To reveal the drop failure modes of the wafer level chip scale packages （WLCSPs） with Sn-3.0Ag-0.5Cu solder joints, board level drop tests were performed according to the JEDEC standard. Six failure modes were iden...To reveal the drop failure modes of the wafer level chip scale packages （WLCSPs） with Sn-3.0Ag-0.5Cu solder joints, board level drop tests were performed according to the JEDEC standard. Six failure modes were identified, i.e., short FR-4 cracks and complete FR-4 cracks at the printing circuit board （PCB） side, split between redistribution layer （RDL） and Cu under bump metallization （UBM）, RDL fracture, bulk cracks and partial bulk and intermetallic compound （IMC） cracks at the chip side. For the outmost solder joints, complete FR-4 cracks tended to occur, due to large deformation of PCB and low strength of FR-4 dielectric layer. The formation of complete FR-4 cracks largely absorbed the impact energy, resulting in the absence of other failure modes. For the inner solder joints, the absorption of impact energy by the short FR-4 cracks was limited, resulting in other failure modes at the chip side.展开更多
The formation and the growth of Cu-Sn intermetallic compound (IMC) layer at the interface between Sn-3.0Ag-0.5Cu-xCe solder and Cu substrate during soldering and aging were studied. The results show that Cu6Sn5 IMC is...The formation and the growth of Cu-Sn intermetallic compound (IMC) layer at the interface between Sn-3.0Ag-0.5Cu-xCe solder and Cu substrate during soldering and aging were studied. The results show that Cu6Sn5 IMC is observed at the interface between solder and Cu substrate in all conditions. After aging for 120 h,the Cu3Sn IMC is then obtained. With increasing aging time,the scalloped Cu6Sn5 structure changes to a plate structure. The Cu3Sn film always forms with a relatively planar interface. By adding a small amount of the rare earth element Ce (only 0.1%,mass fraction) into the Sn-3.0Ag-0.5Cu solder alloy,the growth rate of the Cu-Sn IMC at the interface of solder alloy system is decreased. When the time exponent is approximately 0.5,the growth of the IMC layer is mainly controlled by a diffusion over the studied time range.展开更多
To introduce boron (B) into the Sn-1.0Ag-0.5Cu (SAC 105) solder, based on the thermodynamic calculations, iron (Fe) is a competent carrier component for bonding B and Sn. The Sn-Fe-B master alloys were prepared by mec...To introduce boron (B) into the Sn-1.0Ag-0.5Cu (SAC 105) solder, based on the thermodynamic calculations, iron (Fe) is a competent carrier component for bonding B and Sn. The Sn-Fe-B master alloys were prepared by mechanical alloying initially;then, the SAC 105- 0.05(Fe-B) and SAC 105-0.1 (Fe-B) solder alloys were prepared using 72-h-milling Sn-Fe-B master alloys. The preparation process and the properties of solders were studied in this work. For the Sn-Fe-B master alloys, the results show that with the increase in the ball-milling time, the powder changes illustrate a cold welding-crushingcold welding cyclic process. Moreover, the supersaturated solid solubility of (Fe-B) increases gradually in the alloys, matrix and the lattice distortion increases to 0.167% after 72-h milling. Meanwhile, the alloying degree is increasingly apparent, and after 72-h milling, the content of B in the Sn matrix reaches 2.38 wt%. For the solder alloys, with the (Fe-B) content in creasing, the melting point decreases and a significant grain refinement occurs in the matrix. Compared to the benchmark SAC105, the hardness of SAC105-0.05(Fe-B) and SAC 105-0.1 (Fe-B) solder alloys prepared by this method is improved by 20.65% and 34.79%, respectively. The present research provides a novel approach for introducing the immiscible component into the lead-free solder alloys.展开更多
基金Projects(51475072,51171036)supported by the National Natural Science Foundation of China
文摘To reveal the drop failure modes of the wafer level chip scale packages （WLCSPs） with Sn-3.0Ag-0.5Cu solder joints, board level drop tests were performed according to the JEDEC standard. Six failure modes were identified, i.e., short FR-4 cracks and complete FR-4 cracks at the printing circuit board （PCB） side, split between redistribution layer （RDL） and Cu under bump metallization （UBM）, RDL fracture, bulk cracks and partial bulk and intermetallic compound （IMC） cracks at the chip side. For the outmost solder joints, complete FR-4 cracks tended to occur, due to large deformation of PCB and low strength of FR-4 dielectric layer. The formation of complete FR-4 cracks largely absorbed the impact energy, resulting in the absence of other failure modes. For the inner solder joints, the absorption of impact energy by the short FR-4 cracks was limited, resulting in other failure modes at the chip side.
基金Project(06GK2002) supported by the Major Project of Hunan Provincial Science and Technology Development Strategy
文摘The formation and the growth of Cu-Sn intermetallic compound (IMC) layer at the interface between Sn-3.0Ag-0.5Cu-xCe solder and Cu substrate during soldering and aging were studied. The results show that Cu6Sn5 IMC is observed at the interface between solder and Cu substrate in all conditions. After aging for 120 h,the Cu3Sn IMC is then obtained. With increasing aging time,the scalloped Cu6Sn5 structure changes to a plate structure. The Cu3Sn film always forms with a relatively planar interface. By adding a small amount of the rare earth element Ce (only 0.1%,mass fraction) into the Sn-3.0Ag-0.5Cu solder alloy,the growth rate of the Cu-Sn IMC at the interface of solder alloy system is decreased. When the time exponent is approximately 0.5,the growth of the IMC layer is mainly controlled by a diffusion over the studied time range.
基金financially supported by the National Key R&D Program of China (No. 2017YFB0305703)
文摘To introduce boron (B) into the Sn-1.0Ag-0.5Cu (SAC 105) solder, based on the thermodynamic calculations, iron (Fe) is a competent carrier component for bonding B and Sn. The Sn-Fe-B master alloys were prepared by mechanical alloying initially;then, the SAC 105- 0.05(Fe-B) and SAC 105-0.1 (Fe-B) solder alloys were prepared using 72-h-milling Sn-Fe-B master alloys. The preparation process and the properties of solders were studied in this work. For the Sn-Fe-B master alloys, the results show that with the increase in the ball-milling time, the powder changes illustrate a cold welding-crushingcold welding cyclic process. Moreover, the supersaturated solid solubility of (Fe-B) increases gradually in the alloys, matrix and the lattice distortion increases to 0.167% after 72-h milling. Meanwhile, the alloying degree is increasingly apparent, and after 72-h milling, the content of B in the Sn matrix reaches 2.38 wt%. For the solder alloys, with the (Fe-B) content in creasing, the melting point decreases and a significant grain refinement occurs in the matrix. Compared to the benchmark SAC105, the hardness of SAC105-0.05(Fe-B) and SAC 105-0.1 (Fe-B) solder alloys prepared by this method is improved by 20.65% and 34.79%, respectively. The present research provides a novel approach for introducing the immiscible component into the lead-free solder alloys.
