fraction of diamond, the homogeneity and relative density of the composites.

Microstructural development and its effects on mechanical properties of Al/Cu laminated composite

The microstructural development and its effect on the mechanical properties of Al/Cu laminated composite produced by asymmetrical roll bonding and annealing were studied. The composite characterizations were conducted by transmission electron microscope（TEM）, scanning electron microscope（SEM）, peeling tests and tensile tests. It is found that the ultra-fine grained laminated composites with tight bonding interface are prepared by the roll bonding technique. The annealing prompts the atomic diffusion in the interface between dissimilar matrixes, and even causes the formation of intermetallic compounds. The interfacial bonding strength increases to the maximum value owing to the interfacial solution strengthening at 300 °C annealing, but sharply decreases by the damage effect of intermetallic compounds at elevated temperatures. The composites obtain high tensile strength due to the Al crystallization grains and Cu twins at 300 °C. At 350 °C annealing, however, the composites get high elongation by the interfacial interlayer with submicron thickness.

超声振动辅助切削SiCp/Al复合材料的加工机理及试验

切削加工过程中材料损伤形式对加工表面质量会产生较大影响,现有仿真分析难以模拟真实颗粒失效行为,通过建立二维微观多相有限元模型能够深入了解材料损伤与表面质量的关系。基于常规切削(Conventional cutting,CC)与超声振动辅助切削(Ultrasonic vibration-assisted cutting,UVAC)两种加工方式,通过有限元仿真软件Abaqus对20%SiCp/Al复合材料的切削过程进行仿真模拟,阐释加工过程中刀具与工件的相互作用机理,并在同一参数下验证有限元仿真的准确性。通过设计单因素试验,对比两种加工方式及不同加工参数对切削力和表面粗糙度的影响规律,得出最佳加工参数组合,并对最佳加工参数下表面形貌进行分析。模拟和试验结果表明,SiC颗粒断裂、颗粒耕犁、颗粒拔出以及Al基体撕裂是影响SiCp/Al复合材料加工质量的主要原因,刀具与颗粒不同的相对作用位置会产生不同的损伤形式。与常规切削相比,施加超声振动后可以有效抑制颗粒失效和基体损伤,使加工中的平均切削力(主切削力)降低33%,工件已加工表面粗糙度值最大减小量为531 nm,显著提高了表面质量。所建立的二维微观多相有限元模型,能够有效模拟铝基复合材料的加工缺陷和裂纹损伤问题,对提高难加工材料的高质量表面制备有重要借鉴意义。

时效处理对Cu-Y_(2)O_(3)-Ti复合材料组织及性能的影响

以Cu、Y、Ti和CuO粉末为原料,采用机械合金化(MA)和热还原的方法制备了Cu-Y_(2)O_(3)-Ti复合粉末。然后经放电等离子烧结(SPS)技术制备了Cu-Y_(2)O_(3)-Ti复合材料,并对材料进行了900℃固溶1 h和不同温度时效2 h的处理。采用光学显微镜(OM)、扫描电镜(SEM)、X射线衍射仪(XRD)、能谱仪(EDS)、拉伸试验和导电率测量仪等研究了不同温度时效处理对Cu-Y_(2)O_(3)-Ti复合材料组织及性能的影响。结果表明:随着时效温度的升高,Cu-Y_(2)O_(3)-Ti复合材料的晶粒和第二相尺寸增大,导电率降低,最大应变和抗拉强度先增大后减小。Cu-Y_(2)O_(3)-Ti复合材料经900℃固溶1 h+400℃时效2 h后,综合性能最优,其具有良好塑性的同时,抗拉强度和导电率分别达到326.4 MPa和73.0%IACS。

三维互穿结构Cu-W触头抗熔焊机理

触头闭合回跳电弧引起的开关电器动熔焊问题,直接影响大功率接触器的电寿命和可靠性。为此设计了2种三维互穿有序结构的四边形和菱形十二面体的Cu-W复合材料触头,围绕触头动熔焊过程中的电弧、熔池、液滴溅射及凝固相变降温等问题,建立触头熔池流体动力学模型和冷凝降温数学模型,研究了2种有序结构和商用无序结构的触头阳极在闭合回跳电弧作用下熔化温度分布、熔池喷溅形貌和接触区域金属凝固过程,通过模拟熔焊实验平台进行了熔焊力验证。结果表明,通过调节三维互穿有序W骨架结构,能够有效抑制熔池扩散和液态金属喷溅,并降低熔焊力,从而提高Cu-W复合材料的抗熔焊性能。

