Zn-Sb双掺杂Mg_2(Si,Sn)合金的热电性能

Mg_2(Si,Sn)合金热电材料具有成本低廉、环境友好等优点,作为一种绿色环保的中温区热电材料一直受到广泛关注。在Mg_2(Si,Sn)基材料中掺杂大剂量Sb可诱发Mg空位,从而有效降低材料的热导率,但同时Seebeck系数也会降低。研究采用高温熔炼及真空热压法成功合成了Mg_(2.12-y)Si_(0.4)Sn_(0.5)Sb_(0.1)Zn_y(y=0～0.025)试样,通过在大剂量Sb掺杂的Mg_2(Si,Sn)基材料中添加Zn元素,研究了大剂量Sb和微量Zn双掺杂对材料电声输运特性的综合影响。研究结果表明,Zn-Sb双掺杂可通过有效抑制材料电子热导率的方法大幅降低Mg_2(Si,Sn)合金材料的总热导率,与此同时明显提高掺Zn试样的塞贝克系数以弥补其电导率的损失,维持材料较为优异的电学性能。最终,热导率的大幅优化及电学性能的维持实现了材料综合热电性能的显著提升,其中,成分为Mg_(2.095)Si_(0.4)Sn_(0.5)Sb_(0.1)Zn_(0.025)的材料在823 K下热电优值ZT达到1.42。

Mg_(2)(Si,Sn)合金大尺寸试样低温固相反应法制备及其热电性能

Mg_(2)(Si,Sn)合金是一种受到广泛关注的中温区热电材料,具有成本低廉、环境友好等优点。Mg_(2)(Si,Sn)材料研究中非常重要的一环在于如何实现对Mg元素的精准控制,采用低温固相反应法可能是一种切实有效的方法。本研究通过低温固相反应法成功制备了高质量Mg_(2)(Si,Sn)合金试样,并将此方法应用至百克级Mg_(2)Si_(0.35)Sn_(0.635)Sb_(0.015)大尺寸试样的制备中,研究了大尺寸试样不同区域的热电性能及其均匀性。实验结果表明低温固相反应法能有效抑制Mg元素的挥发,实现对其较为精准的成分控制;制得的大尺寸试样的致密度沿压力方向存在规律性分布,越靠近试样中心材料致密度越高,相应地其组分含量和热电性能也随之变化。在640 K时,Mg_(2)Si_(0.35)Sn_(0.635)Sb_(0.015)大尺寸试样在所研究的不同区域最高zT值约为0.75,平均zT值达到0.66。

Solidification process and microstructure evolution of bulk undercooled Co-Sn alloys

A series of Co-Sn alloys with Sn content ranging from 12% to 32%（mole fraction） were undercooled to different degrees below the equilibrium liquidus temperature and the solidification behaviors were investigated by monitoring the temperature recalescence and examing the solidification microstructures.A boundary clearly exists,which separates the coupled growth zone from the decoupled growth zone of eutectic phases for the alloys with Sn content ranging from 14% to 31%（mole fraction）.The other Co-Sn alloys out of this content range are hard to be undercooled into the coupled growth zone in the experiment.It is found that the so-called non-reciprocal nucleation phenomenon does not happen in the solidification of undercooled Co-Sn off-eutectic alloys.

Recycling of metals from waste Sn-based alloys by vacuum separation

In order to recycle waste Sn-based alloys, the vapor-liquid phase equilibrium composition diagrams of Sn-Pb, Sn-Sb and Sn-Zn binary systems were calculated. The calculated results indicate that Pb, Sb and Zn can be separated from Sn effectively. Based on the above calculation, the industrial experiments of vacuum distillation of Sn-Pb alloy, Sn-Pb-Sb alloy, Sn-Pb-Sb-As alloy, crude Sn and Sn-Zn alloy with different contents were carried out. The experimental results show that Pb(>99% Pb) and Sn(≤0.003% Pb) were obtained simultaneously while Sn-Pb alloy was subjected to vacuum distillation; the crude Sn(>90% Sn, ≤ 2% Pb, ≤6% Sb) and crude Pb(≤2% Sn) were obtained simultaneously while a single vacuum distillation was carried out for Sn-Pb-Sb alloy; the Pb and Bi contents in the Sn ingot(99.99% Sn) achieve the grade A of GB/T 728—2010 standard, more than 50% of As and Sb was removed after vacuum distillation of crude Sn; Zn(<0.002% Sn) and Sn(about 3% Zn) were obtained while vacuum distillation of Sn-Zn alloy was conducted at 1173 K, 20-30 Pa for 8-10 h.

