枪黑色Sn-Ni合金在NaOH溶液中的析氢电催化性能

为了降低电解制氢的电耗 ,提高经济效益。作者对枪黑色Sn -Ni合金在NaOH溶液中的析氢电流化性能进行了研究。试验测出的电化学参数表明 ,在NaOH溶液中电解制氢时 ,枪黑色Sn -Ni合金的析氢电催化性能比 4 5钢和高硫镍的强很多 ,而且具有很高的电化学稳定性。用它取代目前工业上使用的 4 5钢和高硫镍作为电解制氢的阴极 。

柠檬酸盐体系电镀稀土Sn-Ni合金

采用正交实验优化,得到一种柠檬酸盐体系电镀稀土Sn-Ni合金的实验方法,给出柠檬酸盐体系电沉积稀土Sn-Ni合金的镀液成分和工艺条件,并且对镀液中各组分的作用进行研究和讨论。研究稀土添加剂CeCl3对Sn-Ni合金镀层的影响,运用扫描电子显微镜对Sn-Ni合金沉积层的组成和形貌进行分析,结果表明:镀液中加入稀土盐CeCl3,控制其质量浓度为2～5 g/L,能改善镀层性能,提高镀层的耐腐蚀性,开始生锈时间由52 h提高到143 h(无钝化)。

Modulation of microstructure and properties of Cu−Ni−Sn alloy by addition of trace Ti

The segregation of Sn and discontinuous precipitation at grain boundaries are detrimental to the strength,ductility,and machinability of the Cu−Ni−Sn alloy.A strategy to solve the above problems is multi-component composition design by introducing strong enthalpic interaction element.In this work,a series of Cu_(80)Ni_(15)Sn_(5−x)Ti_(x)(at.%)alloys were designed by cluster-plus-glue-atom model,and the effects of Ti content on the microstructure and properties of the alloys were systematically investigated using TEM and other analysis methods.The results demonstrate that Ti can effectively inhibit the segregation and discontinuous precipitation while promoting continuous precipitation to improve the high-temperature stability of the alloys.As the Ti content increases,the distribution of Ti changes from uniform distribution to predominant precipitation.The hardness and conductivity of the alloy exceed those of the C72900(Cu−15Ni−8Sn(wt.%))commercial alloy and the Cu_(80)Ni_(15)Sn_(5)(at.%)reference alloy when Ti is in the solution state.

Structure and effects of electroless Ni-Sn-P transition layer during acid electroless plating on magnesium alloys

An electroless ternary Ni-Sn-P transition layer with high corrosion resistance was applied for acid electroless nickel plating on magnesium alloys. The surface morphologies and microstructure of the traditional alkaline electroless Ni-P and novel Ni-Sn-P transition layers were compared by SEM and XRD, and the bonding strengths between the transition layers and AZ31 magnesium alloys were tested. The corrosion resistance of the samples was analyzed by porosity test, potentiodynamic polarization, electrochemical impedance spectroscopy（EIS） in acid electroless solution at p H 4.5 and immersion test in 10% HCl. The results indicate that the transition layer is essential for acid electroless plating Ni-P coatings on magnesium alloys. Under the same thin thickness（-6 μm）, the electroless Ni-Sn-P transition layer possesses superior properties to the traditional Ni-P transition layer, including high amorphization, smooth and dense surface without pores, enhanced bonding strength and corrosion resistance. Most importantly, acid electroless Ni-P coatings can be successfully deposited on magnesium alloys by using Ni-Sn-P transition layer.

Effect of Sn substitution and heat treatment on microstructure and microhardness of Co_(38)Ni_(34)Al_(28-x)Sn_x magnetic shape memory alloys

Sn was used to replace Al in Co38Ni34Al28 alloy. The microstructure and microhardness of Co38Ni34Al28-xSnx （x=0, 1, 2, 3） magnetic shape memory alloys were investigated at different heat treatment temperatures （1373 K, 1473 K, and 1573 K） for 2 h. The results show that more Sn substitution reduces the content of γ-phase and a partial phase of martensite can be obtained in Co38Ni34Al28-xSnx （x=1, 2, 3） alloys after treatment at 1573 K for 2 h. The maximum martensite phase appears when 2% Al is substituted by Sn. The reverse martensitic transformation temperature of Co38Ni34Al28-xSnx alloys increases at x=1 and 2, then decreases as x=3. As the content of Sn and the temperature increase, the microhardness will increase.

Effect of Co substitution on magnetic properties of Ni-Mn-Sn magnetic shape memory alloys

The effect of Co substitution on magnetic properties of Ni-Mn-Sn shape memory alloy was revealed by first-principles calculations. Large magnetization difference in Ni-Mn-Sn alloy obtained by addition of Co arises from enhancement of magnetization of austenite due to change of Mn-Mn interaction from anti-ferromagnetism to ferromagnetism. Total energy difference between paramagnetic and ferromagnetic austenite plays an important role in magnetic transition of Ni-Co-Mn-Sn. The altered Mn 3d states due to Co substitution give rise to difference in magnetic properties.

Macrosegregation and thermosolutal convection-related freckle formation in directionally solidified Sn−Ni peritectic alloy in crucibles with different diameters

Different from other alloys,the observation in this work on the dendritic mushy zone shows that the freckles are formed in two different regions before and after peritectic reaction in directional solidification of Sn−Ni peritectic alloys.In addition,the experimental results demonstrate that the dendritic morphology is influenced by the temperature gradient zone melting and Gibbs−Thomson effects.A new Rayleigh number(Ra_(P))is proposed in consideration of both effects and peritectic reaction.The prediction of Ra_(P) confirms the freckle formation in two regions during peritectic solidification.Besides,heavier thermosolutal convection in samples with larger diameter is also demonstrated.

