The microstructure and melting behavior of Sn-9Zn-2Cu （SZC） lead-free solder with 3 wt pct Bi and various amount of Ni additions were studied. The wetting properties and the interracial reaction of Sn-Zn-Cu with Cu ...The microstructure and melting behavior of Sn-9Zn-2Cu （SZC） lead-free solder with 3 wt pct Bi and various amount of Ni additions were studied. The wetting properties and the interracial reaction of Sn-Zn-Cu with Cu substrate were also examined. The results indicated that the addition of 3 wt pct Bi could decrease the melting point of the solder and Ni would refine the microstructure and the rod-shape Cu5Zn8 phase changed into square-shape （Cu, Ni）5Zn8 phase. The addition of Bi, Ni greatly improved the wettability of SZC solder. In addition, the interracial phase of the solders/Cu joint was typical planar Cu5Zn8 in SZC-3Bi-INi alloy.展开更多
The wetting property of （Sn-9Zn）-2Cu （wt pct） on Ni substrate and the evolution of interracial microstructure in （Sn-9Zn）-2Cu/Ni joints during soldering as well as isothermal aging were studied. The wetting abil...The wetting property of （Sn-9Zn）-2Cu （wt pct） on Ni substrate and the evolution of interracial microstructure in （Sn-9Zn）-2Cu/Ni joints during soldering as well as isothermal aging were studied. The wetting ability of eutectic Sn-gZn solder on Ni substrate was markedly improved by adding 2 wt pct Cu into this solder alloy. Plate-like Cu5Zn8 intermetallic compounds （IMCs） were detected in （Sn-9Zn）-2Cu solder matrix. A continuous NisZn21 IMC layer was formed at （Sn-9Zn）-2Cu/Ni interface after soldering. This IMC layer kept its type and integrality even after aging at 170℃ for up to 1000 h. At the early aging stage （before 500 h）, the IMC layer grew fast and its thickness followed a linear relationship with the square root of aging time. Thereafter, however, the thickness increased very slowly with longer aging time. When the joints were aged for 1000 h, a new IMC phase, （Cu,Ni）5Zn8, was found in the matrix near the interface. The formation of （Cu,Ni）5Zns phase can be attributed to the diffusion of Ni atoms into the solder matrix from the substrate.展开更多
The effects of aging time and temperature on the formation and growth behavior of interfacial intermetallic compound(IMC) of Sn-16 Sb/Cu(wt%) solder joints prepared by using dip soldering were investigated. The result...The effects of aging time and temperature on the formation and growth behavior of interfacial intermetallic compound(IMC) of Sn-16 Sb/Cu(wt%) solder joints prepared by using dip soldering were investigated. The results show that the major IMCs between Sn-16 Sb solder and Cu substrate after thermal aging are Cu3 Sn and Cu6 Sn5. The thickness of the interfacial IMC in Sn-16 Sb/Cu is linearly against the square root of aging time, which indicates that the growth of IMC is mainly controlled by diffusion between Cu and Sn atoms. By using linear regression method, the growth rate constants of interfacial IMC layers are 1.254×10^-18, 8.821×10^-18 and 1.22×10^-17 m^2 s^-1 for Sn-16 Sb/Cu joints aged at 120, 150 and 170 ℃, respectively. Besides, the activation energy of the interfacial IMC growth was also calculated to be 68.27 kJ/mol. The IMC grain diameters after aging treatment increase with the increasing aging time, with i e, d = 0.492 t0.106, d = 0.543 t0.143 and d = 0.290 t0.263 for aging temperatures of 120, 150 and 170 ℃, respectively. Besides, by using nanoindentation, the softening of Sn-16 Sb solder was found during aging treatment. Moreover, the U-shape evolution of the values in hardness and Young’s moduli was found in this work.展开更多
Solder size effect on early stage interfacial intermetallic compound(IMC) evolution in wetting reaction between Sne3.0Age0.5Cu solder balls and electroless nickel electroless palladium immersion gold(ENEPIG) pads at 2...Solder size effect on early stage interfacial intermetallic compound(IMC) evolution in wetting reaction between Sne3.0Age0.5Cu solder balls and electroless nickel electroless palladium immersion gold(ENEPIG) pads at 250 C was investigated. The interfacial IMCs transformed from initial needle- and rodtype(Cu,Ni)6Sn5to dodecahedron-type(Cu,Ni)6Sn5and then to needle-type(Ni,Cu)3Sn4at the early interfacial reaction stage. Moreover, these IMC transformations