Microstructures and mechanical properties of extruded and aged Mg-Zn-Mn-Sn-Y alloys

The microstructures and mechanical properties of Mg-6Zn-1Mn-4Sn and Mg-6Zn-1Mn-4Sn-0.5Y alloys under extrusion and T6 aging conditions were investigated by optical microscopy（OM）, X-ray diffraction（XRD）, scanning electron microscopy（SEM） and tensile test. The results show that Y element refines the grains and improves the comprehensive mechanical properties of ZMT614-0.5Y both in as-extruded and T6 states. The phase compositions of Mg-6Zn-1Mn-4Sn-0.5Y are α-Mg, Mg Zn2, Mn, Mg2 Sn and Mg Sn Y phases. After T6 treatment, the ultimate tensile strength（UTS） and yield strength（YS） increase while the elongation decreases severely. For both of these alloys, the theoretical results combined with the experimental values demonstrate that the grain boundary strengthening and solid solution strengthening play an important role in enhancing the YS in the as-extruded state, while the precipitation strengthening is the key factor for the enhancement of YS in the T6 state.

Effect of traveling magnetic field on dendrite growth of Pb-Sn alloy during directional solidification

The influence of melt convection on dendrite growth during the upward-directional solidification of Pb-33%Sn binary alloys was investigated.The melt convection was modulated by traveling magnetic field.When the direction of traveling magnetic field was changed from upward to downward,the primary dendrite spacing gradually increased,and the distribution peak of the primary dendrite spacing shifted to the field of narrower spacing.These result from the different intensities of melt convection,which are controlled by the traveling magnetic field.The effects of the traveling magnetic field on melt convection are similar to those of adjustment in the gravity level,thus,the primary dendrite spacing varies.When the intensity of the traveling magnetic field was 1 mT,and the drawing speed was 50 μm/s,the gravity acceleration reached 0.22g for the downward-traveling magnetic field and 3.07g for the upward-traveling magnetic field.

Effect of Sb content on properties of Sn-Bi solders

The effect of Sb content on the properties of Sn-Bi solders was studied. The nonequilibrium melting behaviors of a series of Sn-Bi-Sb solders were examined by differential scanning calorimetry （DSC）. The spreading test was carried out to characterize the wettability of Sn-Bi-Sb solders on Cu substrate. The mechanical properties of the solders/Cu joints were evaluated. The results show that the ternary alloy solders contain eutectic structure resulting from quasi-peritetic reaction. With the increase of Sb content, the amount of the eutectic structure increases. At a heating rate of 5 ℃/min, Sn-Bi-Sb alloys exhibit a higher melting point and a wider melting range. A small amount of Sb has an impact on the wettability of Sn-Bi solders. The reaction layers form during spreading process. Sb is detected in the reaction layer while Bi is not detected. The total thickness of reaction layer between solder and Cu increases with the increase of the Sb content. The shear strength of the Sn-Bi-Sb solders increases as the Sb content increases.

Effects of heat treatment on microstructure and mechanical properties of Mg-3Sn-1Mn magnesium alloy

The effects of heat treatment on the microstructure and mechanical properties of Mg-3Sn-1Mn alloy were preliminarily investigated by using optical and electron microscopy,X-ray diffraction（XRD） analysis,and tensile and creep test.The results indicate that the heat treatment has an obvious effect on the microstructure and mechanical properties of the Mg-3Sn-1Mn alloy.After the solid solution treatment at 420 ℃,a majority of the Mg2Sn phases in the alloy are dissolved into the matrix.However,after the further aging treatment at 250 ℃,lots of fine Mg2Sn phases in the aged alloy are precipitated at the grain boundaries and within the grains.As a result,the tensile and creep properties of the aged alloy are significantly improved.The mechanism for the higher tensile and creep properties of the aged alloy is related to the dispersive distribution of the Mg2Sn phase in the--Mg matrix.