Microstructure, martensitic transformation and mechanical properties of Ni-Mn-Sn alloys by substituting Fe for Ni

The effects of partial substitution of Fe element for Ni element on the structure,martensitic transformation and mechanicalproperties of Ni50-xFexMn38Sn12(x=0and3%,molar fraction)ferromagnetic shape memory alloys were investigated.Experimentalresults indicate that by substitution of Fe for Ni,the microstructure and crystal structure of the alloys change at room temperature.Compared with Ni50Mn38Sn12alloy,the martensitic transformation starting temperature of Ni47Fe3Mn38Sn12alloy is decreased by32.5K.It is also found that martensitic transformation occurs over a broad temperature window from288.9to352.2K.It is found that themechanical properties of Ni-Mn-Sn alloy can be significantly improved by Fe addition.The Ni47Fe3Mn38Sn12alloy achieves amaximum compressive strength of855MPa with a fracture strain of11%.Moreover,the mechanism of the mechanical propertyimprovement is clarified.Fe doping changes the fracture type from intergranular fracture of Ni50Mn38Sn12alloy to transgranularcleavage fracture of Ni47Fe3Mn38Sn12alloys.

Wetting of molten Sn-3.5Ag-0.5Cu on Ni-P(-SiC) coatings deposited on high volume faction SiC/Al composite

The wetting of molten Sn-3.5Ag-0.5Cu alloy on the Ni-P(-SiC)coated SiCp/Al substrates was investigated by electroless Ni plating process,and the microstructures of the coating and the interfacial behavior of wetting systems were analyzed.The SiC particles are evenly distributed in the coating and enveloped with Ni.No reaction layer is observed at the coating/SiCp/Al composite interfaces.The contact angle increases from^19°with the Ni-P coating to 29°,43°and 113°with the corresponding Ni-P-3SiC,Ni-P-6SiC and Ni-P-9SiC coatings,respectively.An interaction layer containing Cu,Ni,Sn and P forms at the Sn-Ag-Cu/Ni-P-(0,3,6)SiC coated SiCp/Al interfaces,and the Cu-Ni-Sn and Ni-Sn-P phases are detected in the interaction layer.Moreover,the molten Sn-Ag-Cu can penetrate into the Ni-P(-SiC)coatings through the Ni-P/SiC interface and dissolve them to contact the SiCp/Al substrate.

Property alterations of Sn-0.6Cu-0.05Ni-Ge lead-free solder by Ag, Bi, In and Sb addition

The Sn-Cu-Ni-Ge solder is a strong challenger to the Sn-Ag-Cu（SAC） solders as a replacement for the Sn-Pb eutectic solder. This research investigated the effects of addition of Ag, Bi, In, and Sb on the physical properties of the Sn-0.6 Cu-0.05 Ni-Ge（SCNG） lead-free solder and the interfacial reaction with the Cu substrate. The melting behavior, microstructure, tensile strength, and wettability of the SCNG-x（x=Ag, Bi, In, Sb） solders were examined. The findings revealed that the introduction of Ag, Bi, In, and Sb minimally altered the solidus temperature, liquidus temperature, and tensile strength of the solder. However, the cooling behavior and solidified microstructure of the solder were affected by the concentration of the alloying elements. The wettability of the SCNG solder was improved with the doping of the alloying elements except Sb. The thickness of intermetallic layer was increased by the addition of the alloying elements and was related to the cooling behavior of the solder. The morphology of intermetallic layer between the SCNG-x solders and the Cu substrate was different from that of the typical SAC solders. In conclusion, alloying the SCNG solder with Ag, Bi, In or Sb is able to improve particular properties of the solder.

Dumb-bell Structures of Nonstoichiometric La(Ni, Sn)_(5+x) Alloys and Their Relationships with the Preparation Methods

Crystal structures of nonstoichiometric La(Ni, Sn)5+x (x = 0.1～0.4) alloys prepared by different methods were investigated by using powder X-ray diffraction and Rietveld refinement analysis. Space group of this type of alloys belongs to P6/mmm, in which Sn only occupies the 3g sites. It has been demonstrated that some of the 1a sites of the nonstoichiometric alloy are replaced by the NiNi dumb-bells which have a strong correlation with the anisotropic thermal parameter B33. The preparation methods have an effect on the number of dumb-bells that can substitute the 1a sites. It was found that the annealed alloys have more NiNi dumb-bells in the structure than the rapid solidified and as-cast alloys have while still keep good crystallinity.

光亮锡镍合金镀层的制备及其耐腐蚀性能研究

采用氨基酸类添加剂在焦磷酸盐体系中电沉积出锡含量67%、颜色与镍镀层相仿、耐腐蚀性能优异的Sn-Ni合金镀层。研究了镀液中添加剂含量变化对锡镍合金镀层含量、表面形貌和耐蚀性的影响。结果表明:当添加剂用量为2.0g/L时,对镀液的稳定性和镀层锡含量均有显著影响,耐蚀性能显著提高。同时中性盐雾试验测试结果表明,Sn-Ni合金镀层的耐蚀性比单金属镍镀层更为优异。

锡镍铜三元合金电镀新工艺的研究

研究了一种柠檬酸盐体系电镀锡镍铜合金新工艺。讨论了络合剂的浓度、电流密度、铜离子的浓度、pH、温度等因素对锡镍铜合金镀层的外观及铜、镍的含量的影响。实验结果表明:该工艺所得镀层表面细致、均匀,抗变色性好,耐腐蚀性强。