利用等离子增强化学气相沉积(PECVD)技术,采用NH_3等离子体预氮化法淀积α-SiN_x介质膜,同时结合layer by layer生长nc-Si的方法一次性原位制备了α-SiN_x/nc-Si/α-SiN_x双势垒结构样品.通过原子力显微镜(AFM)测量,估算了nc-Si的密度为...利用等离子增强化学气相沉积(PECVD)技术,采用NH_3等离子体预氮化法淀积α-SiN_x介质膜,同时结合layer by layer生长nc-Si的方法一次性原位制备了α-SiN_x/nc-Si/α-SiN_x双势垒结构样品.通过原子力显微镜(AFM)测量,估算了nc-Si的密度为1.2×10^(11)cm^(-2).通过C-V测量研究镶嵌在SiN_x双势垒层中的nc-Si颗粒的电荷存储现象.C-V曲线出现明显的迥滞现象,迴滞窗口约为1 V,表明结构中电荷存储特性.根据迴滞窗口,计算了结构中存储电荷的密度,发现存储电荷密度与nc-Si层的晶粒密度具有相同的数量级.展开更多
The effect of a self-organized SiNs interlayer on the defect density of （1122） semipolar GaN grown on 7n-plane sapphire is studied by transmission electron microscopy, atomic force microscopy and high resolution x-r...The effect of a self-organized SiNs interlayer on the defect density of （1122） semipolar GaN grown on 7n-plane sapphire is studied by transmission electron microscopy, atomic force microscopy and high resolution x-ray diffrac- tion. The SiNx interlayer reduces the c-type dislocation density from 2.5 ×10^10 cm^-2 to 5 ×10^8 cm 2. The SiNx interlayer produces regions that are free from basal plane stacking faults （BSFs） and dislocations. The overall BSF density is reduced from 2.1×10^5 cm-1 to 1.3×10^4 cm^-1. The large dislocations and BSF reduction in semipolar （1122） GaN with the SiNx, interlayer result from two primary mechanisms. The first mechanism is the direct dislocation blocking by the SiNx interlayer, and the second mechanism is associated with the unique structure character of （1122） semipolar GaN.展开更多
The effect of high overdrive voltage on the positive bias temperature instability(PBTI)trapping behavior is investigated for GaN metal–insulator–semiconductor high electron mobility transistor(MIS-HEMT)with LPCVD-Si...The effect of high overdrive voltage on the positive bias temperature instability(PBTI)trapping behavior is investigated for GaN metal–insulator–semiconductor high electron mobility transistor(MIS-HEMT)with LPCVD-SiNx gate dielectric.A higher overdrive voltage is more effective to accelerate the electrons trapping process,resulting in a unique trapping behavior,i.e.,a larger threshold voltage shift with a weaker time dependence and a weaker temperature dependence.Combining the degradation of electrical parameters with the frequency–conductance measurements,the unique trapping behavior is ascribed to the defect energy profile inside the gate dielectric changing with stress time,new interface/border traps with a broad distribution above the channel Fermi level are introduced by high overdrive voltage.展开更多
In boron-doped p+-n crystalline silicon（Si） solar cells, p-type boron doping control and surface passivation play a vital role in the realization of high-efficiency and low cost pursuit. In this study, boron-doped p...In boron-doped p+-n crystalline silicon（Si） solar cells, p-type boron doping control and surface passivation play a vital role in the realization of high-efficiency and low cost pursuit. In this study, boron-doped p+-emitters are formed by boron diffusion in an open-tube furnace using borontribromide（BBr3） as precursor. The formed emitters are characterized in detail in terms of shape of the doping profile, surface doping concentration, junction depth, sheet resistance and removal of the boron-rich layer（BRL）. In the aspect of BRL removal, three different methods were adopted to investigate their influence on device performance. The results demonstrate that our proposed chemical etch treatment（CET） with the proper etching time could be an effective way to remove the BRL.After removal of the BRL, Al;O;/SiN;stacks are deposited by atomic layer deposition（ALD） and plasma-enhanced chemical vapor deposition（PECVD） to passivate the cell surface. It was found that a reasonably-high implied Voc of 680 mV has been achieved for the fabricated n-type Si solar cells.展开更多
文摘利用等离子增强化学气相沉积(PECVD)技术,采用NH_3等离子体预氮化法淀积α-SiN_x介质膜,同时结合layer by layer生长nc-Si的方法一次性原位制备了α-SiN_x/nc-Si/α-SiN_x双势垒结构样品.通过原子力显微镜(AFM)测量,估算了nc-Si的密度为1.2×10^(11)cm^(-2).通过C-V测量研究镶嵌在SiN_x双势垒层中的nc-Si颗粒的电荷存储现象.C-V曲线出现明显的迥滞现象,迴滞窗口约为1 V,表明结构中电荷存储特性.根据迴滞窗口,计算了结构中存储电荷的密度,发现存储电荷密度与nc-Si层的晶粒密度具有相同的数量级.
