Influence of rapid solidification on Sn-8Zn-3Bi alloy characteristics and microstructural evolution of solder/Cu joints during elevated temperature aging

The effects of rapid solidification on the microstructure and melting behavior of the Sn-8Zn-3Bi alloy were studied. The evolution of the microstructuraI characteristics of the solder/Cu joint after an isothermal aging at 150 ℃ was also analyzed to evaluate the interconnect reliability. Results showed that the Bi in Sn-8Zn-3Bi solder alloy completely dissolved in the Sn matrix with a dendritic structure after rapid solidification. Compared with as-solidified Sn-8Zn-3Bi solder alloy, the melting temperature of the rapid solidified alloy rose to close to that of the Sn-Zn eutectic alloy due to the extreme dissolution of Bi in Sn matrix. Meanwhile, the adverse effect on melting behavior due to Bi addition was decreased significantly. The interfacial intermetallic compound （IMC） layer of the solder/Cu joint was more compact and uniform. Rapid solidification process obviously depressed the formation and growth of the interfacial IMC during the high-temperature aging and improved the high-temperature stability of the Sn-8Zn-3Bi solder/Cu joint.

Sn-8Zn-3Bi无铅钎料的抗氧化性

为了提高Sn-8Zn-3Bi合金钎料的抗氧化性,在Sn-8Zn-3Bi合金基础上,通过加入少量的其他合金元素(Al,P)以提高钎料的抗氧化性.少量Al的加入降低了Sn-8Zn-3Bi钎料的氧化量,而加入P的Sn-8Zn-3Bi钎料在加热过程中不仅没有质量增加,反而出现减重现象.通过扫描电镜和X射线衍射等分析手段研究样品的表面微观结构和显微组织,探讨了Al,P的抗氧化机理.分析结果表明:Al通过在合金表面形成一层致密的氧化膜,阻止钎料直接接触周围空气,从而达到了降低氧化速率的目的;P通过自身不断被氧化而消耗钎料表面的O原子,从而保护元素Sn和Zn不被氧化.

Sn-8Zn-3Bi-P焊料的高温氧化行为及其对性能的影响

通过增重法研究了250℃下微量合金元素P的添加对液态Sn-8Zn-3Bi焊料表面氧化行为的影响。试验借助扫描电镜(SEM)、俄歇电子能谱(AES)等分析方法探索磷的抗氧化机理。比较了氧化前后焊料的力学性能及铺展性能差异,探讨合金元素P的加入对焊料其它性能的影响。结果表明,磷的加入对Sn-8Zn-3Bi焊料的抗氧化性具有明显的改善作用。磷替代了锌优先被氧化,在焊料表面形成了易于挥发的P4O6氧化膜。当合金中P元素含量为0.2%(质量分数)时,焊料的综合性能最佳。

Sn-8Zn-3Bi无铅钎料压蠕变行为的研究

试验研究了Sn-8Zn-3Bi无铅钎料在温度为55～100℃、压力为9.3～18.6MPa范围内的压蠕变行为。结果表明,随温度和应力的升高,合金的压蠕变量增大,稳态蠕变速率的对数分别与应力的对数和温度呈线性关系。在试验温度下,应力指数n相近,平均值为3.82;在不同的应力下,表观激活能Qa相差不大,平均值为80.68kJ/mol。材料结构常数A为6.83×104。压蠕变变形是位错滑移和位错攀移共同作用的结果。

Sn-8Zn-3Bi无铅焊料的表面改性

采用液相法用有机物改性剂对Sn-8Zn-3Bi焊料进行表面包覆改性,以改善焊料的润湿性能及抗氧化性能。对包覆样品进行了红外光谱表征。考察了样品的抗氧化性、润湿性能和存储性能。结果表明:采用液相法可以实现在Sn-8Zn-3Bi焊料表面包覆有机物。以有机物C为改性剂,且用量为2%(质量分数)时得到的改性样品的润湿角θ为7.8°,铺展面积S为108.83mm2,而未被改性的焊料θ为10.74°,S为93.40mm2。