Effects of Ce, Y and Gd additions on as-cast microstructure and mechanical properties of Mg-3Sn-2Sr magnesium alloy

The effects of Ce, Y and Gd additions on the as-cast microstructure and mechanical properties of Mg-3Sn-2Sr alloy were investigated and compared by scanning electron microscopy, X-ray diffraction, differential scanning calorimetry analysis, tensile and creep tests. The results indicate that the Mg-3Sn-2Sr ternary alloy is mainly composed ofα-Mg, primary and eutectic SrMgSn, and Mg2Sn phases. After the additions of 1.0%Ce, 1.0%Y and 1.0%Gd to the Mg-3Sn-2Sr alloy, the Mg12Ce, YMgSn, GdMgSn and/or Mg17Sr2 phases are formed, respectively. At the same time, the formation of the primary SrMgSn phase is suppressed and the coarse needle-like primary SrMgSn phase is modified and refined. In addition, the additions of 1.0% Ce, 1.0% Y and 1.0% Gd to the Mg-3Sn-2Sr alloy can simultaneously improve the tensile and creep properties of the alloy. Among the Ce-, Y-and Gd-containing alloys, the tensile properties of the Ce-containing alloy are relatively higher than those of the Y-and Gd-containing alloys.

Microstructure, mechanical and bio-corrosion properties of as-extruded Mg-Sn-Ca alloys

The as-extruded Mg？Sn？Ca alloys were prepared and investigated for orthopedic applications via using optical microscopy, scanning electron microscopy, X-ray diffraction, as well as tensile, immersion and electrochemical tests. The results showed that, with the addition of 1% Sn and the Ca content of 0.2%？0.5%, the microstructure of the as-extruded Mg？Sn？Ca alloys became homogenous, which led to increased mechanical properties and improved corrosion resistance. Further increase of Ca content up to 1.5% improved the strength, but deteriorated the ductility and corrosion resistance. For the alloy containing 0.5% Ca, when the Sn content increased from 1% to 3%, the ultimate tensile strength increased with a decreased corrosion resistance, and the lowest yield strength and ductility appeared with the Sn content of 2%. These behaviors were determined by Sn/Ca mass ratio. The analyses showed that as-extruded Mg？1Sn？0.5Ca alloy was promising as a biodegradable orthopedic implant.

Effect of travelling magnetic field on interface morphology in directionally solidified Sn-Cd alloy

The diversity of interface morphologies is observed for directionally solidified Sn-0.65%Cd alloy under a travelling magnetic field （TMF） in the 4 mm-diameter sample. Under an upward TMF, planar and cellular interface morphologies transform alternately with increasing magnetic flux density （B≤10.3 mT）. The interface morphology transforms from shallow cellular to deep cellular morphology under a weak downward TMF （B=3.2 mT）. When the magnetic flux density increases further, both sides of the interface morphology appear to be slightly inconsistent, but they roughly tend to be planar under a strong downward TMF （BS10.3 mT）. The interface instability may be attributed to the flow driven by the TMF. Moreover, the shape of interface appears to be almost flat under an upward TMF, but deflective under a downward TMF.

Corrosion and leaching behaviors of Sn-based alloy in simulated soil solutions

The corrosion and leaching behaviors of Sn-0.75Cu solders and joints in NaCl-Na2SO4 and NaCl-Na2SO4-Na2CO3 simulated soil solutions were investigated compared with those in NaCl solution, aiming to assess the potential risk from the electronic-waste disposed in soil. The leaching kinetics of Sn reveals that the leaching amount of Sn increases with increasing the time. The amount of Sn leached from the joint is the largest in NaCl solution.SO4^2- and CO3^2- inhibit the leaching of Sn from the joints, but accelerate that from the solders. Meanwhile, the corrosion layer of the joint in NaCl solution is more porous, and those immersed in NaCl-Na2SO4 and NaCl-Na2SO4-Na2CO3 solutions are compact. The XRD results indicate that the main corrosion products on the solders and joints surfaces are comprised of tin oxide, tin chloride and tin chloride hydroxide. The potentiodynamic polarization measurements for the solders were discussed in the simulated soil solutions.

