The influences of the plasma ignition condition in plasma enhanced chemical vapour deposition （PECVD） on the interfaces and the microstructures of hydrogenated microcrystalline Si （μc-Si：H） thin films are invest...The influences of the plasma ignition condition in plasma enhanced chemical vapour deposition （PECVD） on the interfaces and the microstructures of hydrogenated microcrystalline Si （μc-Si：H） thin films are investigated. The plasma ignition condition is modified by varying the ratio of Sill4 to H2 （RH）. For plasma ignited with a constant gas ratio, the time-resolved optical emission spectroscopy presents a low value of the emission intensity ratio of Ha to Sill＊ （Iuα//SiH＊） at the initial stage, which leads to a thick amorphous incubation layer. For the ignition condition with a profiling RH, the higher IHα/ISiH＊ values are realized. By optimizing the RN modulation, a uniform crystallinity along the growth direction and a denser αc-Si：H film can be obtained. However, an excessively high IRα/ISIH＊ may damage the interface properties, which is indicated by capacitance-voltage （C-V） measurements. Well controlling the ignition condition is critically important for the applications of Si thin films.展开更多
Cubic boron nitride thin films were deposited on silicon substrates by low-pressure inductively coupled plasmaenhanced chemical vapour deposition. It was found that the introduction of 02 into the deposition system su...Cubic boron nitride thin films were deposited on silicon substrates by low-pressure inductively coupled plasmaenhanced chemical vapour deposition. It was found that the introduction of 02 into the deposition system suppresses both nucleation and growth of cubic boron nitride. At a B2H6 concentration of 2.5% during film deposition, the critical O2 concentration allowed for the nucleation of cubic boron nitride was found to be less than 1.4%, while that for the growth of cubic boron nitride was higher than 2.1%. Moreover, the infrared absorption peak observed at around 1230- 1280 cm^-1, frequently detected for cubic boron nitride films prepared using non-ultrahigh vacuum systems, appears to be due to the absorption of boron oxide, a contaminant formed as a result of the oxygen impurity. Therefore, the existence of trace oxygen contamination in boron nitride films can be evaluated qualitatively by this infrared absorption peak.展开更多
Evolution of chemical bonding configurations for the films deposited from hexam- ethyldisiloxane （HMDSO） diluted with H2 during plasma assisted chemical vapour deposition is investigated. In the experiment a small a...Evolution of chemical bonding configurations for the films deposited from hexam- ethyldisiloxane （HMDSO） diluted with H2 during plasma assisted chemical vapour deposition is investigated. In the experiment a small amount of CH4 was added to adjust the plasma environment and modify the structure of the deposited films. The measurements of Raman spectroscopy and X-ray diffraction （XRD） revealed the production of 6H-SiC embedded in the amorphous matrix without the input of CH4. As CH4 was introduced into the deposition reaction, the transition of 6H-SiC to cubic SiC in the films took place, and also the film surfaces changed from a structure of ellipsoids to cauliflower-like shapes. With a further increase of CH4 in the flow ratio, the obtained films varied from Si-C bonding dominant to a sp^2/sp^3 carbon-rich composition.展开更多
SiNx：H films with different N/Si ratios are synthesized by plasma-enhanced chemical vapor deposition （PECVD）. Composition and structure characteristics are detected by Fourier transform infrared spectroscopy （FTIR...SiNx：H films with different N/Si ratios are synthesized by plasma-enhanced chemical vapor deposition （PECVD）. Composition and structure characteristics are detected by Fourier transform infrared spectroscopy （FTIR） and X-ray photoelectron spectroscopy （XPS）. It indicates that Si-N bonds increase with increased NH3/SiH4 ratio. Electrical property investigations by I-V measurements show that the prepared films offer higher resistivity and less leakage current with increased N/Si ratio and exhibit entirely insulating properties when N/Si ratio reaches 0.9, which is ascribed to increased Si-N bonds achieved.展开更多
The inductively coupled plasma chemical vapor deposition(ICP-CVD) deposited silicon nitride(SiN_(x)) thin film was evaluated for its application as the electrical insulating film for a capacitor device.In order to ach...The inductively coupled plasma chemical vapor deposition(ICP-CVD) deposited silicon nitride(SiN_(x)) thin film was evaluated for its application as the electrical insulating film for a capacitor device.In order to achieve highest possible dielectric strength of SiN_(x),the process parameters of ICP-CVD were carefully tuned to control hydrogen in SiN_(x) films by means of tuning N_(2)/SiH_(4) ratio and radio frequency(RF) power.Besides electrical measurements,the hydrogen content in the films was measured by dynamic secondary ion mass spectrometry(D-SIMS).Fourier transform infrared spectroscopy(FTIR) and micro Raman spectroscopy were used to characterize the SiN_(x) films by measuring Si-H and N-H bonds’ intensities.It was found that the more Si-H bonds lead to the higher dielectric strength.展开更多