Ni元素对Sn-9Zn-3Bi无铅钎料显微组织和性能的影响

利用真空箱式电阻炉制备了Sn-9Zn-3Bi-xNi无铅钎料合金,并对其显微组织和主要性能(熔点、熔程、抗氧化性、润湿性、剪切强度)及钎焊接头断口形貌进行了分析。结果表明,少量Ni的加入可以细化Sn-9Zn-3Bi合金的显微组织,而对其熔点影响较小。当Ni添加量为0.1%和0.5%时,钎料的熔程变化不大,Ni添加量为1%时,钎料的熔程增大比较明显。随着Ni添加量增多,无铅钎料的抗氧化性能和润湿性能提高。Ni添加量在0.1%和0.5%时,钎焊接头的剪切强度变化不大,但韧性增加;Ni添加量在1%时,钎焊接头的剪切强度略有增大,但韧性降低。

Microstructure evolution and optimum parameters analysis for hot working of new type Mg-8Sn-2Zn-0.5Cu alloy

The hot deformation behavior of as-solutionized Mg 8Sn 2Zn 0.5Cu(TZC820)alloy was investigated experimentally and numerically via isothermal compression tests at 250400℃and strain rate range of 0.013 s 1 on a Gleeble 1500D thermomechanical simulator.Results show that the deformation temperature and strain rate signi cantly affected ow stress and material constants.In addition,the strain-compensated constitutive relationship was established on the basis of true stress strain curves.The main deformation mechanism for this alloy was the dynamic recrystallization(DRX),and the DRX degree was effectively enhanced with an increase in deformation temperature and a decrease in strain rate.Moreover,the cellular automaton method was used to simulate the microstructure evolution during hot compression.In addition,the processing maps were established,and the optimum deformation parameters for the as-solutionized TZC820 alloy are at 370400℃and 0.01 s 1,and at 320360℃and 13 s 1.

Microstructure of Mg-8Zn-4Al-1Ca aged alloy

The microstructure of Mg-8Zn-4Al-1Ca aged alloy was investigated by TEM and HRTEM. The results show that the hardening produced in the Mg-8Zn-4Al-1Ca alloy is considerably higher than that in the Mg-8Zn-4A1 alloy. A dense dispersion of disc-like Ca2Mg6Zn3 precipitates are formed in Mg-8Zn-4Al-1Ca alloy aged at 160 ℃ for 16 h. In addition, the lattice distortions, honeycomb-looking Moir＆#233; fringes, edge dislocations and dislocation loop also exist in the microstructure. The precipitates of alloy aged at 160 ℃ for 48 h are coarse disc-like and fine dispersed grainy. When the alloy is subjected to aging at 160 ℃ for 227 h, the microstructure consists of numerous MgZn2 precipitates and Ca2Mg6Zn3 precipitates. All the analyses show that Ca is a particularly effective trace addition in improving the age-hardening and postponing the formation of MgZn2 precipitates in Mg-8Zn-4Al alloy aged at 160 ℃.

焊点高度对焊点微观组织和抗拉强度的影响

研究了不同SOH对焊点微观组织和抗拉强度的影响。用拉伸试验的方法在SOH低于100μm的条件下分析Cu/Sn-8Zn-3Bi/Cu和Cu/Sn-9Zn/Cu焊点的力学特性。结果表明,随着SOH的减少,针状的富Zn相在这2个焊点中逐渐减少。在Cu/Sn-9Zn/Cu焊点中会形成金属间化合物Cu5Zn8,在Cu/Sn-8Zn-3Bi/Cu焊点中形成一层金属间化合物Cu5Zn8和另一层Cu-Sn和Cu-Zn的混合相。Cu/Sn-9Zn/Cu焊点的极限抗拉强度会随SOH的减少而降低,而Cu/Sn-8Zn-3Bi/Cu焊点则相反。