Surface quality, microstructure and mechanical properties of Cu-Sn alloy plate prepared by two-phase zone continuous casting

Cu-4.7%Sn （mass fraction） alloy plate was prepared by the self-developed two-phase zone continuous casting （TZCC） process. The relationship between process parameters of TZCC and surface quality of the alloy plate was investigated. The microstructure and mechanical properties of the TZCC alloy plate were analyzed. The results show that Cu-4.7%Sn alloy plate with smooth surface can be obtained by means of reasonable matching the entrance temperature of two-phase zone mold and the continuous casting speed. The microstructure of the TZCC alloy is composed of grains-covered grains, small grains with self-closed grain boundaries, columnar grains and equiaxed grains. Compared with cold mold continuous casting Cu-4.7%Sn alloy plate, the room temperature tensile strength and ductility of the TZCC alloy plate are greatly improved.

Structure and effects of electroless Ni-Sn-P transition layer during acid electroless plating on magnesium alloys

An electroless ternary Ni-Sn-P transition layer with high corrosion resistance was applied for acid electroless nickel plating on magnesium alloys. The surface morphologies and microstructure of the traditional alkaline electroless Ni-P and novel Ni-Sn-P transition layers were compared by SEM and XRD, and the bonding strengths between the transition layers and AZ31 magnesium alloys were tested. The corrosion resistance of the samples was analyzed by porosity test, potentiodynamic polarization, electrochemical impedance spectroscopy（EIS） in acid electroless solution at p H 4.5 and immersion test in 10% HCl. The results indicate that the transition layer is essential for acid electroless plating Ni-P coatings on magnesium alloys. Under the same thin thickness（-6 μm）, the electroless Ni-Sn-P transition layer possesses superior properties to the traditional Ni-P transition layer, including high amorphization, smooth and dense surface without pores, enhanced bonding strength and corrosion resistance. Most importantly, acid electroless Ni-P coatings can be successfully deposited on magnesium alloys by using Ni-Sn-P transition layer.

Effect of Sn substitution and heat treatment on microstructure and microhardness of Co_(38)Ni_(34)Al_(28-x)Sn_x magnetic shape memory alloys

Sn was used to replace Al in Co38Ni34Al28 alloy. The microstructure and microhardness of Co38Ni34Al28-xSnx （x=0, 1, 2, 3） magnetic shape memory alloys were investigated at different heat treatment temperatures （1373 K, 1473 K, and 1573 K） for 2 h. The results show that more Sn substitution reduces the content of γ-phase and a partial phase of martensite can be obtained in Co38Ni34Al28-xSnx （x=1, 2, 3） alloys after treatment at 1573 K for 2 h. The maximum martensite phase appears when 2% Al is substituted by Sn. The reverse martensitic transformation temperature of Co38Ni34Al28-xSnx alloys increases at x=1 and 2, then decreases as x=3. As the content of Sn and the temperature increase, the microhardness will increase.

Interfacial characteristics and microstructural evolution of Sn-6.5Zn solder/Cu substrate joints during aging

The influence of isothermal aging at 150 °C on the microstructural characteristics and microhardness of the Sn-6.5Zn solder/Cu joint was studied. The mechanisms for the formation and evolution of intermetallic compound （IMC） at the interface of the Sn-6.5Zn/Cu joint were also analyzed. The results indicate that a continuous layer consisting of CuZn and Cu5Zn8 IMCs is formed in the interface zone. As the aging time prolongs, the thickness of the IMC layer first increases and then decreases, and the continuous and compactable layer is destroyed due to the decomposition of the Cu-Zn IMC layer. A discontinuous layer of Cu6Sn5 IMC is present within the Cu substrate near the decomposed region. The interface becomes rough and evident voids form after aging. The microhardness of the interface increases owing to the application of aging.

