应力强度因子是预测荷载作用下结构中裂纹产生和扩展的重要参数。半解析的比例边界有限元法结合了有限元和边界元法的优势,在裂纹尖端或存在奇异应力的区域不需要局部网格细化,可以直接提取应力强度因子。在比例边界有限元法计算应力强...应力强度因子是预测荷载作用下结构中裂纹产生和扩展的重要参数。半解析的比例边界有限元法结合了有限元和边界元法的优势,在裂纹尖端或存在奇异应力的区域不需要局部网格细化,可以直接提取应力强度因子。在比例边界有限元法计算应力强度因子的框架下,引入随机参数进行蒙特卡罗模拟(Monte Carlo simulation, MCS),并提出一种新颖的基于MCS的不确定量化分析。与直接的MCS不同,采用奇异值分解构造低阶的子空间,降低系统的自由度,并使用径向基函数对子空间进行近似,通过子空间的线性组合获得新的结构响应,实现基于MCS的快速不确定量化分析。考虑不同荷载状况下,结构形状参数和材料属性参数对应力强度因子的影响,使用改进的MCS计算应力强度因子的统计特征,量化不确定参数对结构的影响。最后通过若干算例验证了该算法的准确性和有效性。展开更多
Circular holes are commonly employed in engineering designs;however, they often serve as locations where cracks initiate and propagate. This paper explores a novel approach to structural repair by utilizing piezoelect...Circular holes are commonly employed in engineering designs;however, they often serve as locations where cracks initiate and propagate. This paper explores a novel approach to structural repair by utilizing piezoelectric actuators. The primary focus of this study is to investigate the influence of an adhesively bonded piezoelectric actuator patch placed above a circular hole on the stress intensity factor (SIF) in an aluminium plate. The plate is subjected to uniaxial tensile stress, while the piezoelectric actuator is excited with varying voltage levels. The analysis is conducted using the finite element method (FEM), a powerful numerical technique for simulating complex structures. The study assesses the stress distribution and employs the SIF as an adequate criterion for evaluating the impact of different patch configurations. The results indicate a strong correlation between the applied voltage and the SIF. Whether the SIF increases or decreases depends on the polarization of the piezoelectric actuator. Particularly noteworthy is the finding that rectangular patches in a horizontal orientation significantly reduce the SIF compared to other patch geometries. Moreover, double-sided patches exhibit a pronounced decrease in the SIF compared to single-sided patches. In summary, this research underscores the potential of piezoelectric actuators in mitigating stress intensity in structures with circular hole with crack initiation. It offers valuable insights into the influence of applied voltage, patch geometry, and patch placement on the SIF, thereby contributing to developing effective strategies for enhancing structural integrity.展开更多
The transient and static anti-plane problem of a rigid line inclusion pulled out from an elastic medium is studied.The singular integral equation method is used to solve the stress field.Under the static load,the stre...The transient and static anti-plane problem of a rigid line inclusion pulled out from an elastic medium is studied.The singular integral equation method is used to solve the stress field.Under the static load,the stress intensity factor(SIF)at the inclusion tips increases with the medium length.The problem becomes equivalent to an inclusion in a medium with an infinite length when the length of the medium is 3.5times longer than that of the inclusion.However,under the transient load,the maximum value of the SIF occurs when the medium length is about two times the inclusion length.Besides,the relation between the pull-out force and the anti-plane displacement is given.The conclusions are useful in guiding the design of fiber reinforced composite materials.展开更多
In this paper,we investigate the interfacial behavior of a thin one-dimensional(1D)hexagonal quasicrystal(QC)film bonded on an elastic substrate subjected to a mismatch strain due to thermal variation.The contact inte...In this paper,we investigate the interfacial behavior of a thin one-dimensional(1D)hexagonal quasicrystal(QC)film bonded on an elastic substrate subjected to a mismatch strain due to thermal variation.The contact interface is assumed to be nonslipping,with both perfectly bonded and debonded boundary conditions.The Fourier transform technique is adopted to establish the integral equations in terms of interfacial shear stress,which are solved as a linear algebraic system by approximating the unknown phonon interfacial shear stress via the series expansion of the Chebyshev polynomials.The expressions are explicitly obtained for the phonon interfacial shear stress,internal normal stress,and stress intensity factors(SIFs).Finally,based on numerical calculations,we briefly discuss the effects of the material mismatch,the geometry of the QC film,and the debonded length and location on stresses and SIFs.展开更多