occurred earlier in the smaller solder joints, where the decreasing rate of Cu concentration was faster due to the Cu consumption by the formation of interfacial(Cu,Ni)6Sn5. On thermodynamics, the decrease of Cu concentration in liquid solder changed the phase equilibrium at the interface and thus resulted in the evolution of interfacial IMCs; on kinetics, larger solder joints had sufficient Cu flux toward the interface to feed the(Cu,Ni)6Sn5growth in contrast to smaller solder joints, thus resulted in the delayed IMC transformation and the formation of larger dodecahedron-type(Cu,Ni)6Sn5grains. In smaller solders, no spalling but the consumption of(Cu,Ni)6Sn5grains by the formation of(Ni,Cu)3Sn4grains occurred where smaller discrete(Cu,Ni)6Sn5grains formed at the interface.展开更多
Sn-10Sb-5Cu lead-free solder was fabricated for high temperature application in electronic package. Wetting behaviors and interfacial reaction between such a high temperature lead-free solder and Cu substrate were inv...Sn-10Sb-5Cu lead-free solder was fabricated for high temperature application in electronic package. Wetting behaviors and interfacial reaction between such a high temperature lead-free solder and Cu substrate were investigated and compared with those of 95Pb-Sn solder. The results showed that the wetting properties of Sn-10Sb-SCu solder are superior to those of 95Pb-Sn solder in maximum wetting force, wetting time and wetting angle in the temperature range of 340-400℃. However, the surface of the Sn-10Sb-5Cu solder sample after wetting balance tests was rougher than that of 95Pb-Sn solder at the temperature lower than 360℃. In static liquid-state interracial reaction, the types and thickness of the intermetallic compounds （IMCs） of both solders were different from each other. The wetting kinetics in the Sn-10Sb-5Cu/Cu system was more rapid than that in 95Pb-Sn/Cu system, and the higher formation rate of IMCs in the former system was considered as the reason.展开更多
The formation and growth behavior of intermetallic compound(IMC) layers after introducing an electroless Ni-W-P metallization into the Sn-3.0Ag-0.5Cu(SAC305) solder joint during soldering and aging were investigated. ...The formation and growth behavior of intermetallic compound(IMC) layers after introducing an electroless Ni-W-P metallization into the Sn-3.0Ag-0.5Cu(SAC305) solder joint during soldering and aging were investigated. The soldering was performed at 250 ℃ for 10 min, followed by air cooling and aging treatment at 150 ℃ up to 15 days. The results show that the scallop-like Cu_6Sn_5 IMC layer and planar-like Cu_3Sn formed between solder and Cu substrate during soldering and aging. The Ni_3P and(Ni,Cu)_3Sn_4 compounds were formed between electroless Ni-W-P layer and solder, and Cu substrate was not damaged and kept a smooth interface. When the isothermal aging treatment was applied, the total thickness of IMCs which formed at the SAC305/Cu and SAC305/Ni-W-P/Cu interface increased with increasing aging time. Kirkendall voids emerged at the Cu_3Sn and the Ni_3P layers, but the voids emerged at the Ni_3P layer in the form of crack. The amount of Kirkendall voids increased and the crack elongated with increasing aging time. The Cu_6Sn_5 and(Ni,Cu)_3Sn_4grains grew by merging adjacent grains. In the process of growth, the growing interfacial compounds filled the free space, and new columnar dendrite grain of(Ni,Cu)_3Sn_4 constantly generated during aging treatment. After 15 days aging, the Ni-W-P barrier layer was still remained, which indicated that the Ni-W-P layer can be a good barrier layer between the solder alloys and Cu substrate.展开更多
文摘The microstructure and melting behavior of Sn-9Zn-2Cu （SZC） lead-free solder with 3 wt pct Bi and various amount of Ni additions were studied. The wetting properties and the interracial reaction of Sn-Zn-Cu with Cu substrate were also examined. The results indicated that the addition of 3 wt pct Bi could decrease the melting point of the solder and Ni would refine the microstructure and the rod-shape Cu5Zn8 phase changed into square-shape （Cu, Ni）5Zn8 phase. The addition of Bi, Ni greatly improved the wettability of SZC solder. In addition, the interracial phase of the solders/Cu joint was typical planar Cu5Zn8 in SZC-3Bi-INi alloy.