晶粒尺寸对界面含Cr-O-C防黏层Cu/Ni复合体拉伸性能的影响

通过分子动力学方法研究含Cr-O-C防黏层的具有不同晶粒尺寸的Cu/Ni复合体的拉伸变形。结果表明:当Cu/Ni复合体的晶粒尺寸大于12 nm时,不论界面不含Cr、O和C原子或含有定量Cr、O和C原子,复合体的屈服强度随着晶粒尺寸的减小呈现增大趋势,符合细晶强化规律,晶粒塑性变形主要受晶体内部的位错滑移控制,最大应力增加9.52%;当晶粒尺寸小于12 nm时,由于晶界所占比例的增加,拉伸过程的塑性变形更多受晶界变形控制,屈服强度下降。Cr-O-C界面弱化了Cu/Ni复合体的强度,随着界面上Cr、O和C原子数量的增加,Cu/Ni复合体的抗拉强度随之降低,最大应力下降56.40%,Cu/Ni复合体内部的位错数量也随之降低,转移到Ni表面的Cu原子数量随之减少。

纵扭超声辅助铣削SiCp/Al复合材料表面质量研究

高体积分数SiCp/Al复合材料具有高比强度、高比模数和良好的耐磨性等优异性能。然而,它们的高硬度和脆性会导致精密制造过程中应力分布更为复杂,这会使材料中产生过大的力和过多的热,从而影响加工精度和工件耐久极限寿命。目的通过分析切削过程中颗粒的去除机理和表面缺陷类型,利用纵扭超声辅助铣削(longitudinal-torsional ultrasonic assisted milling,LTUAM)技术,改善高体积分数SiCp/Al复合材料的加工表面质量。方法利用ABAQUS和PYTHON软件,建立考虑颗粒断裂过程的两相随机分布颗粒SiCp/Al复合材料模型,并采用Johnson-Cook模型和Brittle Cracking模型对SiCp/Al复合材料纵扭超声辅助铣削过程进行有限元模拟仿真。针对不同加工参数,进行SiCp/Al复合材料纵扭超声辅助铣削和常规铣削(conventional milling,CM)试验,评估有限元仿真模拟与试验结果的一致性。结果模拟结果表明,损伤和裂纹主要产生在SiC颗粒(SiCp)中上部的切削线上,凹坑缺陷主要产生在颗粒下部的切削线上。试验结果显示,表面缺陷的类型主要包括颗粒的损伤和拔出、颗粒的损伤和断裂形成凹坑、未损伤的颗粒形成凸起、破损颗粒与刀具在已加工表面上挤压摩擦形成犁沟、铝基体涂覆、表面微裂纹和表面空穴等,并且当加工速度120 m/min,超声振幅3μm时,最大裂纹深度最小,表面缺陷最小,表面质量最好。结论对比有限元仿真结果与试验结果发现,二者的表面质量变化趋势基本具有一致性。纵扭超声辅助铣削技术的应用对提高SiCp/Al复合材料的表面质量有较好效果。

挤压铸造压力对超声辅助成形纳米SiCp/Al-Cu复合材料颗粒分布与力学性能的影响

采用超声振动技术制备2%(质量分数)纳米SiCp/Al-Cu复合材料浆料,并研究挤压铸造压力对纳米SiCp/Al-Cu复合材料颗粒分布和力学性能的影响。研究发现,随着挤压压力从0增至400 MPa,合金α(Al)晶粒尺寸先大幅降低而后下降趋势变缓,并且铸件中孔隙率明显降低。当挤压压力为400 MPa时,α(Al)晶粒尺寸从105μm减小到25μm,纳米SiCp分布得到明显改善,以致其力学性能最佳。复合材料的抗拉强度、屈服强度和伸长率分别为290 MPa、182 MPa和10%,相比于重力铸造(0 MPa)分别提高52.6%、25.5%和400%。在高压作用下,纳米SiCp/Al-Cu复合材料强度和伸长率的提高归因于晶粒细化、孔隙率降低和纳米颗粒均匀分布。

Effects of rolling and annealing on microstructures and properties of Cu/Invar electronic packaging composites prepared by powder metallurgy

The Cu/Invar composites of 40% Cu were prepared by powder metallurgy, and the composites were rolled with 70% reduction and subsequently annealed at 750 ℃. Phases, microstructures and properties of the composites were then studied. After that, the amount of a-Fe（Ni,Co） in the composites is reduced, because a-Fe（Ni,Co） partly transfers into y-Fe（Ni,Co） through the diffusion of the Ni atoms into a-Fe（Ni,Co） from Cu. When the rolling reduction is less than 40%, the deformation of Cu takes place, resulting in the movement of the Invar particles and the seaming of the pores. When the rolling reduction is in the range from 40% to 60%, the deformations of Invar and Cu occur simultaneously to form a streamline structure. After rolling till 70% and subsequent annealing, the Cu/Invar composites have fine comprehensive properties with a relative density of 98.6%, a tensile strength of 360 MPa, an elongation rate of 50%, a thermal conductivity of 25.42 W/（m.K） （as-tested） and a CTE of 10.79× 10-6/K （20-100 ℃）.