In order to study the effect of the stirring flow on the grain diameter and solute concentration of hollow billet, the couple model of the two-phase solidification and electromagnetic field was built to simulate the s...In order to study the effect of the stirring flow on the grain diameter and solute concentration of hollow billet, the couple model of the two-phase solidification and electromagnetic field was built to simulate the solidification process of Sn-3.5%Pb hollow billet with the traveling magnetic field and rotating magnetic field. The effects of different kinds of flows on the temperature field, concentration field and grain diameter of molten metal during solidification were analysed. The results show that, there are different flow patterns in the molten metal induced by the traveling magnetic field and rotating magnetic field. Both flows can refine the grains in the hollow billet because of change of the temperature gradient and cooling rate of molten metal. The bigger the stirring velocity is,the smaller the grain diameter. Both flows can result in the macro-segregation in the hollow billet because of the non-homogeneous flows. The bigger the stirring velocity, the more serious the macro-segregation of the hollow billet. So, the stirring intensity should be controlled to acquire the high quality hollow billet.展开更多
The microstructure and microhardness of Sn-3.5%Ag solders were explored in the cooling rate ranging from 0.08 to 104 K/s. Under rapid cooling condition, the strong kinetic undercooling effect leads to the actual solid...The microstructure and microhardness of Sn-3.5%Ag solders were explored in the cooling rate ranging from 0.08 to 104 K/s. Under rapid cooling condition, the strong kinetic undercooling effect leads to the actual solidification process starting at the temperature lower than the equilibrium eutectic point, and the actual metastable eutectic point shifts to the higher Ag concentration. Hence, the higher the applied cooling rate is, the more the volume fraction of primary β-Sn crystal forms. At the same time, the separation of primary β-Sn crystal favors restraining the formation of bulk Ag3Sn intermetallic compounds (IMCs) in solder due to the mismatch crystalline orientation relationship, those Ag3Sn phase separating through the eutectic reaction could hardly cling to the primary β-Sn crystal and grow up. Additionally, the Vickers hardness test shows that fine β-Sn and spherical Ag3Sn phase in the rapidly solidified alloy strongly improves the microhardness of the Sn-3.5%Ag solder.展开更多
基金Project(50274017 50474055) supported by the National Natural Science Foundation of China+1 种基金Project(20052176) supported by Natural Science Foundation of Liaoning Province, ChinaProject supported by Homecoming Foundation of Ministry of Education, China
文摘In order to study the effect of the stirring flow on the grain diameter and solute concentration of hollow billet, the couple model of the two-phase solidification and electromagnetic field was built to simulate the solidification process of Sn-3.5%Pb hollow billet with the traveling magnetic field and rotating magnetic field. The effects of different kinds of flows on the temperature field, concentration field and grain diameter of molten metal during solidification were analysed. The results show that, there are different flow patterns in the molten metal induced by the traveling magnetic field and rotating magnetic field. Both flows can refine the grains in the hollow billet because of change of the temperature gradient and cooling rate of molten metal. The bigger the stirring velocity is,the smaller the grain diameter. Both flows can result in the macro-segregation in the hollow billet because of the non-homogeneous flows. The bigger the stirring velocity, the more serious the macro-segregation of the hollow billet. So, the stirring intensity should be controlled to acquire the high quality hollow billet.
基金Project(50401033) supported by the National Natural Science Foundation of China Project(200335) supported by the Foundation for the Author of National Excellent Doctoral Dissertation of China+1 种基金 Project(033608811) supported by the Natural Science Foundation of Tianjin City, China Project supported by the Scientific Research Foundation for the Returned Overseas Chinese Scholars, State Education Ministry
文摘The microstructure and microhardness of Sn-3.5%Ag solders were explored in the cooling rate ranging from 0.08 to 104 K/s. Under rapid cooling condition, the strong kinetic undercooling effect leads to the actual solidification process starting at the temperature lower than the equilibrium eutectic point, and the actual metastable eutectic point shifts to the higher Ag concentration. Hence, the higher the applied cooling rate is, the more the volume fraction of primary β-Sn crystal forms. At the same time, the separation of primary β-Sn crystal favors restraining the formation of bulk Ag3Sn intermetallic compounds (IMCs) in solder due to the mismatch crystalline orientation relationship, those Ag3Sn phase separating through the eutectic reaction could hardly cling to the primary β-Sn crystal and grow up. Additionally, the Vickers hardness test shows that fine β-Sn and spherical Ag3Sn phase in the rapidly solidified alloy strongly improves the microhardness of the Sn-3.5%Ag solder.