基金supported by the National Key Project of ScientificTechnical Supporting Programs during the 11th Five-year Plan (No. 2006BAE03B02-2)NSFC Key Program (No. U0734006)
文摘The wetting property of （Sn-9Zn）-2Cu （wt pct） on Ni substrate and the evolution of interracial microstructure in （Sn-9Zn）-2Cu/Ni joints during soldering as well as isothermal aging were studied. The wetting ability of eutectic Sn-gZn solder on Ni substrate was markedly improved by adding 2 wt pct Cu into this solder alloy. Plate-like Cu5Zn8 intermetallic compounds （IMCs） were detected in （Sn-9Zn）-2Cu solder matrix. A continuous NisZn21 IMC layer was formed at （Sn-9Zn）-2Cu/Ni interface after soldering. This IMC layer kept its type and integrality even after aging at 170℃ for up to 1000 h. At the early aging stage （before 500 h）, the IMC layer grew fast and its thickness followed a linear relationship with the square root of aging time. Thereafter, however, the thickness increased very slowly with longer aging time. When the joints were aged for 1000 h, a new IMC phase, （Cu,Ni）5Zn8, was found in the matrix near the interface. The formation of （Cu,Ni）5Zns phase can be attributed to the diffusion of Ni atoms into the solder matrix from the substrate.
基金Funded by the National Natural Science Foundation of China(Nos.51465039,51665038,51765040)Natural Science Foundation of Jiangxi Province(Nos.20161BAB206122 and 20171ACB21011)
文摘The effects of aging time and temperature on the formation and growth behavior of interfacial intermetallic compound(IMC) of Sn-16 Sb/Cu(wt%) solder joints prepared by using dip soldering were investigated. The results show that the major IMCs between Sn-16 Sb solder and Cu substrate after thermal aging are Cu3 Sn and Cu6 Sn5. The thickness of the interfacial IMC in Sn-16 Sb/Cu is linearly against the square root of aging time, which indicates that the growth of IMC is mainly controlled by diffusion between Cu and Sn atoms. By using linear regression method, the growth rate constants of interfacial IMC layers are 1.254×10^-18, 8.821×10^-18 and 1.22×10^-17 m^2 s^-1 for Sn-16 Sb/Cu joints aged at 120, 150 and 170 ℃, respectively. Besides, the activation energy of the interfacial IMC growth was also calculated to be 68.27 kJ/mol. The IMC grain diameters after aging treatment increase with the increasing aging time, with i e, d = 0.492 t0.106, d = 0.543 t0.143 and d = 0.290 t0.263 for aging temperatures of 120, 150 and 170 ℃, respectively. Besides, by using nanoindentation, the softening of Sn-16 Sb solder was found during aging treatment. Moreover, the U-shape evolution of the values in hardness and Young’s moduli was found in this work.