The influence of deposition, annealing conditions, and etchants on the wet etch rate of plasma enhanced chemical vapor deposition （PECVD） silicon nitride thin film is studied. The deposition source gas flow rate and...The influence of deposition, annealing conditions, and etchants on the wet etch rate of plasma enhanced chemical vapor deposition （PECVD） silicon nitride thin film is studied. The deposition source gas flow rate and annealing temperature were varied to decrease the etch rate of SiNx：H by HF solution. A low etch rate was achieved by increasing the SiH4 gas flow rate or annealing temperature, or decreasing the NH3 and N2 gas flow rate. Concentrated, buffered, and dilute hydrofluoric acid were utilized as etchants for Sit2 and SiNx：H. A high etching selectivity of Sit2 over SiNx：H was obtained using highly concentrated buffered HE展开更多
Hydrogenated microcrystalline silicon （μc-Si：H） films are fabricated by very high frequency plasma enhanced chemical vapour deposition （VHF-PECVD） at a silane concentration of 7% and a varying total gas flow ra...Hydrogenated microcrystalline silicon （μc-Si：H） films are fabricated by very high frequency plasma enhanced chemical vapour deposition （VHF-PECVD） at a silane concentration of 7% and a varying total gas flow rate （H2＋SiH4）. Relations between the total gas flow rate and the electrical and structural properties as well as deposition rate of the films are studied. The results indicate that with the total gas flow rate increasing the photosensitivity and deposition rate increase, but the crystalline volume fraction （Xc） and dark conductivity decrease. And the intensity of （220） peak first increases then decreases with the increase of the total gas flow rate. The cause for the changes in the structure and deposition rate of the films with the total gas flow rate is investigated using optical emission spectroscopy （OES）.展开更多
Surface-plasmon （SP） enhancement of amorphous-silicon-nitride （a-SiNx） light emission with single-layer gold （Au） waveguides is experimentally demonstrated through time-resolved photoluminescence measure- ment. ...Surface-plasmon （SP） enhancement of amorphous-silicon-nitride （a-SiNx） light emission with single-layer gold （Au） waveguides is experimentally demonstrated through time-resolved photoluminescence measure- ment. The a-SiN~ active layer with strong steady-state photoluminescence at 560 nm is prepared by plasma-enhanced chemical vapor deposition, and ricated by magnetron sputtering. The maximum the Au waveguide on the top of the a-SiNx layer is lab- Purcell factor value of -3 is achieved with identified SP resonance of the Au waveguide at -530 nm.展开更多
基金Project supported by the National Basic Research Program of China(Grant Nos.G2006CB202601 and 2011CBA00705)the National Natural Science Foundation of China(Grant No.60806020)the Knowledge Innovation Project of Chinese Academy of Sciences(Grant No.KGCX2-YW-383-1)
文摘The influences of the plasma ignition condition in plasma enhanced chemical vapour deposition （PECVD） on the interfaces and the microstructures of hydrogenated microcrystalline Si （μc-Si：H） thin films are investigated. The plasma ignition condition is modified by varying the ratio of Sill4 to H2 （RH）. For plasma ignited with a constant gas ratio, the time-resolved optical emission spectroscopy presents a low value of the emission intensity ratio of Ha to Sill＊ （Iuα//SiH＊） at the initial stage, which leads to a thick amorphous incubation layer. For the ignition condition with a profiling RH, the higher IHα/ISiH＊ values are realized. By optimizing the RN modulation, a uniform crystallinity along the growth direction and a denser αc-Si：H film can be obtained. However, an excessively high IRα/ISIH＊ may damage the interface properties, which is indicated by capacitance-voltage （C-V） measurements. Well controlling the ignition condition is critically important for the applications of Si thin films.
基金Project supported by the National Natural Science Foundation of China (Grant No. 50772096)the Educational Department of Zhejiang Province, China (Grant No. 20061365)
文摘Cubic boron nitride thin films were deposited on silicon substrates by low-pressure inductively coupled plasmaenhanced chemical vapour deposition. It was found that the introduction of 02 into the deposition system suppresses both nucleation and growth of cubic boron nitride. At a B2H6 concentration of 2.5% during film deposition, the critical O2 concentration allowed for the nucleation of cubic boron nitride was found to be less than 1.4%, while that for the growth of cubic boron nitride was higher than 2.1%. Moreover, the infrared absorption peak observed at around 1230- 1280 cm^-1, frequently detected for cubic boron nitride films prepared using non-ultrahigh vacuum systems, appears to be due to the absorption of boron oxide, a contaminant formed as a result of the oxygen impurity. Therefore, the existence of trace oxygen contamination in boron nitride films can be evaluated qualitatively by this infrared absorption peak.