文摘应力强度因子是预测荷载作用下结构中裂纹产生和扩展的重要参数。半解析的比例边界有限元法结合了有限元和边界元法的优势,在裂纹尖端或存在奇异应力的区域不需要局部网格细化,可以直接提取应力强度因子。在比例边界有限元法计算应力强度因子的框架下,引入随机参数进行蒙特卡罗模拟(Monte Carlo simulation, MCS),并提出一种新颖的基于MCS的不确定量化分析。与直接的MCS不同,采用奇异值分解构造低阶的子空间,降低系统的自由度,并使用径向基函数对子空间进行近似,通过子空间的线性组合获得新的结构响应,实现基于MCS的快速不确定量化分析。考虑不同荷载状况下,结构形状参数和材料属性参数对应力强度因子的影响,使用改进的MCS计算应力强度因子的统计特征,量化不确定参数对结构的影响。最后通过若干算例验证了该算法的准确性和有效性。
文摘Circular holes are commonly employed in engineering designs;however, they often serve as locations where cracks initiate and propagate. This paper explores a novel approach to structural repair by utilizing piezoelectric actuators. The primary focus of this study is to investigate the influence of an adhesively bonded piezoelectric actuator patch placed above a circular hole on the stress intensity factor (SIF) in an aluminium plate. The plate is subjected to uniaxial tensile stress, while the piezoelectric actuator is excited with varying voltage levels. The analysis is conducted using the finite element method (FEM), a powerful numerical technique for simulating complex structures. The study assesses the stress distribution and employs the SIF as an adequate criterion for evaluating the impact of different patch configurations. The results indicate a strong correlation between the applied voltage and the SIF. Whether the SIF increases or decreases depends on the polarization of the piezoelectric actuator. Particularly noteworthy is the finding that rectangular patches in a horizontal orientation significantly reduce the SIF compared to other patch geometries. Moreover, double-sided patches exhibit a pronounced decrease in the SIF compared to single-sided patches. In summary, this research underscores the potential of piezoelectric actuators in mitigating stress intensity in structures with circular hole with crack initiation. It offers valuable insights into the influence of applied voltage, patch geometry, and patch placement on the SIF, thereby contributing to developing effective strategies for enhancing structural integrity.
基金Project supported by the Guangdong Basic and Applied Basic Research Foundation of China(Nos.2022A1515010801 and 2023A1515012641)the Shenzhen Science and Technology Program of China(Nos.JCYJ20220818102409020 and GXWD20220811165158003)。
文摘The transient and static anti-plane problem of a rigid line inclusion pulled out from an elastic medium is studied.The singular integral equation method is used to solve the stress field.Under the static load,the stress intensity factor(SIF)at the inclusion tips increases with the medium length.The problem becomes equivalent to an inclusion in a medium with an infinite length when the length of the medium is 3.5times longer than that of the inclusion.However,under the transient load,the maximum value of the SIF occurs when the medium length is about two times the inclusion length.Besides,the relation between the pull-out force and the anti-plane displacement is given.The conclusions are useful in guiding the design of fiber reinforced composite materials.
基金Project supported by the National Natural Science Foundation of China(Nos.11572289,1171407,11702252,and 11902293)the China Postdoctoral Science Foundation(No.2019M652563)。
文摘In this paper,we investigate the interfacial behavior of a thin one-dimensional(1D)hexagonal quasicrystal(QC)film bonded on an elastic substrate subjected to a mismatch strain due to thermal variation.The contact interface is assumed to be nonslipping,with both perfectly bonded and debonded boundary conditions.The Fourier transform technique is adopted to establish the integral equations in terms of interfacial shear stress,which are solved as a linear algebraic system by approximating the unknown phonon interfacial shear stress via the series expansion of the Chebyshev polynomials.The expressions are explicitly obtained for the phonon interfacial shear stress,internal normal stress,and stress intensity factors(SIFs).Finally,based on numerical calculations,we briefly discuss the effects of the material mismatch,the geometry of the QC film,and the debonded length and location on stresses and SIFs.