基金supported by the National Natural Science Foundation of China under Grant Nos. 51475072 and 51171036
文摘Solder size effect on early stage interfacial intermetallic compound(IMC) evolution in wetting reaction between Sne3.0Age0.5Cu solder balls and electroless nickel electroless palladium immersion gold(ENEPIG) pads at 250 C was investigated. The interfacial IMCs transformed from initial needle- and rodtype(Cu,Ni)6Sn5to dodecahedron-type(Cu,Ni)6Sn5and then to needle-type(Ni,Cu)3Sn4at the early interfacial reaction stage. Moreover, these IMC transformations occurred earlier in the smaller solder joints, where the decreasing rate of Cu concentration was faster due to the Cu consumption by the formation of interfacial(Cu,Ni)6Sn5. On thermodynamics, the decrease of Cu concentration in liquid solder changed the phase equilibrium at the interface and thus resulted in the evolution of interfacial IMCs; on kinetics, larger solder joints had sufficient Cu flux toward the interface to feed the(Cu,Ni)6Sn5growth in contrast to smaller solder joints, thus resulted in the delayed IMC transformation and the formation of larger dodecahedron-type(Cu,Ni)6Sn5grains. In smaller solders, no spalling but the consumption of(Cu,Ni)6Sn5grains by the formation of(Ni,Cu)3Sn4grains occurred where smaller discrete(Cu,Ni)6Sn5grains formed at the interface.
基金supported by the Science and Technology Program of Zhejiang Province,China (No.2008F1024)
文摘Sn-10Sb-5Cu lead-free solder was fabricated for high temperature application in electronic package. Wetting behaviors and interfacial reaction between such a high temperature lead-free solder and Cu substrate were investigated and compared with those of 95Pb-Sn solder. The results showed that the wetting properties of Sn-10Sb-SCu solder are superior to those of 95Pb-Sn solder in maximum wetting force, wetting time and wetting angle in the temperature range of 340-400℃. However, the surface of the Sn-10Sb-5Cu solder sample after wetting balance tests was rougher than that of 95Pb-Sn solder at the temperature lower than 360℃. In static liquid-state interracial reaction, the types and thickness of the intermetallic compounds （IMCs） of both solders were different from each other. The wetting kinetics in the Sn-10Sb-5Cu/Cu system was more rapid than that in 95Pb-Sn/Cu system, and the higher formation rate of IMCs in the former system was considered as the reason.
基金Funded by National Natural Science Foundation of China(Nos.51465039,51665038)Natural Science Foundation of Jiangxi Province(Nos.20151BAB206041,20161BAB206122)the State Key Laboratory of Solidification Processing in NWPU(No.SKLSP201508)
文摘The formation and growth behavior of intermetallic compound(IMC) layers after introducing an electroless Ni-W-P metallization into the Sn-3.0Ag-0.5Cu(SAC305) solder joint during soldering and aging were investigated. The soldering was performed at 250 ℃ for 10 min, followed by air cooling and aging treatment at 150 ℃ up to 15 days. The results show that the scallop-like Cu_6Sn_5 IMC layer and planar-like Cu_3Sn formed between solder and Cu substrate during soldering and aging. The Ni_3P and(Ni,Cu)_3Sn_4 compounds were formed between electroless Ni-W-P layer and solder, and Cu substrate was not damaged and kept a smooth interface. When the isothermal aging treatment was applied, the total thickness of IMCs which formed at the SAC305/Cu and SAC305/Ni-W-P/Cu interface increased with increasing aging time. Kirkendall voids emerged at the Cu_3Sn and the Ni_3P layers, but the voids emerged at the Ni_3P layer in the form of crack. The amount of Kirkendall voids increased and the crack elongated with increasing aging time. The Cu_6Sn_5 and(Ni,Cu)_3Sn_4grains grew by merging adjacent grains. In the process of growth, the growing interfacial compounds filled the free space, and new columnar dendrite grain of(Ni,Cu)_3Sn_4 constantly generated during aging treatment. After 15 days aging, the Ni-W-P barrier layer was still remained, which indicated that the Ni-W-P layer can be a good barrier layer between the solder alloys and Cu substrate.