基金Supported by the National Natural Science Foundation of China under Grant Nos 61204006 and 61574108the Fundamental Research Funds for the Central Universities under Grant No JB141101the Foundation of Key Laboratory of Nanodevices and Applications of Suzhou Institute of Nano-Tech and Nano-Bionics of Chinese Academy of Sciences under Grant No 15CS01
文摘The effect of a self-organized SiNs interlayer on the defect density of （1122） semipolar GaN grown on 7n-plane sapphire is studied by transmission electron microscopy, atomic force microscopy and high resolution x-ray diffrac- tion. The SiNx interlayer reduces the c-type dislocation density from 2.5 ×10^10 cm^-2 to 5 ×10^8 cm 2. The SiNx interlayer produces regions that are free from basal plane stacking faults （BSFs） and dislocations. The overall BSF density is reduced from 2.1×10^5 cm-1 to 1.3×10^4 cm^-1. The large dislocations and BSF reduction in semipolar （1122） GaN with the SiNx, interlayer result from two primary mechanisms. The first mechanism is the direct dislocation blocking by the SiNx interlayer, and the second mechanism is associated with the unique structure character of （1122） semipolar GaN.
基金Project supported by the National Key Research and Development Program,China(Grant No.2017YFB0402800)the Key Research and Development Program of Guangdong Province,China(Grant No.2019B010128002)+1 种基金the National Natural Science Foundation of China(Grant No.U1601210)the Natural Science Foundation of Guangdong Province,China(Grant No.2015A030312011)。
文摘The effect of high overdrive voltage on the positive bias temperature instability(PBTI)trapping behavior is investigated for GaN metal–insulator–semiconductor high electron mobility transistor(MIS-HEMT)with LPCVD-SiNx gate dielectric.A higher overdrive voltage is more effective to accelerate the electrons trapping process,resulting in a unique trapping behavior,i.e.,a larger threshold voltage shift with a weaker time dependence and a weaker temperature dependence.Combining the degradation of electrical parameters with the frequency–conductance measurements,the unique trapping behavior is ascribed to the defect energy profile inside the gate dielectric changing with stress time,new interface/border traps with a broad distribution above the channel Fermi level are introduced by high overdrive voltage.
基金Project supported by the Beijing Municipal Science and Technology Commission,China(No.Z151100003515003)the Beijing Natural Science Foundation(No.4173077,2184112)+3 种基金the Fundamental Research Funds for the Central Universities,China(Nos.FRF-BR-16-018A,FRF-TP-17-022A1,06400071)the National Natural Science Foundation of China(Nos.110751402347,61274134,51402064,61274059,51602340)the Beijing Municipal Innovation and Research Base,China(No.Z161100005016095)the Youth Innovation Promotion Association of Chinese Academy of Sciences(No.2015387)
文摘In boron-doped p+-n crystalline silicon（Si） solar cells, p-type boron doping control and surface passivation play a vital role in the realization of high-efficiency and low cost pursuit. In this study, boron-doped p+-emitters are formed by boron diffusion in an open-tube furnace using borontribromide（BBr3） as precursor. The formed emitters are characterized in detail in terms of shape of the doping profile, surface doping concentration, junction depth, sheet resistance and removal of the boron-rich layer（BRL）. In the aspect of BRL removal, three different methods were adopted to investigate their influence on device performance. The results demonstrate that our proposed chemical etch treatment（CET） with the proper etching time could be an effective way to remove the BRL.After removal of the BRL, Al;O;/SiN;stacks are deposited by atomic layer deposition（ALD） and plasma-enhanced chemical vapor deposition（PECVD） to passivate the cell surface. It was found that a reasonably-high implied Voc of 680 mV has been achieved for the fabricated n-type Si solar cells.