Effect of Co substitution on magnetic properties of Ni-Mn-Sn magnetic shape memory alloys

The effect of Co substitution on magnetic properties of Ni-Mn-Sn shape memory alloy was revealed by first-principles calculations. Large magnetization difference in Ni-Mn-Sn alloy obtained by addition of Co arises from enhancement of magnetization of austenite due to change of Mn-Mn interaction from anti-ferromagnetism to ferromagnetism. Total energy difference between paramagnetic and ferromagnetic austenite plays an important role in magnetic transition of Ni-Co-Mn-Sn. The altered Mn 3d states due to Co substitution give rise to difference in magnetic properties.

Effect of Sn content on microstructure and tensile properties of as-cast and as-extruded Mg-8Li-3Al-(1,2,3)Sn alloys

The effects of Sn content on microstructure and tensile properties of as-cast and as-extruded Mg-8Li-3Al-(1,2,3)Sn(wt.%)alloys were investigated by X-ray diffractometry(XRD),optical microscopy(OM),scanning electron microscopy(SEM)and tensile test.It is found that,as-cast Mg-8Li-3Al-(1,2,3)Sn alloys consist ofα-Mg+β-Li duplex matrix,MgLiAl2 and Li2Mg Sn phases.Increasing Sn content leads to grain refinement ofα-Mg dendrites and increase in content of Li2MgSn phase.During hot extrusion,complete dynamic recrystallization(DRX)takes place inβ-Li phase while incomplete DRX takes place inα-Mg phase.As Sn content is increased,the volume fraction of DRXedα-Mg grains is increased and the average grain size of DRXedα-Mg grains is decreased.Increasing Sn content is beneficial to strength but harmful to ductility for as-cast Mg-8Li-3Al-(1,2,3)Sn alloys.Tensile properties of Mg-8Li-3Al-(1,2,3)Sn alloys are improved significantly via hot extrusion and Mg-8Li-3Al-2Sn alloy exhibits the best tensile properties.

Microstructural,mechanical and shape memory characterizations of Ti-Mo-Sn alloys

As a β stabilizing element in Ti-based alloys,the effect of Mo on phase constitution,microstructure,mechanical and shape memory properties was investigated.Different compositions of Ti-xMo-3Sn alloys(where x=2,4,6,at.%) were prepared by arc melting.A binary composition of Ti-6 Mo alloy was also prepared for comparison.Ti-xMo-3Sn alloys show low hardness and high ductility with 90% reduction in thickness while Ti-6 Mo alloy shows high hardness,brittle behavior,and poor ductility.Field emission scanning electron microscopy(FESEM) reveals round morphology of athermal ω(ωath) precipitates.The presence of ωath phase is also confirmed by X-ray diffraction(XRD)in both as-cast and solution-treated and quenched conditions.The optical microscopy(OM) and FESEM show that the amount of martensite forming during quenching decreases with an increase in Mo content,which is also due to β→ω transformation.The hardness trends reinforce the presence of ωath too.The shape memory effect(SME) of 9% is the highest for Ti-6 Mo-3Sn alloy.The SME is trivial due to ωath phase formation;however,the increase in SME is observed with an increase in Mo content,which is due to the reverse transformation from ωath and the stress-induced martensitic transformation.In addition,a new and very simple method was designed and used for shape memory effect measurement.

Influence of microstructural characteristics on corrosion behavior of Mg-5Sn-3In alloy in Hank’s solution

The microstructural observation,the mass loss test,potentiodynamic polarization measurements and corrosion morphology examinations were conducted to study the influence of microstructural characteristics on corrosion behavior of Mg–5Sn–3In alloys in Hank’s solution after extrusion.The results show that the corrosion rate of the as-cast alloy is similar to that of as-extruded alloy;however,the local corrosion susceptibility is greatly weakened in the as-extruded alloy,especially in the extrusion direction.The relatively uniform corrosion morphology of the as-extruded alloy is attributed to refined Mg_(2)Sn particles,uniform distribution of Mg_(2)Sn particles and favorable crystal orientation.Meanwhile,the cytotoxicity tests confirm that the Mg–5Sn–3In alloy exhibits cytotoxicity of Grade 0−1 for NIH3T3 cells,suggesting an acceptable cytotoxicity of this alloy in the vitro assay.