基金supported by National Natural Science Foundation of China (No. 10635010)
文摘Evolution of chemical bonding configurations for the films deposited from hexam- ethyldisiloxane （HMDSO） diluted with H2 during plasma assisted chemical vapour deposition is investigated. In the experiment a small amount of CH4 was added to adjust the plasma environment and modify the structure of the deposited films. The measurements of Raman spectroscopy and X-ray diffraction （XRD） revealed the production of 6H-SiC embedded in the amorphous matrix without the input of CH4. As CH4 was introduced into the deposition reaction, the transition of 6H-SiC to cubic SiC in the films took place, and also the film surfaces changed from a structure of ellipsoids to cauliflower-like shapes. With a further increase of CH4 in the flow ratio, the obtained films varied from Si-C bonding dominant to a sp^2/sp^3 carbon-rich composition.
文摘SiNx：H films with different N/Si ratios are synthesized by plasma-enhanced chemical vapor deposition （PECVD）. Composition and structure characteristics are detected by Fourier transform infrared spectroscopy （FTIR） and X-ray photoelectron spectroscopy （XPS）. It indicates that Si-N bonds increase with increased NH3/SiH4 ratio. Electrical property investigations by I-V measurements show that the prepared films offer higher resistivity and less leakage current with increased N/Si ratio and exhibit entirely insulating properties when N/Si ratio reaches 0.9, which is ascribed to increased Si-N bonds achieved.
基金Project supported by the Natural Science Foundation of Jiangsu Higher Education Institutions of China(Grant Nos.19KJD140002 and 19KJB140008)the Key Projects of Ministry of Science and Technology of China(Grant No.SQ2020YFF0407077)+3 种基金Postgraduate Research&Practice Innovation Program of Jiangsu Province,China(Grant Nos.2020XKT786 and KYCX202337)the National Foreign Experts Bureau High-end Foreign Experts Project,China(Grant No.G20190114003)the Key Research and Development Program of Jiangsu Province,China(Grant No.BE2018063)the Scientific Research Program for Doctoral Teachers of JSNU(Grant No.9212218113)。
文摘The inductively coupled plasma chemical vapor deposition(ICP-CVD) deposited silicon nitride(SiN_(x)) thin film was evaluated for its application as the electrical insulating film for a capacitor device.In order to achieve highest possible dielectric strength of SiN_(x),the process parameters of ICP-CVD were carefully tuned to control hydrogen in SiN_(x) films by means of tuning N_(2)/SiH_(4) ratio and radio frequency(RF) power.Besides electrical measurements,the hydrogen content in the films was measured by dynamic secondary ion mass spectrometry(D-SIMS).Fourier transform infrared spectroscopy(FTIR) and micro Raman spectroscopy were used to characterize the SiN_(x) films by measuring Si-H and N-H bonds’ intensities.It was found that the more Si-H bonds lead to the higher dielectric strength.
基金Project supported by the National High Technology Research and Development Program of China (No.2007AA04Z322)the State Key Development Program for Basic Research of China (No.2009CB320305)the Hundred Talents Plan of Chinese Academy of Sciences
文摘The influence of deposition, annealing conditions, and etchants on the wet etch rate of plasma enhanced chemical vapor deposition （PECVD） silicon nitride thin film is studied. The deposition source gas flow rate and annealing temperature were varied to decrease the etch rate of SiNx：H by HF solution. A low etch rate was achieved by increasing the SiH4 gas flow rate or annealing temperature, or decreasing the NH3 and N2 gas flow rate. Concentrated, buffered, and dilute hydrofluoric acid were utilized as etchants for Sit2 and SiNx：H. A high etching selectivity of Sit2 over SiNx：H was obtained using highly concentrated buffered HE
基金Project supported the Key Project of Tianjin Municipal Science and Technology Commission （Grant No 043186511）, the National Natural Science Foundation of China （Grant No 60506003）, and the Chinese-Greece International Project,
文摘Hydrogenated microcrystalline silicon （μc-Si：H） films are fabricated by very high frequency plasma enhanced chemical vapour deposition （VHF-PECVD） at a silane concentration of 7% and a varying total gas flow rate （H2＋SiH4）. Relations between the total gas flow rate and the electrical and structural properties as well as deposition rate of the films are studied. The results indicate that with the total gas flow rate increasing the photosensitivity and deposition rate increase, but the crystalline volume fraction （Xc） and dark conductivity decrease. And the intensity of （220） peak first increases then decreases with the increase of the total gas flow rate. The cause for the changes in the structure and deposition rate of the films with the total gas flow rate is investigated using optical emission spectroscopy （OES）.
基金supported by the National Basic Research Program of China(Nos.2011CBA00608 and 2011CBA00303)the National Natural Science Foundation of China(Nos.61036011 and 61036010)
文摘Surface-plasmon （SP） enhancement of amorphous-silicon-nitride （a-SiNx） light emission with single-layer gold （Au） waveguides is experimentally demonstrated through time-resolved photoluminescence measure- ment. The a-SiN~ active layer with strong steady-state photoluminescence at 560 nm is prepared by plasma-enhanced chemical vapor deposition, and ricated by magnetron sputtering. The maximum the Au waveguide on the top of the a-SiNx layer is lab- Purcell factor value of -3 is achieved with identified SP resonance of the Au waveguide at -530 nm.
